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公开(公告)号：US11799048B2
公开(公告)日：2023-10-24
申请号：US17274312
申请日：2019-10-08
发明人： Daniel Richter , Luca Haiberger
IPC分类号： H01L31/173 , A61B5/00 , H01L31/0203 , H01L31/0216
CPC分类号： H01L31/173 , A61B5/0059 , H01L31/0203 , H01L31/02164 , H01L31/02165
摘要： In an embodiment an optoelectronic sensor includes a radiation-emitting semiconductor region, a radiation-detecting semiconductor region, a first polarization filter arranged above the radiation-emitting semiconductor region and including a first polarization direction and a second polarization filter arranged above the radiation-detecting semiconductor region and including a second polarization direction, wherein the first polarization direction and the second polarization direction are perpendicular to each other, wherein a radiation-reflecting or radiation-absorbing layer is arranged on side flanks of the radiation-emitting semiconductor region and/or the radiation-detecting semiconductor region and/or the first polarization filter and/or the second polarization filter.
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公开(公告)号：US10230031B2
公开(公告)日：2019-03-12
申请号：US15557564
申请日：2016-03-16
发明人： Luca Haiberger , Sam Chou
IPC分类号： H01L33/60 , H01L33/10 , H01L33/50 , H01L33/54 , H01L33/48 , H01L33/62 , H01L33/46 , H01L27/32 , H01L51/52
摘要： An electromagnetic radiation-emitting assembly is disclosed. In an embodiment the assembly includes an electromagnetic radiation-emitting component arranged above a carrier, the electromagnetic radiation-emitting component including a first side facing away from the carrier, a second side facing the carrier, and at least one side wall connecting the first side and the second side of the electromagnetic radiation-emitting component to one another, an encapsulating body, into which the electromagnetic radiation-emitting component is embedded, which adjoins the first side and the side wall of the electromagnetic radiation-emitting component, a potting material at least partly surrounding the encapsulating body and a reflector body at least partly surrounding the potting material.
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公开(公告)号：US20180062051A1
公开(公告)日：2018-03-01
申请号：US15557564
申请日：2016-03-16
发明人： Luca Haiberger , Sam Chou
CPC分类号： H01L33/60 , H01L27/322 , H01L33/10 , H01L33/46 , H01L33/486 , H01L33/504 , H01L33/54 , H01L33/62 , H01L51/5237 , H01L51/5268 , H01L51/5271 , H01L2224/48091 , H01L2224/73265 , H01L2933/0091 , H01L2924/00014
摘要： An electromagnetic radiation-emitting assembly is disclosed. In an embodiment the assembly includes an electromagnetic radiation-emitting component arranged above a carrier, the electromagnetic radiation-emitting component including a first side facing away from the carrier, a second side facing the carrier, and at least one side wall connecting the first side and the second side of the electromagnetic radiation-emitting component to one another, an encapsulating body, into which the electromagnetic radiation-emitting component is embedded, which adjoins the first side and the side wall of the electromagnetic radiation-emitting component, a potting material at least partly surrounding the encapsulating body and a reflector body at least partly surrounding the potting material.
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公开(公告)号：US09876148B2
公开(公告)日：2018-01-23
申请号：US15502188
申请日：2015-08-04
发明人： Luca Haiberger , Matthias Sperl
CPC分类号： H01L33/486 , H01L21/568 , H01L24/96 , H01L33/0095 , H01L33/54 , H01L33/62 , H01L2224/04105 , H01L2224/18 , H01L2224/19 , H01L2224/24 , H01L2224/82 , H01L2924/1301 , H01L2924/13055 , H01L2924/13091 , H01L2924/1815 , H01L2933/0033
摘要： An electronic component, an optoelectronic component, a component arrangement, and a method for producing an electronic component are disclosed. In an embodiment, the method includes forming a sacrificial structure on a top side of a carrier by a photolithographic process from a photoresist layer, arranging an electronic semiconductor chip on the carrier after exposing the photoresist layer, molding a molded body around the sacrificial structure and around the electronic semiconductor chip such that a surface of the electronic semiconductor chip is at least partly not covered by the molded body, detaching the molded body from the carrier and removing the sacrificial structure, wherein removing the sacrificial structure results in a cutout being formed in the molded body.
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公开(公告)号：US09741910B1
公开(公告)日：2017-08-22
申请号：US15119503
申请日：2015-02-18
发明人： Luca Haiberger , Michael Wittmann
CPC分类号： H01L33/56 , H01L33/465 , H01L33/48 , H01L33/483 , H01L33/486 , H01L33/50 , H01L33/501 , H01L33/502 , H01L33/504 , H01L33/507 , H01L33/508 , H01L33/54 , H01L2224/48091 , H01L2933/0091 , H01L2924/00014
摘要： An optoelectronic component includes a housing having a cavity in which an optoelectronic semiconductor chip having an emission face that emits light rays and a transparent potting material are arranged, wherein the cavity includes at least one side wall at least partly reflecting light rays incident on the side wall and reflectivity of which decreases as an operating period of the component increases, conversion particles are embedded into the potting material, which conversion particles convert light rays having a first wavelength incident on the conversion particles into light rays having a second wavelength, and scattering particles are embedded into the potting material, which scattering particles scatter light rays incident on the scattering particles and the scattering capability of which scattering particles increases as the operating period increases.
