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公开(公告)号：US20210395452A1
公开(公告)日：2021-12-23
申请号：US17281866
申请日：2019-09-27
Inventor： Tatsuya ARISAWA , Shun YAMAGUCHI , Fuminori SATOU , Akira IRIFUNE , Mitsuyoshi NISHINO
Abstract: A metal-clad laminate includes an insulating layer, and a metal foil in contact with at least one surface of the insulating layer, in which the insulating layer contains a cured product of a resin composition containing a polyphenylene ether compound, and the metal foil is a metal foil in which a first nickel element amount, on a surface on a side in contact with the insulating layer, measured by X-ray photoelectron spectroscopy is 4.5 at % or less with respect to a total element amount measured by X-ray photoelectron spectroscopy, and a second nickel element amount, on a surface on a side in contact with the insulating layer when the surface is sputtered for 1 minute at a speed of 3 nm/min in terms of SiO2, measured by X-ray photoelectron spectroscopy is 4.5 at % or less with respect to a total element amount measured by X-ray photoelectron spectroscopy.
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公开(公告)号：US20210079215A1
公开(公告)日：2021-03-18
申请号：US16629829
申请日：2018-06-22
Inventor： Tatsuya ARISAWA , Fumito SUZUKI , Shunji ARAKI , Hirohisa GOTO , Yuki INOUE
IPC: C08L71/12 , C08K5/00 , C08K5/3492 , C08K5/544 , C08K3/36 , C08K5/5399 , C08J5/24 , C08J5/04 , C08J5/18 , B32B15/08
Abstract: Provided is a resin composition containing: a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated carbon-carbon double bond; a cross-linking curing agent having an unsaturated carbon-carbon double bond in its molecule; a silane coupling agent having a phenylamino group in its molecule; and silica. A content of the silica is 60 to 250 parts by mass with respect to a total of 100 parts by mass of the modified polyphenylene ether compound and the cross-linking curing agent.
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公开(公告)号：US20230094806A1
公开(公告)日：2023-03-30
申请号：US17768153
申请日：2020-10-15
Inventor： Akira IRIFUNE , Shun YAMAGUCHI , Fuminori SATOU , Tatsuya ARISAWA , Mitsuyoshi NISHINO
Abstract: A metal-clad laminate includes an insulating layer that contains a cured product of a resin composition containing a polymer having a structural unit represented by Formula (1) in a molecule and a metal foil that is laminated on the insulating layer and is a metal foil in which a nickel element amount on a surface on a side in contact with the insulating layer and a nickel element amount on the surface when the surface is sputtered for 1 minute at 3 nm/min in terms of SiO2 are each 4.5 at % or less with respect to the total element amount on each surface. In Formula (1), Z represents an arylene group, R1-R3 each independently represent a hydrogen atom or an alkyl group, and R4-R6 each independently represent a hydrogen atom or an alkyl group having 1-6 carbon atoms.
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Patent Agency Ranking
公开(公告)号：US20230054257A1
公开(公告)日：2023-02-23
申请号：US17768170
申请日：2020-10-15
Inventor： Yuki INOUE , Tatsuya ARISAWA , Yuki KITAI
IPC: B32B15/20 , B32B15/082
Abstract: A copper-clad laminate includes an insulating layer that contains a cured product of a resin composition containing a polymer having a structural unit represented by the following Formula (1) in a molecule, and a metal foil that is laminated on the insulating layer, and in which a chromium element amount, on an exposed surface of the insulating layer exposed by an etching treatment of the copper-clad laminate is 7.5 at % or less with respect to a total element amount on the exposed surface, and ten-point average roughness of the exposed surface is 2.0 μm or less. In Formula (1), Z represents an arylene group, R1 to R3 each independently represent a hydrogen atom or an alkyl group, and R4 to R6 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.
