公开(公告)号：US10861764B2

公开(公告)日：2020-12-08

申请号：US16295962

申请日：2019-03-07

Applicant: NXP USA, Inc.

Inventor： Lakshminarayan Viswanathan ,  Mahesh K. Shah ,  Lu Li ,  David Abdo ,  Geoffrey Tucker ,  Carl Emil D'Acosta ,  Jaynal A. Molla ,  Justin Eugene Poarch ,  Paul Hart

IPC: H01L23/367 ,  H01L21/48 ,  H01L23/13 ,  H01L23/528 ,  H01L23/00 ,  H01L23/36 ,  H01L23/047 ,  H01L23/373 ,  H01L23/40 ,  H01L23/433 ,  H05K1/02

Abstract: Microelectronic systems and components having integrated heat dissipation posts are disclosed, as are methods for fabricating such microelectronic systems and components. In various embodiments, the microelectronic system includes a substrate having a frontside, a socket cavity, and inner cavity sidewalls defining the socket cavity. A microelectronic component is seated on the frontside of the substrate such that a heat dissipation post, which projects from the microelectronic component, is received in the socket cavity and separated from the inner cavity sidewalls by a peripheral clearance. The microelectronic system further includes a bond layer contacting the inner cavity sidewalls, contacting an outer peripheral portion of the heat dissipation post, and at least partially filling the peripheral clearance.

公开(公告)号：US10269678B1

公开(公告)日：2019-04-23

申请号：US15832479

申请日：2017-12-05

Applicant: NXP USA, INC.

Inventor： Lakshminarayan Viswanathan ,  Mahesh K. Shah ,  Lu Li ,  David Abdo ,  Geoffrey Tucker ,  Carl Emil D'Acosta ,  Jaynal A. Molla ,  Justin Eugene Poarch ,  Paul Hart

IPC: H01L21/48 ,  H01L23/00 ,  H01L23/13 ,  H01L23/40 ,  H01L23/367 ,  H01L23/528

Abstract: Microelectronic systems having integrated heat dissipation posts are disclosed, as are methods for fabricating such microelectronic systems. In various embodiments, the method includes the step or process of obtaining a microelectronic component from which a heat dissipation post projects. The microelectronic component is placed or seated on a substrate, such as a multilayer printed circuit board, having a socket cavity therein. The heat dissipation post is received in the socket cavity as the microelectronic component is seated on the substrate. Concurrent with or after seating the microelectronic component, the microelectronic component and the heat dissipation post are bonded to the substrate. In certain embodiments, the heat dissipation post may be dimensioned or sized such that, when the microelectronic component is seated on the substrate, the heat dissipation post occupies a volumetric majority of the socket cavity.

公开(公告)号：US20190206759A1

公开(公告)日：2019-07-04

申请号：US16295962

申请日：2019-03-07

Applicant: NXP USA, Inc.

Inventor： Lakshminarayan Viswanathan ,  Mahesh K. Shah ,  Lu Li ,  David Abdo ,  Geoffrey Tucker ,  Carl Emil D'Acosta ,  Jaynal A. Molla ,  Justin Eugene Poarch ,  Paul Hart

IPC: H01L23/367 ,  H01L21/48 ,  H01L23/13 ,  H01L23/528 ,  H01L23/00

CPC classification number: H01L23/367 ,  H01L21/4853 ,  H01L21/4867 ,  H01L21/4882 ,  H01L23/047 ,  H01L23/13 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/3736 ,  H01L23/4334 ,  H01L23/5286 ,  H01L24/29 ,  H01L24/73 ,  H01L24/83 ,  H01L2023/4043 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2224/29239 ,  H01L2224/29244 ,  H01L2224/29247 ,  H01L2224/73265 ,  H01L2224/8384

Abstract: Microelectronic systems and components having integrated heat dissipation posts are disclosed, as are methods for fabricating such microelectronic systems and components. In various embodiments, the microelectronic system includes a substrate having a frontside, a socket cavity, and inner cavity sidewalls defining the socket cavity. A microelectronic component is seated on the frontside of the substrate such that a heat dissipation post, which projects from the microelectronic component, is received in the socket cavity and separated from the inner cavity sidewalls by a peripheral clearance. The microelectronic system further includes a bond layer contacting the inner cavity sidewalls, contacting an outer peripheral portion of the heat dissipation post, and at least partially filling the peripheral clearance.