公开(公告)号：US20230257869A1

公开(公告)日：2023-08-17

申请号：US18013124

申请日：2020-10-22

Applicant: QORVO BIOTECHNOLOGIES, LLC

Inventor： Derya Deniz ,  Philip Johnston ,  Jay Helland ,  John Belsick ,  Kevin McCarron

IPC: C23C14/56 ,  H03H3/02 ,  H03H9/17 ,  H01J37/34 ,  H01J37/32 ,  C23C14/54 ,  C23C14/50 ,  C23C14/35 ,  C23C14/02 ,  C23C14/22 ,  C30B23/00 ,  C30B23/06

CPC classification number: C23C14/566 ,  H03H3/02 ,  H03H9/173 ,  H03H9/175 ,  H01J37/3447 ,  H01J37/32899 ,  H01J37/32743 ,  H01J37/32458 ,  H01J37/3417 ,  H01J37/3405 ,  C23C14/568 ,  C23C14/541 ,  C23C14/50 ,  C23C14/35 ,  C23C14/02 ,  C23C14/225 ,  C30B23/005 ,  C30B23/063 ,  H03H2003/021 ,  H03H2003/025 ,  H01J2237/20285 ,  H01J2237/332 ,  H01J2237/2001 ,  H01J2237/2002 ,  H01J2237/20235 ,  H01J2237/20214 ,  H01J2237/201 ,  H01J2237/2007 ,  H01J2237/0455

Abstract: A deposition system is disclosed that allows for growth of inclined c-axis piezoelectric material structures. The system integrates various sputtering modules to yield high quality films and is designed to optimize throughput lending it to a high-volume in manufacturing environment. The system includes two or more process modules including an off-axis module constructed to deposit material at an inclined c-axis and a longitudinal module constructed to deposit material at normal incidence; a central wafer transfer unit including a load lock, a vacuum chamber, and a robot disposed within the vacuum chamber and constructed to transfer a wafer substrate between the central wafer transfer unit and the two or more process modules; and a control unit operatively connected to the robot.