摘要:
A semiconductor device includes a first MIS transistor on a first active region of a semiconductor substrate, the first MIS transistor including: a first gate insulating film provided on the first active region; a first gate electrode provided on the first gate insulating film; a first stressor insulating film provided on an upper face and side faces facing in a gate length direction of the first gate electrode such that first stress acts on a channel of the first MIS transistor in the gate length direction; and a first base insulating film provided on side faces of the first gate electrode facing in a gate width direction, wherein the side faces of the first gate electrode facing in the gate width direction are not covered with the first stressor insulating film.
摘要:
A semiconductor device includes a first MIS transistor on a first active region of a semiconductor substrate, the first MIS transistor including: a first gate insulating film provided on the first active region; a first gate electrode provided on the first gate insulating film; a first stressor insulating film provided on an upper face and side faces facing in a gate length direction of the first gate electrode such that first stress acts on a channel of the first MIS transistor in the gate length direction; and a first base insulating film provided on side faces of the first gate electrode facing in a gate width direction, wherein the side faces of the first gate electrode facing in the gate width direction are not covered with the first stressor insulating film.
摘要:
A circuit simulation apparatus has a means to acquire data regarding a transistor, a model parameter generation unit for generating a model parameter representing effects of stress upon the transistor active region caused by the isolation region, and a simulation execution unit for evaluating characteristics of the transistor using a simulation program associated with the model parameter. The model parameter includes a term regarding width of the transistor active region, a term regarding width of the peripheral active region, and a term regarding width between the transistor active region and the peripheral active region.
摘要:
By using, as a model expression, an expression showing an inverse proportion between a change rate ΔIdsat/Idsat of saturated current value and a product of a gate protrusion length E1 and a gate width Wg of a transistor and a coefficient, modeling is executed for a transistor property that depends on the gate protrusion length. This provides a circuit simulation that takes into consideration the gate protrusion length of a gate electrode.
摘要:
A first PMIS transistor includes a first active region which is formed on a semiconductor substrate and a first gate electrode which is formed on the first active region and which is connected at one end thereof to a first gate wiring and includes at the other end thereof a first protruding portion protruding at a side opposite to the first gate wiring side from the first active region A first NMIS transistor includes a second active region which is formed on the semiconductor substrate with a space left from the first active region and a second gate electrode which is formed on the second active region and which is connected at one end thereof to the first gate wiring and includes at the other end thereof a second protruding portion protruding at a side opposite to the first gate wiring side from the second active region. A protruding length of the first protruding portion of the first PMIS transistor is greater than a protruding length of the second protruding portion of the first NMIS transistor.
摘要:
An integrated circuit includes: a first well of a first conductivity type; a second well of a second conductivity type coming into contact with the first well at a well boundary extending in a gate length direction; a first transistor having a first active region of the second conductivity type provided in the first well; and a second transistor which has a second active region of the second conductivity type provided in the first well and differing from the first active region in length in a gate width direction. The center location of the first active region in the gate width direction is aligned with the center location of the second active region in the gate width direction with reference to the well boundary.
摘要:
An electrostatic discharge protected transistor of the present invention includes transistors in an active region composed of a p-type semiconductor substrate and surrounded by element isolation regions. On the active region composed of the p-type semiconductor substrate, an on-source silicide film and an on-drain silicide film are provided. The on-drain silicide film is not provided in a portion located on a boundary of each transistor and divided to correspond to the respective transistors. As a result, regions between respective pairs of the transistors have high resistances, and it is, therefore, possible to prevent a current from flowing between the different transistors and prevent local current concentration. It is thereby possible to allow the electrostatic discharge protected transistor to make most use of an electrostatic destruction protection capability per unit area without increasing an area of the transistor.
摘要:
An inventive semiconductor circuit device includes an N-well and a P-well. The N-well is provided with PMIS active areas surrounded by a trench isolation, and the P-well is provided with NMIS active areas surrounded by the trench isolation. The PMIS active areas are each provided with a gate of a P-channel transistor, and the NMIS active areas are each provided with a gate of an N-channel transistor. A layout is designed such that a distance Dpn between the NMIS active areas and the PMIS active areas in a Y-direction substantially becomes a fixed value. Thus, trench isolation stresses applied from the trench isolations to channel regions under the gates become uniform for respective transistors, resulting in an improvement in accuracy of circuit simulation.
摘要:
A power circuit including means for preventing the generation of an inrush current during the power circuit's initial operation without increasing the size of the power circuit is described. The power circuit comprises an output transistor for supplying a current from a power supply to an output terminal, and a differential amplifier for controlling the current supplied by the output transistor in such a manner as to regulate a voltage at the output terminal based on a preset reference voltage. A limiting transistor is provided as a source follower on a current path at the output stage of the differential amplifier. The gate potential of the output transistor is controlled using the source potential of the limiting transistor. Before the power circuit starts to operate, an operation controller charges a capacitor to control the gate potential of the limiting transistor so that during the initial operation of the power circuit, the capacitor is discharged by using a current source. Accordingly, during the initial operation of the power circuit, the gate potential of the limiting transistor gradually decreases while the gate-source voltage of the output transistor gradually increases. As a result, the generation of the inrush current can be suppressed.
摘要:
A semiconductor device includes a semiconductor substrate; a diffusion region which is formed in the semiconductor substrate and serves as a region for the formation of a MIS transistor; an element isolation region surrounding the diffusion region; at least one gate conductor film which is formed across the diffusion region and the element isolation region, includes a gate electrode part located on the diffusion region and a gate interconnect part located on the element isolation region, and has a constant dimension in the gate length direction; and an interlayer insulating film covering the gate electrode. The semiconductor device further includes a gate contact which passes through the interlayer insulating film, is connected to the gate interconnect part, and has the dimension in the gate length direction larger than the gate interconnect part.