SOLID-STATE IMAGING APPARATUS AND RANGING APPARATUS

    公开(公告)号:US20230156370A1

    公开(公告)日:2023-05-18

    申请号:US18098451

    申请日:2023-01-18

    CPC classification number: H04N25/771 H04N25/50 H04N25/78

    Abstract: A solid-state imaging apparatus includes a plurality of pixel circuits arranged in a matrix. Each pixel circuit includes: a photodiode; a first charge storage that stores a charge; a floating diffusion region that stores a charge; a second charge storage that stores a charge; a first transfer transistor that transfers a charge from the photodiode to the first charge storage; a second transfer transistor that transfers a charge from the first charge storage to the floating diffusion region; a first reset transistor that resets the floating diffusion region; and an accumulating transistor for accumulating a charge of the floating diffusion region in the second charge storage. The capacitance of the first charge storage is greater than the capacitance of the floating diffusion region, and the capacitance of the second charge storage is greater than the capacitance of the floating diffusion region.

    SOLID-STATE IMAGING DEVICE, IMAGING DEVICE, AND DISTANCE MEASUREMENT DEVICE

    公开(公告)号:US20230131491A1

    公开(公告)日:2023-04-27

    申请号:US18069683

    申请日:2022-12-21

    Abstract: A solid-state imaging device includes: pixels; a first sample-and-hold circuit provided per column and generating a first differential voltage that is a difference between a first reset voltage and a first signal voltage output from a first pixel disposed in a corresponding column among the pixels; a second sample-and-hold circuit provided per column and generating a second differential voltage that is a difference between a second reset voltage and a second signal voltage output from a second pixel disposed in the corresponding column among the pixels and different from the first pixel; and an A/D conversion circuit provided per column and converting, into digital signals, a first voltage based on the first differential voltage output from the first sample-and-hold circuit disposed in the corresponding column and a second voltage based on the second differential voltage output from the second sample-and-hold circuit disposed in the corresponding column.

    SOLID-STATE IMAGE SENSOR
    4.
    发明申请

    公开(公告)号:US20220310684A1

    公开(公告)日:2022-09-29

    申请号:US17840139

    申请日:2022-06-14

    Abstract: A solid-state image sensor includes pixel cells each of which is formed in and above a semiconductor substrate and that are arranged in each of a first direction and a second direction intersecting the first direction to form a two-dimensional array. The pixel cells include a first pixel cell and a second pixel cell arranged in the second direction, and the pixel circuit of the first pixel cell and the pixel circuit of the second pixel cell are adjacent to each other in the second direction between the photodetection portion of the first pixel cell and the photodetection portion of the second pixel cell. Each of the first transistors of the first pixel cell shares a gate electrode with the first transistor of the second pixel cell that has the same function as the first transistor of the first pixel cell.

    SOLID-STATE IMAGING DEVICE
    7.
    发明申请

    公开(公告)号:US20220005855A1

    公开(公告)日:2022-01-06

    申请号:US17479846

    申请日:2021-09-20

    Abstract: A plurality of pixel cells are provided on a semiconductor substrate and arranged in a two-dimensional array. At least one of the plurality of pixel cells includes a light receiving part, a pixel circuit, and a second transistor. The light receiving part receives an incident light to generate an electrical charge. The pixel circuit includes first transistors arranged side by side along a first direction and a charge retention part that retains the electrical charge generated by the light receiving part. The pixel circuit outputs a light receiving signal in accordance with the electrical charge generated by the light receiving part. The second transistor connects the charge retention part to a memory part that stores the electrical charge. Seen along a thickness direction of the semiconductor substrate, the second transistor is apart from the first transistors in a second direction orthogonal to the first direction.

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