公开(公告)号：US10862514B2

公开(公告)日：2020-12-08

申请号：US16353779

申请日：2019-03-14

Applicant: QUALCOMM Incorporated

Inventor： Rahul Malik ,  Jeremy Dunworth

IPC: H04B1/38 ,  H04B1/00 ,  H04B7/0426 ,  H04B7/0408

Abstract: A radio frequency (RF) architecture performs simultaneous beamforming to two different gigabit node Bs (gNBs) using an independent set of phase shifters. The beamforming process includes simultaneously communicating across a shared antenna aperture in a first frequency and a second frequency. The beamforming process also includes configuring a first beam for the first frequency and a second beam for the second frequency before communicating with the first frequency and/or the second frequency to synchronize communication between the first frequency and the second frequency across the shared antenna aperture.

公开(公告)号：US10461695B2

公开(公告)日：2019-10-29

申请号：US15703756

申请日：2017-09-13

Applicant: QUALCOMM Incorporated

Inventor： Gang Liu ,  Jeremy Dunworth

IPC: H03B5/12 ,  H01F17/00 ,  H03H3/00 ,  H03H7/01

Abstract: A planar differential inductor reduces an effect of parasitics on common mode inductance of a voltage controlled oscillator (VCO)-based inductor to properly ground a common mode alternating current (AC) ground. In one instance, the planar differential inductor includes a ground plane, routing lines, distributed capacitors, an exterior inductor structure, and an interior inductor structure. The planar differential inductor may be coupled to a capacitor as part of an LC tank that operates as a resonator within a VCO. The bypass capacitor array is coupled between the ground plane and the routing lines. The exterior inductor structure is coupled between the routing lines and a power supply. The interior inductor is within the ground plane and coupled between the routing lines and differential ports.

公开(公告)号：US10886612B2

公开(公告)日：2021-01-05

申请号：US16133566

申请日：2018-09-17

Applicant: Qualcomm Incorporated

Inventor： Wai Lim Ngai ,  Jeremy Dunworth

IPC: H01Q3/34 ,  H04B7/0404 ,  H04B1/48

Abstract: An apparatus is disclosed for bi-directional active phase shifting. In an example aspect, the apparatus includes a wireless transceiver. The wireless transceiver includes at least one transmit path and at least one receive path. The wireless transceiver also includes at least one active phase shifter disposed in both the transmit path and the receive path.

公开(公告)号：US20200091605A1

公开(公告)日：2020-03-19

申请号：US16133566

申请日：2018-09-17

Applicant: Qualcomm Incorporated

Inventor： Wai Lim Ngai ,  Jeremy Dunworth

IPC: H01Q3/34 ,  H04B1/48 ,  H04B7/0404

Abstract: An apparatus is disclosed for bi-directional active phase shifting. In an example aspect, the apparatus includes a wireless transceiver. The wireless transceiver includes at least one transmit path and at least one receive path. The wireless transceiver also includes at least one active phase shifter disposed in both the transmit path and the receive path.

公开(公告)号：US09800280B2

公开(公告)日：2017-10-24

申请号：US15176109

申请日：2016-06-07

Applicant: QUALCOMM Incorporated

Inventor： Hajir Hedayati ,  Milad Darvishi ,  Jeremy Dunworth

IPC: H04B1/18 ,  H04B1/16 ,  H03F3/19 ,  H03F1/08 ,  H03F3/68 ,  H04L27/38

CPC classification number: H04B1/16 ,  H03F1/08 ,  H03F3/19 ,  H03F3/68 ,  H03F2200/294 ,  H03F2200/451 ,  H04B1/06 ,  H04B1/40 ,  H04L27/38

Abstract: A radio frequency (RF) receiver device may include a receive path including a first amplifier. The device also includes a first mixer coupled to an output of the first amplifier and to an input of a second amplifier. Further, the device may include an auxiliary path including a second mixer coupled between an output of the first mixer and an input of the first mixer.

公开(公告)号：US11108170B2

公开(公告)日：2021-08-31

申请号：US16178189

申请日：2018-11-01

Applicant: Qualcomm Incorporated

Inventor： Kaushik Chakraborty ,  Rahul Malik ,  Jeremy Dunworth

IPC: H01Q1/22 ,  H01Q21/30 ,  H01Q5/28 ,  H01Q5/35 ,  H01Q5/50 ,  H01Q1/24 ,  H01Q1/40 ,  H01Q21/24

Abstract: An apparatus is disclosed for a multi-band millimeter-wave (mmW) antenna array and radio-frequency integrated circuit (RFIC) module. In an example aspect, the apparatus includes a multi-band mmW antenna array and RFIC module with a first antenna array, a second antenna array, and at least one radio-frequency front-end integrated circuit. The first antenna array includes at least two first antenna elements and is tuned to a first mmW frequency band. The second antenna array includes at least two second antenna elements and is tuned to a second mmW frequency band. The at least one radio-frequency front-end integrated circuit includes at least two first transceiver chains and at least two second transceiver chains. The at least two first transceiver chains are respectively coupled to the at least two first antenna elements, and the at least two second transceiver chains are respectively coupled to the at least two second antenna elements.

