摘要:
Methods and apparatus are disclosed for performing charged-particle-beam (CPB) microlithography, in which methods and apparatus certain position-measurement marks are detected by appropriate deflections of a charged particle beam. The deflections are performed using a primary deflector and a mark-scanning deflector. For example, the beam is deflected by the primary deflector to illuminate a position-measurement mark on the reticle and a corresponding position-measurement mark on the substrate. The position-measurement mark on the substrate is scanned by minute deflections of the beam as performed by the mark-scanning deflector. Meanwhile, charged particles backscattered from the position-measurement mark on the substrate (as the mark is being scanned) are captured and detected by a detector. The marks are detected at timing moments during normal operation of the primary deflector. Thus, during detection of the marks, the resulting positional determinations are less affected by extraneous variables such as changes in temperature and/or hysteresis of the primary deflector.
摘要:
Apparatus and methods are disclosed pertaining to microlithography performed using a charged particle beam. In an exemplary apparatus, the projection-optical system includes a first projection lens situated downstream of a pattern-defining reticle and a second projection lens situated downstream of the first projection lens. Between the first and second projection lenses is a back focal plane of the first projection lens, at which focal plane a beam crossover is formed. The projection-optical system includes a cutoff-plate assembly, including at least one aperture-defining cutoff plate, located between the reticle and the back focal plane. The respective aperture in each cutoff plate is wider than an aperture in a scattering aperture conventionally located at the back focal plane. If the cutoff-plate assembly includes multiple cutoff plates, the aperture defined in the cutoff plate closer to the reticle is wider than the aperture defined in the more downstream cutoff plate. At least one of the cutoff plates defines an aperture that is laterally extended in a beam-deflection direction in the projection-optical system.
摘要:
Microlithography reticles are disclosed that include a high-contrast reticle-identification code (bar code). The bar code is configured as a pattern (usually linearly arrayed) of high-scattering regions (bar-code elements) each exhibiting a relatively high degree of reflection-scattering of irradiated probe light. The high-scattering regions are separated from one another by respective low-scattering regions each exhibiting a relatively low degree of reflection-scattering of incident probe light. For example, the low-scattering regions have smooth surfaces from which very little probe light is reflection-scattered, wherein each high-scattering region includes multiple scattering features such as line, channels, projections, or the like that provide multiple edges and/or points that reflection-scatter probe light. The edges in a high-scattering region can be arranged with a line-space (L/S) pitch that is below the resolution limit of an optical system that delivers probe light to the bar code and detects probe light reflection-scattered from the bar code.
摘要:
In the context of charged-particle-beam (CPB) microlithography methods and systems, methods are disclosed for detecting the incidence orthogonality of a patterned beam on the lithographic substrate. In an embodiment, the position of reticle-fiducial-mark images, as formed on the substrate stage at a position Z1, are detected at two lateral positions of a corresponding reticle fiducial mark. A distance L1 between the images is determined. Then, the substrate stage is moved to a position Z2, at which the position of reticle-fiducial-mark images are detected at two lateral positions of the corresponding reticle fiducial mark. A distance L2 between the images is determined. The incidence-orthogonality error nullnull is calculated by substitution into nullnullnull(L1nullL2)/2nullH. The projection-optical system of the CPB microlithography apparatus is adjusted so that nullnullnull0.
摘要:
Reticles and apparatus for performing charged-particle-beam microlithography, and associated methods, are disclosed, in which the pattern to be transferred to a sensitive substrate is divided according to any of various schemes serving to improve throughput and pattern-transfer accuracy. The methods and apparatus are especially useful whenever a divided stencil reticle is used that includes complementary pattern portions.
摘要:
Methods are disclosed for producing reticles for use in charged-particle-beam microlithography. In an exemplary method, a pattern to be formed on a sensitive substrate is designed. For at least certain of the pattern elements, local resizing is determined as appropriate for correcting proximity effects. Corresponding nullinitial valuenull reticle-pattern data is then produced. During drawing of the reticle pattern on a reticle substrate using an electron beam, the beam dose is varied so as to change linewidths of the pattern elements from their respective initial value data. Drawn linewidths also can be changed for pattern elements during drawing. The reticle that is produced exhibits better correction of proximity effects when the pattern is transferred to the sensitive substrate.
摘要:
Charged-particle-beam (CPB) microlithography methods and apparatus are disclosed that suppress increases in reticle temperature caused by CPB irradiation during exposure. The methods and apparatus employ a reticle segmented into subfields or analogous exposure units arranged into minor stripes and at least one major stripe. At least some of the minor stripes comprise a region in which the constituent minor stripes are illuminated multiple times to achieve transfer of the respective pattern portions to a corresponding region on the substrate. Each time a constituent minor stripe is illuminated, the beam energy is reduced, thereby reducing reticle heating. After a subfield in the region has been transferred multiple times to a corresponding transfer subfield on the substrate, the net exposure energy received by the transfer subfield is the same as if the transfer subfield had been exposed only once at a correspondingly higher dose.