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公开(公告)号：US20210363308A1
公开(公告)日：2021-11-25
申请号：US17291533
申请日：2019-11-06
Inventor： Kyosuke MICHIGAMI , Tomoaki SAWADA , Tomohiro FUKAO , Takatoshi ABE , Andy BEHR
Abstract: One aspect of the present invention relates to a resin composition containing a polyrotaxane (A), an epoxy resin (B), and a curing agent (C), in which the curing agent (C) contains an acid anhydride (C-1) in an amount of 0.1 parts by mass or more and less than 10 parts by mass based on a total of 100 parts by mass of the polyrotaxane (A), the epoxy resin (B), and the curing agent (C).
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公开(公告)号：US20180263113A1
公开(公告)日：2018-09-13
申请号：US15980245
申请日：2018-05-15
Inventor： Tomoaki SAWADA , Takatoshi ABE , Shingo YOSHIOKA
IPC: H05K1/02 , H05K1/03 , C08L63/00 , B32B5/02 , C08L101/00 , C09D105/16 , C09D163/00 , G06F3/041 , H01B1/02 , H01B1/24 , H01L31/0224 , C08J5/18 , C08J7/04 , C08K7/02 , B32B3/12 , B32B3/26 , B32B15/08 , B32B15/092
Abstract: The present invention is a resin composition characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to a resin composition wherein the stress relaxation rate (R) and the residual strain rate (α), as measured in a prescribed extension-restoration test, are as follows: 20%≤R≤95% and 0%≤α≤3%.
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公开(公告)号：US20160264813A1
公开(公告)日：2016-09-15
申请号：US14405541
申请日：2014-03-07
Inventor： Tomoaki SAWADA , Takatoshi ABE , Shingo YOSHIOKA
IPC: C09D163/00
CPC classification number: H05K1/0271 , B32B3/12 , B32B3/266 , B32B5/02 , B32B15/08 , B32B15/092 , B32B2260/021 , B32B2260/046 , B32B2262/103 , B32B2262/106 , B32B2262/14 , B32B2307/202 , B32B2307/412 , B32B2307/50 , B32B2363/00 , C08J5/18 , C08J7/047 , C08J2300/21 , C08J2367/02 , C08J2400/21 , C08J2463/00 , C08K7/02 , C08L101/00 , C09D105/16 , C09D163/00 , G06F3/041 , H01B1/02 , H01B1/24 , H01L31/022466 , H01L31/022491 , H05K1/0213 , H05K1/0274 , H05K1/028 , H05K1/0296 , H05K1/0326 , H05K1/0333 , H05K1/0366 , H05K2201/0108 , H05K2201/012 , H05K2201/0323 , H05K2201/0326 , Y10T428/24331 , Y10T428/24917 , C08L63/00
Abstract: The present invention is a resin composition characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to a resin composition wherein the stress relaxation rate (R) and the residual strain rate α, as measured in a prescribed extension-restoration test, are as follows: 20%≦R≦95% and 0%≦α≦3%.
Abstract translation: 本发明是一种树脂组合物，其特征在于能够进行弹性变形，几乎没有残余应变率和显示应力松弛性能。 更具体地说，本发明涉及一种树脂组合物，其中在规定的延伸恢复试验中测量的应力松弛率（R）和残余应变率α如下：20％≤R≤95％和0％ ≤α≤3％。
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公开(公告)号：US20240147627A1
公开(公告)日：2024-05-02
申请号：US18532011
申请日：2023-12-07
Inventor： Tomohiro FUKAO , Tomoaki SAWADA , Kyosuke MICHIGAMI
CPC classification number: H05K3/0058 , H05K1/0283 , H05K3/188 , H05K2201/0212 , H05K2203/0323
Abstract: One aspect of the present invention relates to a method for manufacturing a substrate with a conductive pattern, the method including: a base forming step of forming a plating base in a desired pattern on at least a portion of one surface of a stretchable substrate, wherein the stretchable substrate has a tensile modulus at 20° C. of 0.1 MPa or more and 500 MPa or less, an elongation at break of 100% or more and 1000% or less, and a storage modulus at 250° C. of 0.1 MPa or more; a bending step of bending the stretchable substrate; and a conductive pattern forming step of plating the plating base after performing the bending step to form a conductive pattern on the stretchable substrate.
