Abstract:
In an optical fiber scanning apparatus, an optical fiber to which a permanent magnet is disposed and which is configured to emit illumination light from a distal end portion is arranged in a hollow portion where a magnetic field generation unit is disposed of a frame body, the frame body for which a cross section of the hollow portion is a square includes a first frame body for which planar coils are disposed respectively on a first surface and a second surface that are orthogonal to each other, and a second frame body for which planar coils are disposed respectively on a third surface and a fourth surface that are orthogonal to each other, and which is bonded with the first frame body, and the first surface to the fourth surface configure inner surfaces of the hollow portion.
Abstract:
Provided is a covered stent manufacturing method including: disposing an inner cover inside a stent body having a mesh structure formed by knitting wires, the stent body having engagement portions, each of which is formed by hooking two bent portions of the wires with each other; disposing an outer cover outside the stent body; forming a slack portion that expands in a radial direction of the stent body in at least one of the covers, the slack portion creating slack that allows movements of the two bent portions in a longitudinal direction and the radial direction of the stent body in at least one of the covers; and joining the covers with each other in regions on an inner side of the mesh of the mesh structure.
Abstract:
An optical fiber scanning apparatus is the optical fiber scanning apparatus for which an optical fiber to which a permanent magnet is disposed and which is configured to emit illumination light from a distal end portion is arranged in a hollow portion of a magnetic field generation unit, the magnetic field generation unit is provided with four coil units each including a flexible substrate where a planar coil, a lead-out wiring layer of the planar coil and an external connection electrode pad are disposed, and an inside of the four coil units arranged in a square prism shape configures the hollow portion.
Abstract:
An ultrasound transducer array according to an embodiment includes a substrate, a plurality of groove-like recesses arranged at a predetermined interval on one surface of the substrate, a cell region arranged between the recesses on the one surface side of the substrate, a flexible film configured to cover the substrate and the cell region and having fragility lower than fragility of the substrate, and a dividing groove having a width smaller than a width of the recess and reaching from the other surface of the substrate to the flexible film in the recess.
Abstract:
Stent device has a stent cover bonding to the stent wires forming the stent body at a plurality of bonding portions that are remote from the cross over points of the stent wire. By allocating the bonding portions to the stent wires in between the cross over portions, the axial flexibility of the stent device is maintained. The stent cover bonded by the disclosed bonding portions contributes to preventing lumen tissues to penetrate into the stent body and clogging the stent while placement of the bonding portions bonding the stent cover to the stent device provides variations of positive effects to the cover stent device and to the patient in which the stent device is placed.
Abstract:
An ultrasound transducer element includes a plurality of electrostatic capacitance type ultrasound cells each having a lower electrode portion and a membrane including an upper electrode portion that are oriented and disposed via a cavity circular in plan view, and a thickness of the cavity monotonously decreases in a curved manner toward an outer circumferential portion from a center portion of the cavity.
Abstract:
An ultrasound element includes a silicon substrate, a lower electrode layer that has a plurality of lower electrode sections, and a plurality of lower wiring sections, and is connected to a lower electrode terminal to which a drive signal and a bias signal are applied, a lower insulating layer, an upper insulating layer in which a plurality of cavities smaller than the respective lower electrode sections are formed, an upper electrode layer that has a plurality of upper electrode sections that are disposed to face the respective lower electrode sections via the respective cavities, and are smaller than the lower electrode sections and larger than the cavities, and a plurality of upper wiring sections, and is connected to an upper electrode terminal at a ground potential that detects a capacitance signal, and a protection layer.
Abstract:
A US element includes a silicon substrate, wherein a lower electrode layer that has a plurality of lower electrode sections, and a plurality of lower wiring sections, and is connected to a lower electrode terminal to which a drive signal and a bias signal are applied, a lower insulating layer, an upper insulating layer in which a plurality of cavities are formed, an upper electrode layer that has a plurality of upper electrode sections and a plurality of upper wiring sections, and is connected to an upper electrode terminal at a ground potential for detecting a capacitance signal, and a protection layer are sequentially stacked on the silicon substrate, and the US element further includes a shield electrode section that is formed at least at an upper side of the lower wiring sections, and is connected to a shield electrode terminal at a ground potential.