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公开(公告)号：US20210363308A1
公开(公告)日：2021-11-25
申请号：US17291533
申请日：2019-11-06
Inventor： Kyosuke MICHIGAMI , Tomoaki SAWADA , Tomohiro FUKAO , Takatoshi ABE , Andy BEHR
Abstract: One aspect of the present invention relates to a resin composition containing a polyrotaxane (A), an epoxy resin (B), and a curing agent (C), in which the curing agent (C) contains an acid anhydride (C-1) in an amount of 0.1 parts by mass or more and less than 10 parts by mass based on a total of 100 parts by mass of the polyrotaxane (A), the epoxy resin (B), and the curing agent (C).
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2.发明公开公开(公告)号：US20230167215A1
公开(公告)日：2023-06-01
申请号：US18100960
申请日：2023-01-24
Inventor： Tomohiro FUKAO , Tomoaki SAWADA , Kyosuke MICHIGAMI
IPC: C08F220/32 , C08F220/44 , C08F220/18 , C08K5/09 , C08J5/18 , B32B15/082 , B32B15/20
CPC classification number: C08F220/325 , C08F220/44 , C08F220/1811 , C08K5/09 , C08J5/18 , B32B15/082 , B32B15/20 , C08J2333/08 , C08J2333/20 , B32B2457/08 , B32B2307/304 , B32B2311/12
Abstract: An aspect of the present invention relates to a resin composition containing an acrylic resin and a curing agent, in which the acrylic resin contains a polymerization unit (A) of a (meth)acrylate having an epoxy group, a polymerization unit (B) of a (meth)acrylate having a cyano group, and a polymerization unit (C) of a (meth)acrylate having an isobornyl group, a weight average molecular weight of the acrylic resin is 50,000 or more and 3,000,000 or less, and a storage modulus of a cured product of the resin composition at 200° C. is 0.1 MPa or more and 3.5 MPa or less.
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公开(公告)号：US20240147609A1
公开(公告)日：2024-05-02
申请号：US18410564
申请日：2024-01-11
Inventor： Tomohiro FUKAO , Tomoaki SAWADA , Kyosuke MICHIGAMI , Qianying LI
CPC classification number: H05K1/0283 , H05K1/181 , H05K3/0058 , H05K3/0094 , H05K3/1283 , H05K2201/0212
Abstract: A method for manufacturing a stretchable circuit board includes preparing a laminate in which a metal layer and a first stretchable insulating layer are in contact with each other and a peel strength between the metal layer and the first stretchable insulating layer is 0.5 N/mm or more and 3.0 N/mm or less, a second stretchable insulating layer, and a fluid; forming a via leading from a first surface, in contact with the metal layer, of the first stretchable insulating layer to a second surface opposite to the first surface; filling the fluid in the via; laminating the second stretchable insulating layer on the second surface to seal the via; and patterning the metal layer.
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公开(公告)号：US20240147627A1
公开(公告)日：2024-05-02
申请号：US18532011
申请日：2023-12-07
Inventor： Tomohiro FUKAO , Tomoaki SAWADA , Kyosuke MICHIGAMI
CPC classification number: H05K3/0058 , H05K1/0283 , H05K3/188 , H05K2201/0212 , H05K2203/0323
Abstract: One aspect of the present invention relates to a method for manufacturing a substrate with a conductive pattern, the method including: a base forming step of forming a plating base in a desired pattern on at least a portion of one surface of a stretchable substrate, wherein the stretchable substrate has a tensile modulus at 20° C. of 0.1 MPa or more and 500 MPa or less, an elongation at break of 100% or more and 1000% or less, and a storage modulus at 250° C. of 0.1 MPa or more; a bending step of bending the stretchable substrate; and a conductive pattern forming step of plating the plating base after performing the bending step to form a conductive pattern on the stretchable substrate.
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Patent Agency Ranking
公开(公告)号：US20220167497A1
公开(公告)日：2022-05-26
申请号：US17440453
申请日：2020-03-26
Inventor： Tomohiro FUKAO , Tomoaki SAWADA , Takatoshi ABE , Kyosuke MICHIGAMI , Makoto TAKASHIRO , Susumu FUKUSHIMA , Daisuke HONDA
Abstract: Provided is a stretchable circuit board including a stretchable insulating layer, and a wiring, in which the wiring is formed of a combination of a metal wiring portion that forms a main portion of the wiring, and a conductive stretchable portion disposed ancillary to the metal wiring portion.
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6.发明申请公开(公告)号：US20250115036A1
公开(公告)日：2025-04-10
申请号：US18904813
申请日：2024-10-02
Inventor： Kyosuke MICHIGAMI
Abstract: The present invention relates to a stretchable laminate that is a laminate including: a resin layer (A); a first substrate (B); and a second substrate (C), wherein the resin layer (A) includes a cured product of a resin composition including an organic peroxide, the resin layer (A) is located between the first substrate (B) and the second substrate (C), the resin layer (A) has a tensile stress of 0.5 MPa or more and 10 MPa or less at 50% elongation, and an elongation at break of 50% or more and 700% or less, and when a surface of the resin layer (A) is observed with an optical microscope, a total number of bubbles and openings having a diameter of 150 to 500 μm is 5 per 10 cm2 or less, and bubbles and openings having a diameter exceeding 500 μm are not present.
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公开(公告)号：US20220208411A1
公开(公告)日：2022-06-30
申请号：US17556119
申请日：2021-12-20
Inventor： Tomohiro FUKAO , Tomoaki SAWADA , Takatoshi ABE , Kyosuke MICHIGAMI
Abstract: An aspect of the present invention relates to a conductive resin composition containing an epoxy resin, a curing agent, and a conductive powder, in which a loss modulus of a dried product or semi-cured product of the conductive resin composition at 170° C. is 0.1 MPa or more and 15 MPa or less.
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公开(公告)号：US20220201850A1
公开(公告)日：2022-06-23
申请号：US17603781
申请日：2020-04-16
Inventor： Takatoshi ABE , Tomohiro FUKAO , Tomoaki SAWADA , Kyosuke MICHIGAMI
Abstract: A stretchable laminate to be fixed to a fabric includes a stretchable circuit board including a stretchable insulating layer having an elongation rate of 10% or more, a fabric base material, and an adhesive layer that bonds the stretchable circuit board and the fabric base material together.
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公开(公告)号：US20220183154A1
公开(公告)日：2022-06-09
申请号：US17441492
申请日：2020-03-26
Inventor： Tomohiro FUKAO , Tomoaki SAWADA , Takatoshi ABE , Kyosuke MICHIGAMI
IPC: H05K1/03
Abstract: A fiber sheet includes: a resin layer containing a thermosetting resin; and a fiber layer, wherein the fiber sheet is stretchable by 1% or more, and an initial tensile elastic modulus of the fiber sheet is 1 MPa or more and 1 GPa or less.
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