Apparatus for carrying out a titration procedure for the chemical
analysis of a sample
    1.
    发明授权
    Apparatus for carrying out a titration procedure for the chemical analysis of a sample 失效
    用于进行样品化学分析的滴定程序的装置

    公开(公告)号:US4873057A

    公开(公告)日:1989-10-10

    申请号:US27001

    申请日:1987-03-10

    IPC分类号: G01N31/16

    摘要: The sample and the reagent required for titration are fed into a titration vessel (1), the reagent and/or sample being supplied intermittently in the form of pulses of liquid. Toward this end, a controlled valve (9) is provided in the supply line (4) for the reagent. The opening and closing times of this valve (9) and, hence, the frequency and duration of the pulses of liquid, are chosen such that the ratio of the average sample flow to the average reagent flow is sufficient to achieve the ratio of sample to the reagent at the equivalence point. This renders continuous titration possible, for which only one pump (7) is needed, which does not require any complex servo system and, therefore, has a low energy consumption.

    摘要翻译: 将滴定所需的样品和试剂送入滴定容器(1)中,以液体脉冲的形式间歇地供给试剂和/或样品。 为此,在用于试剂的供给管线(4)中设置受控阀(9)。 选择该阀(9)的打开和关闭时间,因此选择液体的脉冲的频率和持续时间,使得平均样品流量与平均试剂流量之比足以达到样品与 试剂在当量点。 这使得可以进行连续滴定,仅需要一个泵(7),其不需要任何复杂的伺服系统,因此具有低的能量消耗。

    Use of a mass spectrometer with secondary ionization for the inspection
of containers
    2.
    发明授权
    Use of a mass spectrometer with secondary ionization for the inspection of containers 失效
    使用具有二次电离的质谱仪检查容器

    公开(公告)号:US5523565A

    公开(公告)日:1996-06-04

    申请号:US304130

    申请日:1994-09-12

    CPC分类号: G01N33/0011

    摘要: Inspection of PET bottles for contamination is performed with a mass spectrometer in which the gas sample is ionized by an ionized primary gas. This causes greatly reduced fragmentation, or unambiguous fragmentation, of the gas sample. As a consequence, the spectrum obtained is very meaningful on its own, and can be interpreted very rapidly, which is an essential prerequisite for the use of mass spectrometers in industrial inspection.

    摘要翻译: 使用质谱仪对用于污染的PET瓶进行检查,其中气体样品通过电离的一次气体离子化。 这导致气体样品的碎裂或明确的碎裂的大大减少。 因此,所获得的光谱本身是非常有意义的,并且可以非常快速地解释,这是在工业检验中使用质谱仪的基本先决条件。

    Method for determining concentrations of additives in acid copper electrochemical deposition baths
    3.
    发明授权
    Method for determining concentrations of additives in acid copper electrochemical deposition baths 有权
    确定酸性铜电化学沉积池中添加剂浓度的方法

    公开(公告)号:US06709568B2

    公开(公告)日:2004-03-23

    申请号:US10064125

    申请日:2002-06-13

    IPC分类号: G01N2742

    CPC分类号: G01N27/4161 G01N27/42

    摘要: The present invention relates to a method for determining concentration of brightener and leveler contained in an aqueous acid metal electroplating solution, by firstly determining the concentration of the brightener at a first set of measurement conditions, and secondly determining the concentration of the leveler at a second set of measurement conditions, provided that the first set of measurement conditions differ from the second set of measurement conditions on the rotation speed of a rotating disc electrode used for measuring plating potential of said aqueous acid metal electroplating solution, and optionally, the electroplating duration at which the plating potential of said aqueous acid metal electroplating solution is measured, provided that the first rotation speed is lower than the second rotation speed, and that the first electroplating duration is shorter than the second electroplating duration.

    摘要翻译: 本发明涉及一种通过首先在第一组测量条件下确定增白剂的浓度来确定含酸的酸性金属电镀溶液中所含的增白剂和矫正剂的浓度的方法,其次在第二次测定矫光器的浓​​度 条件是第一组测量条件与第二组测量条件不同,所述第二组测量条件对于用于测量所述酸性金属电镀水溶液的电镀电位的旋转盘电极的旋转速度,以及可选地,电镀持续时间在 测量所述含水酸性金属电镀溶液的电镀电位,条件是所述第一转速低于所述第二转速,并且所述第一电镀持续时间短于所述第二电镀持续时间。

    Interference correction of additives concentration measurements in metal electroplating solutions
    6.
    发明授权
    Interference correction of additives concentration measurements in metal electroplating solutions 有权
    金属电镀溶液中添加剂浓度测量的干扰校正

    公开(公告)号:US06936157B2

    公开(公告)日:2005-08-30

    申请号:US10215586

    申请日:2002-08-09

    IPC分类号: G01N27/416 G01N27/42

    摘要: The present invention relates to a method and apparatus for determining concentrations of various organic additives in metal electroplating solutions, by utilizing a mathematical correction model in combination with the conventional PCGA chrono-potentiometric analysis method, to eliminate the interaction between the observed electrochemical behavior of various organic additives, and to achieve accurate concentration determination of such additives.

