摘要:
The concentration of a leveler in a plating liquid that is used by a plating apparatus for filling metal such as copper in interconnection trenches and holes defined in the surface of a semiconductor substrate or the like is determined based on a peak area (Ar value) in a peel-off region of the plating liquid measured according to a CV or CVS process.
摘要:
An apparatus and method for measuring an electrochemical impedance at high speed. The method for measuring the electrochemical impedance of an electrolyte at high speed includes applying a direct current (DC) voltage having the reaction potential of the electrolyte to the electrolyte via a counter electrode and, after a delay, applying a signal voltage, including a DC voltage added to a differentiated or integrated Dirac-delta function voltage, to the electrolyte; computing a digital data value related only to the differentiated or integrated Dirac-delta function voltage, obtained by converting signal current flowing in a working electrode via the electrolyte into a voltage, integrating or differentiating the voltage, and Fourier transforming the result of the integration or differentiation; and obtaining changes in magnitude and phase as a function of frequency based on the Fourier transform, to compute the impedance. By investigating impedances computed at intervals upon the application of a reaction potential and upon the application of a step voltage plus the reaction potential to the electrolyte, the influence of mass transfer and electron transfer in the electrolyte on the impedance measurement can be understood.
摘要:
Organic addition agents in copper plating baths are monitored by diluting a sample of the bath with sulfuric acid and hydrochloric acid and optionally a cupric salt. The diluting provides a bath having conventional concentrations of cupric ion, sulfuric acid and hydrochloric acid; and adjusted concentrations of the organic addition agents of 1/X of their original values in the sample; where X is the dilution factor. CVS techniques are used to determine concentrations of organic addition agents.
摘要:
A battery cell inspection method in which the difference in the measured value in case of normal battery cell insertion and that incase of mistaken battery cell insertion is large to facilitate decision as to whether or not mistaken insertion occurred to enable stable result of decision to be achieved, and in which, if the area of the electrode plate and/or the number of the electrode plates making up a sole battery cell is small, decision as to mistaken insertion can be given easily to assure correct results of decision. To this end, measurement is made of the difference between a measured value of the capacitance across a minus (−) electrode plate 103a of a first cell 101a and a (−) electrode plate 103b of a second cell 101b facing the (−) electrode plate 103a in case the potential across a plus (+) electrode plate 104a of the first cell 101a and a (+) terminal plate 102b of a second cell 101b neighboring to the first cell 101a is caused to fall to a ground potential (for an acceptable article) and a measured value of the capacitance across a minus (−) electrode plate 103a of the first cell 101a and a plus (+) terminal plate 102b of the second cell 101b neighboring to the minus (−) electrode plate 103a of a first cell 101a with a minus (−) electrode plate 103b of the second cell 101b incase the potential across the plus (+) terminal plate 102a of the first cell 101a and a minus (−) electrode plate 103b of the second cell 101b (for a reject).
摘要:
An apparatus and method for the indirect determination of concentrations of additives in metal plating electrolyte solutions, particularly organic additives in Cu-metalization baths for semiconductor manufacturing. Plating potentials between the reference and test electrodes are measured and plotted for each of the solution mixtures, and data are extrapolated to determine the concentration of the additive in the sample. A multi-cycle method determines the concentration of both accelerator and suppressor organic additives in Cu plating solution in a single test suite.
摘要:
Liquid conductivity and temperature are measured in respective sensitivity fields that are collocated—i. e., in volumes that nearly match by mathematical, geometrical, or functional criteria. Collocation is as distinct from mere adjacency or proximity; and is with respect to measurement volumes, not measuring hardware. Preferably pressure too is measured with sensitivity very generally collocated to the conductivity and temperature sensitivity. Preferably, respective temporal/spatial bandwidths of the two (or three) sensors are matched. Preferably the pressure sensor is a MEMS transducer, the conductivity sensor is a four-terminal device, the thermometer is a thermistor encapsulated in a silkscreened glass wall, and circuits (1) compensate for time lag between conductivity and temperature measurement, (2) remove artifacts due to detritus in or near either sensor, and (3) derive secondary parameters of the liquid.
摘要:
Disclosed are methods for determining the quantity of leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. Such methods are fast, work over a broad concentration range of components and can be performed in real-time.
摘要:
An ultramicroelectrode is disclosed which includes a) a silicon substrate; b) a silicon oxide insulating layer; c) a titanium adhesion layer; d) an iridium layer; e) a gold bond pad layer; f) a titanium adhesion layer; and g) a silicon dioxide insulating layer. In a preferred embodiment, the f) and g) layers have been partially or totally removed. Preferably, the ultramicroelectrode of the invention does not include mercury.
摘要:
The invention relates to a conductivity sensor with a substantially circular cylindrical casing of synthetic material and with metal measuring electrodes in its planar substantially circular front wall, of which at least two voltage electrodes and at least two current electrodes form poles, wherein at least two substantially circular voltage electrodes are encompassed by at least two plane-form current electrodes extending substantially in a semicircle or by at least four substantially circular current electrodes disposed in two semicircles.
摘要:
A method and an apparatus for utilizing a periodic disconnection of a cathodic protection circuit, the voltage fluctuations caused on a cathodically protected structure by periodic disconnection of the protection circuit being detected in an apparatus and used for remote-controlled disconnection of a decoupling capacitor. Detection of periodically occurring negative-going voltage edges on a cathodically protected structure. The voltage supply of an apparatus through a capacitor or an electric circuit by means of a current transformer and a voltage outlet via a breaker.