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公开(公告)号：US20220167497A1
公开(公告)日：2022-05-26
申请号：US17440453
申请日：2020-03-26
Inventor： Tomohiro FUKAO , Tomoaki SAWADA , Takatoshi ABE , Kyosuke MICHIGAMI , Makoto TAKASHIRO , Susumu FUKUSHIMA , Daisuke HONDA
Abstract: Provided is a stretchable circuit board including a stretchable insulating layer, and a wiring, in which the wiring is formed of a combination of a metal wiring portion that forms a main portion of the wiring, and a conductive stretchable portion disposed ancillary to the metal wiring portion.
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Patent Agency Ranking
公开(公告)号：US20160152016A1
公开(公告)日：2016-06-02
申请号：US14925048
申请日：2015-10-28
Inventor： Takatoshi ABE , Tomoaki SAWADA , Shingo YOSHIOKA
CPC classification number: B32B27/36 , B32B3/08 , B32B3/30 , B32B7/045 , B32B27/08 , B32B27/20 , B32B27/38 , B32B2305/77 , B32B2307/202 , B32B2307/21 , B32B2307/50 , B32B2307/51 , B32B2307/546 , B32B2307/552 , B32B2307/734 , B32B2457/00 , B32B2457/20 , B32B2571/00 , C08G59/245 , C08G59/56 , C08L63/00 , C08L71/02 , C08L87/00
Abstract: Provided is a structural member for electronic devices which uses a material that is flexible and has excellent restoration properties after extension and stress relaxation properties. The structural member for electronic devices has the following properties A and B: (Property A) In a case where predetermined deformation is applied, stress that applies the deformation is relaxed (reduced) with time: and (Property B) In a case where the stress that applies deformation is 0, the deformation rarely remains while a resin composition is recovered. That is, when stress is 0, residual strain substantially becomes 0 (specifically 3% or lower).
Abstract translation: 本发明提供一种电子器件的结构构件，其使用柔性材料并且在延伸和应力松弛性能之后具有优异的恢复性能。 电子装置用结构体具有以下性质A，B :(属性A）在施加规定的变形的情况下，施加变形的应力随着时间而放宽（减少）：（性能B）在 施加变形的应力为0，在回收树脂组合物时，变形很少残留。 也就是说，当应力为0时，残余应变基本上变为0（具体为3％以下）。
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公开(公告)号：US20240425642A1
公开(公告)日：2024-12-26
申请号：US18819667
申请日：2024-08-29
Inventor： Tomohiro FUKAO , Tomoaki SAWADA , Takatoshi ABE
Abstract: An aspect of the present invention relates to a stretchable resin composition containing an epoxy resin and a curing agent, in which the epoxy resin has a weight average molecular weight of 50,000 or more and 3,000,000 or less and a polydispersity of average molecular weights (Mw/Mn) that satisfies the following Formula (1): 1.1≤Mw/Mn≤3.0(1) (wherein, Mn represents a number average molecular weight and Mw represents a weight average molecular weight), the curing agent is a crystalline compound, and a glass transition temperature of a cured product of the stretchable resin composition is 60° C. or less.
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公开(公告)号：US20220208411A1
公开(公告)日：2022-06-30
申请号：US17556119
申请日：2021-12-20
Inventor： Tomohiro FUKAO , Tomoaki SAWADA , Takatoshi ABE , Kyosuke MICHIGAMI
Abstract: An aspect of the present invention relates to a conductive resin composition containing an epoxy resin, a curing agent, and a conductive powder, in which a loss modulus of a dried product or semi-cured product of the conductive resin composition at 170° C. is 0.1 MPa or more and 15 MPa or less.
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公开(公告)号：US20220201850A1
公开(公告)日：2022-06-23
申请号：US17603781
申请日：2020-04-16
Inventor： Takatoshi ABE , Tomohiro FUKAO , Tomoaki SAWADA , Kyosuke MICHIGAMI
Abstract: A stretchable laminate to be fixed to a fabric includes a stretchable circuit board including a stretchable insulating layer having an elongation rate of 10% or more, a fabric base material, and an adhesive layer that bonds the stretchable circuit board and the fabric base material together.
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公开(公告)号：US20220183154A1
公开(公告)日：2022-06-09
申请号：US17441492
申请日：2020-03-26
Inventor： Tomohiro FUKAO , Tomoaki SAWADA , Takatoshi ABE , Kyosuke MICHIGAMI
IPC: H05K1/03
Abstract: A fiber sheet includes: a resin layer containing a thermosetting resin; and a fiber layer, wherein the fiber sheet is stretchable by 1% or more, and an initial tensile elastic modulus of the fiber sheet is 1 MPa or more and 1 GPa or less.
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