    摘要翻译: 本发明涉及一种通过结合常规PCGA计时分析方法利用数学校正模型来确定金属电镀溶液中各种有机添加剂浓度的方法和装置,以消除观察到的各种电化学行为之间的相互作用 有机添加剂,并且可以精确地确定这些添加剂的浓度。

    Electrode assembly and method of using the same
    7.
    发明授权
    Electrode assembly and method of using the same 有权
    电极组件及其使用方法

    公开(公告)号:US06758960B1

    公开(公告)日:2004-07-06

    申请号:US10325379

    申请日:2002-12-20

    IPC分类号: G01N27403

    CPC分类号: G01N27/38

    摘要: The present invention relates to an electrode assembly that is capable of both solution measurement and in-line self-cleaning. Specifically, such electrode assembly comprises a central electrode and a measurement circuit for solution measurement, and an auxiliary electrode and an auxiliary current sourse for generating gas during intervals between solution measurement cycles, so as to remove any solid or liquid residues that may passivate the central electrode, thereby cleaning and rejuvenating the central electrode and preparing it for the next solution measurement cycle.

    摘要翻译: 本发明涉及能够进行溶液测量和在线自清洁的电极组件。 具体地说,这种电极组件包括中心电极和用于溶液测量的测量电路,以及用于在溶液测量循环之间的间隔期间产生气体的辅助电极和辅助电流源,以便去除可能钝化中心的任何固体或液体残余物 电极,从而清洗和再生中心电极并准备下一个溶液测量循环。

    Methods for determination of additive concentration in metal plating baths
    8.
    发明授权
    Methods for determination of additive concentration in metal plating baths 有权
    金属镀液中添加剂浓度测定方法

    公开(公告)号:US06758955B2

    公开(公告)日:2004-07-06

    申请号:US10313801

    申请日:2002-12-06

    IPC分类号: G01N2726

    CPC分类号: C25D21/12 G01N33/206

    摘要: The present invention relates to PCGA analytical procedure, in which each PCGA plating/measuring cycle is performed with the stripping and cleaning of test electrode immediately conducted before the equilibrium step, so as to use the metal plate layer formed during a previous plating/measuring cycle as a protective layer for the test electrode. The present invention also relates to PCGA calibration measurement protocol, in which both the calibration measurements and the sample measurement are conducted after a background measurement step.

    摘要翻译: 本发明涉及PCGA分析程序,其中每个PCGA电镀/测量循环是在平衡步骤之前立即进行的剥离和清洁测试电极进行的,以便使用在先前电镀/测量循环期间形成的金属板层 作为测试电极的保护层。 本发明还涉及在背景测量步骤之后进行校准测量和样品测量两者的PCGA校准测量协议。

    Method and apparatus for determination of additives in metal plating baths
    9.
    发明授权
    Method and apparatus for determination of additives in metal plating baths 有权
    用于测定金属电镀液中添加剂的方法和装置

    公开(公告)号:US06592737B1

    公开(公告)日:2003-07-15

    申请号:US09690770

    申请日:2000-10-17

    IPC分类号: G01N2742

    CPC分类号: G01N27/42 G01N27/4161

    摘要: An apparatus and method for the indirect determination of concentrations of additives in metal plating electrolyte solutions, particularly organic additives in Cu-metalization baths for semiconductor manufacturing. Plating potentials between the reference and test electrodes are measured and plotted for each of the solution mixtures, and data are extrapolated to determine the concentration of the additive in the sample. A multi-cycle method determines the concentration of both accelerator and suppressor organic additives in Cu plating solution in a single test suite.

    摘要翻译: 用于间接测定金属电镀溶液中添加剂浓度的装置和方法,特别是用于半导体制造的Cu金属化浴中的有机添加剂。 对每个溶液混合物测量和绘制参考电极和测试电极之间的电位,并推断数据以确定样品中添加剂的浓度。 多循环方法确定单个试验套件中Cu电镀溶液中促进剂和抑制剂有机添加剂的浓度。

    Apparatus for determination of additives in metal plating baths
    10.
    发明授权
    Apparatus for determination of additives in metal plating baths 有权
    用于测定金属电镀浴中添加剂的装置

    公开(公告)号:US06495011B2

    公开(公告)日:2002-12-17

    申请号:US09819218

    申请日:2001-03-28

    IPC分类号: G01N27403

    CPC分类号: G01N27/42 G01N27/4161

    摘要: An apparatus and method for the indirect determination of concentrations of additives in metal plating electrolyte solutions, particularly organic additives in Cu-metalization baths for semiconductor manufacturing. The apparatus features a reference electrode housed in an electrically isolated chamber and continuously immersed in the base metal plating solution (without the additive to be measured). An additive concentration determination method comprises electroplating a test electrode at a constant or known current in a mixing chamber wherein the base metal plating solution is mixed with small volumes of the sample and various calibration solutions containing the additive to be measured. Plating potentials between the electrodes are measured and plotted for each of the solution mixtures, and data are extrapolated to determine the concentration of the additive in the sample. A multi-cycle method determines the concentration of both accelerator and suppressor organic additives in Cu plating solution in a single test suite.

    摘要翻译: 用于间接测定金属电镀溶液中添加剂浓度的装置和方法,特别是用于半导体制造的Cu金属化浴中的有机添加剂。 该装置具有一个参考电极,该参比电极容纳在一个电隔离的腔室中,并连续浸没在贱金属镀液中(不含待测量的添加剂)。 添加剂浓度测定方法包括在混合室中以恒定或已知电流电镀测试电极,其中将贱金属电镀溶液与少量样品和包含待测量添加剂的各种校准溶液混合。 对每个溶液混合物测量和绘制电极之间的电位,并且外推数据以确定样品中添加剂的浓度。 多循环方法确定单个试验套件中Cu电镀溶液中促进剂和抑制剂有机添加剂的浓度。