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公开(公告)号：US20110037179A1
公开(公告)日：2011-02-17
申请号：US12848057
申请日：2010-07-30
申请人： Paresh Limaye , Jan Vanfleteren , Eric Beyne
发明人： Paresh Limaye , Jan Vanfleteren , Eric Beyne
CPC分类号： H01L23/49833 , H01L23/13 , H01L23/49816 , H01L23/49838 , H01L23/4985 , H01L2224/05568 , H01L2224/05573 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/92125 , H01L2924/00014 , H01L2924/01019 , H01L2924/01079 , H01L2924/15311 , H01L2924/1532 , H01L2224/16225 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor package is disclosed. In one aspect, the package includes a base frame and a wiring substrate mounted on the base frame. The base frame has two pieces made of a material with respectively a first and a second coefficient of thermal expansion and connected to each other via resilient connecting structures. The wiring substrate has electric wiring tracks providing the electric connection between first and second bond pads, provided for being electrically connected to bond pads on respectively a die and a printed wiring board. The electrical wiring tracks have flexible parts provided to expand and contract along with the resilient connecting structures.
摘要翻译： 公开了半导体封装。 在一个方面中，包装包括安装在基架上的基架和布线基板。 基座框架具有由具有第一和第二热膨胀系数的材料制成的两个部件，并通过弹性连接结构相互连接。 布线基板具有提供第一和第二接合焊盘之间的电连接的电线路轨道，提供用于分别电连接到管芯和印刷线路板上的接合焊盘。 电线轨道具有设置成与弹性连接结构一起膨胀和收缩的柔性部分。
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公开(公告)号：US08450825B2
公开(公告)日：2013-05-28
申请号：US12848057
申请日：2010-07-30
申请人： Paresh Limaye , Jan Vanfleteren , Eric Beyne
发明人： Paresh Limaye , Jan Vanfleteren , Eric Beyne
IPC分类号： H01L23/36
CPC分类号： H01L23/49833 , H01L23/13 , H01L23/49816 , H01L23/49838 , H01L23/4985 , H01L2224/05568 , H01L2224/05573 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/92125 , H01L2924/00014 , H01L2924/01019 , H01L2924/01079 , H01L2924/15311 , H01L2924/1532 , H01L2224/16225 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor package is disclosed. In one aspect, the package includes a base frame and a wiring substrate mounted on the base frame. The base frame has two pieces made of a material with respectively a first and a second coefficient of thermal expansion and connected to each other via resilient connecting structures. The wiring substrate has electric wiring tracks providing the electric connection between first and second bond pads, provided for being electrically connected to bond pads on respectively a die and a printed wiring board. The electrical wiring tracks have flexible parts provided to expand and contract along with the resilient connecting structures.
摘要翻译： 公开了半导体封装。 在一个方面中，包装包括安装在基架上的基架和布线基板。 基座框架具有由具有第一和第二热膨胀系数的材料制成的两个部件，并通过弹性连接结构相互连接。 布线基板具有提供第一和第二接合焊盘之间的电连接的电线路轨道，提供用于分别电连接到管芯和印刷线路板上的接合焊盘。 电线轨道具有设置成与弹性连接结构一起膨胀和收缩的柔性部分。
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公开(公告)号：US20120280381A1
公开(公告)日：2012-11-08
申请号：US13517934
申请日：2010-12-23
申请人： Eric Beyne , Paresh Limaye
发明人： Eric Beyne , Paresh Limaye
CPC分类号： H01L23/5389 , H01L21/568 , H01L23/3128 , H01L23/36 , H01L23/562 , H01L24/97 , H01L25/0657 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2224/73253 , H01L2224/81005 , H01L2224/83005 , H01L2224/94 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01075 , H01L2924/014 , H01L2924/07811 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/18161 , H01L2924/351 , H01L2924/00 , H01L2224/81 , H01L2224/83
摘要： A semiconductor device is described advantageously making use of the interposer principle. The semiconductor device comprises at least one semiconductor die, a window substrate being an inorganic substrate comprising at least one window-shaped cavity for mounting the at least one semiconductor die, the window substrate having interconnect structures. Furthermore, the at least one semiconductor die is positioned inside the at least one cavity and is connected to the interconnect structures, providing connections to another level of assembly or packaging of the semiconductor device. The invention also relates to a method of manufacturing such a semiconductor device.