公开(公告)号：US10965261B2

公开(公告)日：2021-03-30

申请号：US16208398

申请日：2018-12-03

Applicant: Qualcomm Incorporated

Inventor： Jeremy Dunworth ,  Hyunchul Park ,  Bon-Hyun Ku ,  Vladimir Aparin

IPC: H03F3/21 ,  H03F3/195 ,  H03F3/213 ,  H03F1/56 ,  H03F3/45 ,  H03F1/02 ,  H03F3/30 ,  H03F3/345 ,  H03F3/193 ,  H03F3/24

Abstract: The present disclosure provides an amplifier circuit that includes one or more amplifier stages, each of the one or more amplifier stages including a complementary transistor configuration. The complementary transistor configuration includes an NMOS transistor and a PMOS transistor. The NMOS transistor is electrically coupled in parallel to the PMOS transistor. The amplifier circuit further includes an output amplifier stage electrically coupled to an output of the one or more amplifier stages, the output amplifier stage including a non-complementary transistor configuration including one or more NMOS transistors or PMOS transistors.

公开(公告)号：US10910714B2

公开(公告)日：2021-02-02

申请号：US15940888

申请日：2018-03-29

Applicant: QUALCOMM Incorporated

Inventor： Bon-Hyun Ku ,  Jeremy Dunworth

IPC: H01Q5/335 ,  H01Q1/22 ,  H01Q21/30 ,  H04B1/00 ,  H03H7/48 ,  H01Q21/28 ,  H04B1/44 ,  H03F1/02 ,  H03F1/56 ,  H03F3/21 ,  H03F3/68 ,  H03G1/00 ,  H04B1/525 ,  H01Q21/06 ,  H01Q1/24

Abstract: A signal processing circuit reduces die size and power consumption for each antenna element. The signal processing circuit includes a first set of ports, a third port, a first path, a second path and a first transistor. The first path is between a first port of the first set of ports and the third port. The second path is between a second port of the first set of ports and the third port. The first transistor is coupled between the first path and the second path. The first transistor is configured to receive a control signal to control the first transistor to adjust an impedance between the first path and the second path.

公开(公告)号：US10734332B2

公开(公告)日：2020-08-04

申请号：US15839831

申请日：2017-12-12

Applicant: QUALCOMM Incorporated

Inventor： Jon Bradley Lasiter ,  Ravindra Vaman Shenoy ,  Donald William Kidwell, Jr. ,  Mohammad Ali Tassoudji ,  Vladimir Aparin ,  Seong Heon Jeong ,  Jeremy Dunworth ,  Alireza Mohammadian ,  Mario Francisco Velez ,  Chin-Kwan Kim

IPC: H01L23/00 ,  H01L23/66 ,  H01L23/498 ,  H01L23/552 ,  H01L23/31 ,  H01L21/50 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q21/10 ,  H01Q19/24 ,  H01Q9/16 ,  H01L23/10

Abstract: In conventional packaging strategies for mm wave applications, the size of the package is dictated by the antenna size, which is often much larger than the RFIC (radio frequency integrated circuit). Also, the operations are often limited to a single frequency which limits their utility. In addition, multiple addition build-up layers are required to provide the necessary separation between the antennas and ground layers. To address these issues, it is proposed to provide a device that includes an antenna package, an RFIC package, and an interconnect assembly between the antenna and the RFIC packages. The interconnect assembly may comprise a plurality of interconnects with high aspect ratios and configured to connect one or more antennas of the antenna package with an RFIC of the RFIC package. An air gap may be formed in between the antenna package and the RFIC package for performance improvement.

公开(公告)号：US10693231B2

公开(公告)日：2020-06-23

申请号：US15997575

申请日：2018-06-04

Applicant: QUALCOMM Incorporated

Inventor： Jeremy Dunworth ,  Aliakbar Homayoun ,  Andrzej Partyka

IPC: H01Q5/335 ,  H04B1/44 ,  H03F1/02 ,  H03F1/56 ,  H03F3/21 ,  H03F3/68 ,  H03G1/00 ,  H04B1/525 ,  H03H7/48 ,  H01Q1/22 ,  H01Q21/28 ,  H01Q21/30 ,  H01Q1/24 ,  H01Q21/06 ,  H04B1/00

Abstract: A transmit/receive switching circuit implementation reduces transmitting/receiving switching losses in a transceiver during different modes of operation. The implementation includes connecting a low noise amplifier and a power amplifier in accordance with a shunt configuration in the transceiver. The implementation also includes disabling the power amplifier to achieve a high impedance state by grounding an output stage bias and enabling the low noise amplifier and disabling one or more transistors connected to a path between the low noise amplifier and the power amplifier during a receive mode.