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公开(公告)号：US20170222094A1
公开(公告)日：2017-08-03
申请号：US15502188
申请日：2015-08-04
发明人： Luca Haiberger , Matthias Sperl
CPC分类号： H01L33/486 , H01L21/568 , H01L24/96 , H01L33/0095 , H01L33/54 , H01L33/62 , H01L2224/04105 , H01L2224/18 , H01L2224/19 , H01L2224/24 , H01L2224/82 , H01L2924/1301 , H01L2924/13055 , H01L2924/13091 , H01L2924/1815 , H01L2933/0033
摘要： An electronic component, an optoelectronic component, a component arrangement, and a method for producing an electronic component are disclosed. In an embodiment, the method includes forming a sacrificial structure on a top side of a carrier by a photolithographic process from a photoresist layer, arranging an electronic semiconductor chip on the carrier after exposing the photoresist layer, molding a molded body around the sacrificial structure and around the electronic semiconductor chip such that a surface of the electronic semiconductor chip is at least partly not covered by the molded body, detaching the molded body from the carrier and removing the sacrificial structure, wherein removing the sacrificial structure results in a cutout being formed in the molded body.
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公开(公告)号：US20190312964A1
公开(公告)日：2019-10-10
申请号：US16315448
申请日：2017-07-18
发明人： Luca Haiberger
摘要： A lighting device for a mobile terminal is disclosed. In an embodiment the lighting device includes a light-emitting component comprising a light-emitting semiconductor element and a first light emission face and a second light emission face, the light-emitting component configured to emit light radiation, a first optical waveguide for guiding the light radiation via the first light emission face to a first radiation element, a second optical waveguide for guiding the light radiation via the second light emission face to a second radiation element and at least one optical switch arranged in a region of the first light emission face or the second light emission face for controlling a quantity of light emitted from the light-emitting component via the respective light emission face.
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公开(公告)号：US20170222103A1
公开(公告)日：2017-08-03
申请号：US15119503
申请日：2015-02-18
发明人： Luca Haiberger , Michael Wittmann
CPC分类号： H01L33/56 , H01L33/465 , H01L33/48 , H01L33/483 , H01L33/486 , H01L33/50 , H01L33/501 , H01L33/502 , H01L33/504 , H01L33/507 , H01L33/508 , H01L33/54 , H01L2224/48091 , H01L2933/0091 , H01L2924/00014
摘要： An optoelectronic component includes a housing having a cavity in which an optoelectronic semiconductor chip having an emission face that emits light rays and a transparent potting material are arranged, wherein the cavity includes at least one side wall at least partly reflecting light rays incident on the side wall and reflectivity of which decreases as an operating period of the component increases, conversion particles are embedded into the potting material, which conversion particles convert light rays having a first wavelength incident on the conversion particles into light rays having a second wavelength, and scattering particles are embedded into the potting material, which scattering particles scatter light rays incident on the scattering particles and the scattering capability of which scattering particles increases as the operating period increases.
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公开(公告)号：US20170148959A1
公开(公告)日：2017-05-25
申请号：US15308648
申请日：2015-05-07
发明人： Luca Haiberger
CPC分类号： H01L33/56 , H01L33/486 , H01L33/502 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48465 , H01L2933/0058 , H01L2933/0091 , H01L2924/00014 , H01L2924/00
摘要： An optoelectronic component includes a housing, wherein a cavity is formed on an upper side of the housing, which is delimited by a wall, the housing has an empty space, the wall is arranged between the cavity and the empty space, the housing has a surface, the empty space is arranged between the surface of the housing and the wall, the wall and the surface are arranged at least partially parallel to each other, the wall includes an optically transparent material, and the wall has a wall thickness of 1 μm to 100 μm.
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10.发明申请RADIATION-EMITING SEMICONDUCTOR COMPONENT, LIGHTING DEVICE AND DISPLAY DEVICE 审中-公开辐射半导体元件，照明器件和显示器件公开(公告)号：US20150049510A1
公开(公告)日：2015-02-19
申请号：US14384092
申请日：2013-03-12
发明人： Luca Haiberger , Georg Bogner
IPC分类号： H01L33/46 , F21V8/00 , G02F1/1335 , H01L33/52
CPC分类号： H01L33/46 , G02B6/0068 , G02B6/0073 , G02F1/1336 , G02F1/133603 , H01L25/0753 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/60 , H01L2224/48091 , H01L2224/48465 , H01L2924/00
摘要： A radiation-emitting semiconductor component including a volume-emitting semiconductor chip including a first main surface and a second main surface opposite the first main surface, a first reflective element arranged at the first main surface and reflects electromagnetic radiation emerging through the first main surface during operation of the semiconductor chip back to the first main surface, a second reflective element arranged at the second main surface and reflects electromagnetic radiation emerging through the second main surface during operation of the semiconductor chip back to the second main surface, and at least one radiation exit surface through which electromagnetic radiation generated during the operation of the semiconductor component emerges from the semiconductor component, wherein the at least one radiation exit surface runs transversely with respect to the first main surface and the second main surface of the semiconductor chip.
摘要翻译： 一种包括体积发射半导体芯片的辐射发射半导体部件，包括第一主表面和与第一主表面相对的第二主表面，第一反射元件布置在第一主表面处，并且反射通过第一主表面出射的电磁辐射 将半导体芯片的操作返回到第一主表面，布置在第二主表面处的第二反射元件反射在半导体芯片返回到第二主表面的操作期间通过第二主表面出射的电磁辐射，以及至少一个辐射 出射表面，通过所述出射表面在半导体组件的操作期间产生的电磁辐射从半导体部件出射，其中所述至少一个辐射出射表面相对于半导体芯片的第一主表面和第二主表面横向延伸。
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