Abstract:
This disclosure provides systems, methods and apparatus including devices that include layers of passivation material covering at least a portion of an exterior surface of a thin film component within a microelectromechanical device. The thin film component may include an electrically conductive layer that connects via an anchor to a conductive surface on a substrate. The disclosure further provides processes for providing a first layer of passivation material on an exterior surface of a thin film component and for electrically connecting that thin film component to a conductive surface on a substrate. The disclosure further provides processes for providing a second layer of passivation material on any exposed surfaces of the thin film component after release of the microelectromechanical device.
Abstract:
A device includes a first substrate formed of a first material and a plurality of electromechanical devices formed upon a surface of the first substrate. The device also includes an integrated circuit (IC) chip bonded to the surface of the first substrate where the integrated circuit chip is formed of a material selected from a group consisting of the first material or a material having a coefficient of thermal expansion (CTE) that is substantially similar to the CTE of the first material.
Abstract:
An electromechanical device includes a movable body that is movable along an axis of a direction of motion. The device also includes an actuator beam and a compliant support beam arranged to support the movable body. The compliant support beam includes a first end connected to an anchor and an actuating portion extending from the anchor and in a direction that is transverse to the axis of the direction of motion and away from the anchor. The actuating portion is also arranged adjacently and spaced apart from the actuator beam. The compliant support beam also includes a connector portion that is contiguous with the actuating portion and coupled to the movable body. The connector portion extends at least partially back toward the anchor while being arranged adjacently and spaced apart from the actuating portion.
Abstract:
The invention relates to an improved apparatus and method for the design and manufacture of MEMS anchoring structures for light modulators in order to address the stresses of beams mounted on them.
Abstract:
This disclosure provides systems, methods, and apparatus for reducing ambient light reflection in a display device having a backplane incorporating low-temperature polycrystalline silicon (LTPS) transistors. Ambient reflection can be reduced by incorporating both conductive and non-conductive light-absorbing materials into the display backplane. A light-absorbing conductive material that can withstand the temperatures generated by laser annealing of LTPS transistor channels can be deposited and patterned such that its footprint substantially coincides with the footprints of the LTPS channels. After the LTPS channels are fabricated, a light-absorbing dielectric material can be deposited with a footprint extending at least below the footprints of other reflective components of the backplane to be positioned above the light-absorbing dielectric material. Together, the light-absorbing conductive material and the light-absorbing dielectric material can obstruct substantially all of the reflective surfaces within the backplane, thereby reducing reflection of ambient light by the backplane.
Abstract:
This disclosure provides systems, methods and apparatus for a capacitance change tracking circuit. In one aspect, the capacitance change tracking circuit may determine a capacitance change associated with a display element including a movable element capable of positioning from a first position to a second position. The capacitance change tracking circuit may adjust an operating parameter of the display element based on the capacitance change. For example, the adjusted operating parameter may be an adjustment to an allocated time for the movable element to position from the first position to the second position or an adjustment to a voltage applied to an electrode of the display element.
Abstract:
This disclosure provides systems, methods and apparatus for a multi-state shutter assembly. The multi-state shutter assembly can be used in an electronic display. The shutter assembly can include a movable light obstructing component. The shutter assembly also can include first and second actuators configured to move the light obstructing component between three states, including a fully light obstructive state, a substantially transmissive state, and a partially transmissive state. At least one of the three states is a neutral state in which both the first and second actuators are in an unactuated state. The shutter assembly also can include a controller configured to control the first and second actuator to selectively move the light obstructing component into each of the three states.
Abstract:
The invention relates to an improved apparatus and method for the design and manufacture of MEMS anchoring structures for light modulators in order to address the stresses of beams mounted on them.
Abstract:
The invention relates to a light modulator including a substrate having a surface and a modulation assembly coupled to the substrate that includes a modulation element and a first compliant beam. The first compliant beam includes a first segment that extend away from a first anchor and a second segment that extends back towards the first anchor. The length of the first segment is different than the length of the second segment.
Abstract:
Systems and methods for a display having an array of pixels, a substrate, and a control matrix formed on the substrate are described. The array of pixels includes mechanical light modulators that can be referred to as micro-electro-mechanical or MEMS light modulators. The MEMS light modulators may be shutter-based light modulators, and an array of apertures may be formed on the substrate corresponding spatially to the shutters in the array of shutter-based light modulators. Each modulator is configured to be driven from a-light-blocking state to a-light-transmissive state through a movement direction. The array of light modulators are arranged to reduce the correlations in movement directions of neighboring pixels, thereby reducing the amplitude of acoustic emissions from the display.