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公开(公告)号：US20210014967A1
公开(公告)日：2021-01-14
申请号：US16603067
申请日：2018-02-15
Inventor： Tatsuya ARISAWA , Hirohisa GOTO , Tomoyuki ABE
IPC: H05K1/03 , C08F290/06 , B32B15/14 , H05K1/02
Abstract: A metal-clad laminated board includes an insulating layer and a metal layer, in which the insulating layer includes a cured product of a resin composition containing a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated double bond; and a crosslinkable curing agent having an unsaturated double bond in the molecule, and containing 40 to 250 parts by mass of silica particles with respect to 100 parts by mass in total of the modified polyphenylene ether compound and the crosslinkable curing agent, the resin composition contains 0.2 to 5 parts by mass of a first silane coupling agent having an unsaturated double bond in the molecule with respect to 100 parts by mass of the silica particles, and a contact surface of the metal layer in contact with the insulating layer is surface-treated with a second silane coupling agent having an amino group in the molecule.
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6.发明公开公开(公告)号：US20240279434A1
公开(公告)日：2024-08-22
申请号：US18567246
申请日：2022-05-23
Inventor： Shinichi KATSUTA , Tatsuya ARISAWA , Tomohiro HOSI , Tomoyuki ABE
IPC: C08K5/523 , C08F290/06 , C08G65/48
CPC classification number: C08K5/523 , C08F290/062 , C08G65/485
Abstract: One aspect of the present invention is a resin composition containing a radical-polymerizable compound (A) having a carbon-carbon unsaturated double bond in a molecule and a phosphoric acid ester compound (B) having an alicyclic hydrocarbon structure in a molecule.
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公开(公告)号：US20220015230A1
公开(公告)日：2022-01-13
申请号：US17281845
申请日：2019-09-27
Inventor： Yuki INOUE , Tatsuya ARISAWA , Shun YAMAGUCHI
IPC: H05K1/05 , G01N23/2273 , H05K1/09 , H05K3/00
Abstract: A copper-clad laminate includes an insulating layer and a copper foil in contact with at least one surface of the insulating layer, in which the insulating layer contains a cured product of a resin composition containing a modified polyphenylene ether compound of which a terminal is modified with a substituent having a carbon-carbon unsaturated double bond, a chromium element amount on an exposed surface on which the insulating layer is exposed by an etching treatment of the copper-clad laminate with a copper chloride solution, measured by X-ray photoelectron spectroscopy is 7.5 at % or less with respect to a total element amount measured by X-ray photoelectron spectroscopy, and a surface roughness of the exposed surface is 2.0 μm or less in terms of ten-point average roughness.
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公开(公告)号：US20190203045A1
公开(公告)日：2019-07-04
申请号：US16332259
申请日：2017-10-10
Inventor： Tatsuya ARISAWA , Hirohisa GOTO , Tomoyuki ABE
IPC: C08L71/12 , C08K5/5313 , C08K5/5399 , C08K5/00 , C08L63/04 , C08G65/332 , C08J5/24 , C08G59/06 , C08G59/40 , H05K1/03 , B32B15/08
CPC classification number: C08L71/126 , B32B15/08 , B32B27/00 , B32B2255/26 , B32B2307/3065 , B32B2363/00 , B32B2371/00 , B32B2457/08 , C08F290/06 , C08G59/063 , C08G59/4014 , C08G65/3322 , C08J5/24 , C08K5/0066 , C08K5/5313 , C08K5/5399 , C08L63/04 , C08L71/12 , C08L101/00 , C08L2201/02 , H05K1/03 , H05K1/0353
Abstract: One aspect of the present invention is a resin composition containing a thermosetting resin, a curing agent that reacts with the thermosetting resin, and a flame retardant, in which the flame retardant contains a compatible phosphorus compound that is compatible with a mixture of the thermosetting resin and the curing agent, and a non-compatible phosphorus compound that is not compatible with the mixture, a content of the compatible phosphorus compound is 1 to 3.5 parts by mass per 100 parts by mass of a total of the thermosetting resin and the curing agent, and a content of the non-compatible phosphorus compound is 14 to 30 parts by mass per 100 parts by mass of the total of the thermosetting resin and the curing agent.
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