摘要翻译： 利用插入器原理有利地描述了半导体器件。 所述半导体器件包括至少一个半导体管芯，窗口衬底，其是包括至少一个用于安装所述至少一个半导体管芯的窗口形状的空腔的无机衬底，所述窗口衬底具有互连结构。 此外，至少一个半导体管芯位于至少一个空腔的内部并且连接到互连结构，提供与半导体器件的另一个级别的组装或封装的连接。 本发明还涉及一种制造这种半导体器件的方法。
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公开(公告)号：US20110027967A1
公开(公告)日：2011-02-03
申请号：US12831919
申请日：2010-07-07
申请人： Eric Beyne , Paresh Limaye
发明人： Eric Beyne , Paresh Limaye
IPC分类号： H01L21/30
CPC分类号： H01L24/11 , H01L24/13 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/03912 , H01L2224/0401 , H01L2224/05166 , H01L2224/05647 , H01L2224/11 , H01L2224/1147 , H01L2224/13 , H01L2224/13099 , H01L2224/81136 , H01L2224/81203 , H01L2224/81801 , H01L2225/06513 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01049 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/014 , H01L2924/10329 , H01L2924/1461 , H01L2924/00 , H01L2924/00014
摘要： A method for insertion bonding and a device thus obtained are disclosed. In one aspect, the device includes a first substrate having a front main surface and at least one protrusion at the front main surface. The device includes a second substrate having a front main surface and at least one hole extending from the front main surface into the second substrate. The protrusion of the first substrate is inserted into the hole of the second substrate. The hole is formed in a shape wherein the width is reduced in the depth direction and wherein the width of at least a part of the hole is smaller than the width of the protrusion at the location of the metal portion thereof. The protrusion is deformed during insertion thereof in the hole to provide a bond between the part of the hole and the metal portion.
摘要翻译： 公开了一种用于插入接合的方法和由此获得的器件。 一方面，该装置包括具有前主表面和在前主表面处的至少一个突起的第一基底。 该装置包括具有前主表面和从前主表面延伸到第二基板的至少一个孔的第二基板。 将第一基板的突起插入第二基板的孔中。 孔形成为宽度在深度方向上减小的形状，并且其中孔的至少一部分的宽度小于在其金属部分的位置处的突起的宽度。 突起在其插入孔期间变形，以在孔的一部分和金属部分之间形成结合。
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公开(公告)号：US09508665B2
公开(公告)日：2016-11-29
申请号：US12831919
申请日：2010-07-07
申请人： Eric Beyne , Paresh Limaye
发明人： Eric Beyne , Paresh Limaye
IPC分类号： H01L21/30 , H01L23/00 , H01L25/065 , H01L25/00
CPC分类号： H01L24/11 , H01L24/13 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/03912 , H01L2224/0401 , H01L2224/05166 , H01L2224/05647 , H01L2224/11 , H01L2224/1147 , H01L2224/13 , H01L2224/13099 , H01L2224/81136 , H01L2224/81203 , H01L2224/81801 , H01L2225/06513 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01049 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/014 , H01L2924/10329 , H01L2924/1461 , H01L2924/00 , H01L2924/00014
摘要： A method for insertion bonding and a device thus obtained are disclosed. In one aspect, the device includes a first substrate having a front main surface and at least one protrusion at the front main surface. The device includes a second substrate having a front main surface and at least one hole extending from the front main surface into the second substrate. The protrusion of the first substrate is inserted into the hole of the second substrate. The hole is formed in a shape wherein the width is reduced in the depth direction and wherein the width of at least a part of the hole is smaller than the width of the protrusion at the location of the metal portion thereof. The protrusion is deformed during insertion thereof in the hole to provide a bond between the part of the hole and the metal portion.
摘要翻译： 公开了一种用于插入接合的方法和由此获得的器件。 一方面，该装置包括具有前主表面和在前主表面处的至少一个突起的第一基底。 该装置包括具有前主表面和从前主表面延伸到第二基板的至少一个孔的第二基板。 将第一基板的突起插入第二基板的孔中。 孔形成为宽度在深度方向上减小的形状，并且其中孔的至少一部分的宽度小于在其金属部分的位置处的突起的宽度。 突起在其插入孔期间变形，以在孔的一部分和金属部分之间形成结合。
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公开(公告)号：US08907471B2
公开(公告)日：2014-12-09
申请号：US13517934
申请日：2010-12-23
申请人： Eric Beyne , Paresh Limaye
发明人： Eric Beyne , Paresh Limaye
IPC分类号： H01L23/053 , H01L21/00 , H01L23/538 , H01L23/36 , H01L23/31 , H01L23/00 , H01L25/065
CPC分类号： H01L23/5389 , H01L21/568 , H01L23/3128 , H01L23/36 , H01L23/562 , H01L24/97 , H01L25/0657 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2224/73253 , H01L2224/81005 , H01L2224/83005 , H01L2224/94 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01075 , H01L2924/014 , H01L2924/07811 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/18161 , H01L2924/351 , H01L2924/00 , H01L2224/81 , H01L2224/83
摘要： A semiconductor device is described advantageously making use of the interposer principle. The semiconductor device comprises at least one semiconductor die, a window substrate being an inorganic substrate comprising at least one window-shaped cavity for mounting the at least one semiconductor die, the window substrate having interconnect structures. Furthermore, the at least one semiconductor die is positioned inside the at least one cavity and is connected to the interconnect structures, providing connections to another level of assembly or packaging of the semiconductor device. The invention also relates to a method of manufacturing such a semiconductor device.
摘要翻译： 利用插入器原理有利地描述了半导体器件。 所述半导体器件包括至少一个半导体管芯，窗口衬底，其是包括至少一个用于安装所述至少一个半导体管芯的窗口形状的空腔的无机衬底，所述窗口衬底具有互连结构。 此外，至少一个半导体管芯位于至少一个空腔的内部并且连接到互连结构，提供与半导体器件的另一个级别的组装或封装的连接。 本发明还涉及一种制造这种半导体器件的方法。
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