Abstract:
One example discloses a device for electromagnetic structural characterization, including: a controller having an electromagnetic transmitter output and a communications interface; wherein the controller is configured to send a signal over the electromagnetic transmitter output that causes an electromagnetic transmitter to generate a first electrical field (E1) and a first magnetic field (H1); wherein the controller configured to receive over the communications interface a second electric field (E2) and a second magnetic field (H2) received by an electromagnetic receiver; wherein the first electrical field and the first magnetic field correspond to when the electromagnetic transmitter is at a first location proximate to a structure and the second electrical field and the second magnetic field correspond to when the electromagnetic receiver is at a second location proximate to the structure; and wherein the controller is configured to calculate an impedance based on the electric and magnetic fields interacting with the structure.
Abstract:
One example discloses a liquid exposure sensing device, including: a first sensor configured to be coupled to a reference material; wherein the first sensor configured to generate a first signal in response to either a liquid phase and/or vapor phase of a substance passing through the reference material; a second sensor configured to be coupled to an exposed material; wherein the second sensor configured to generate a second signal in response to the liquid phase and/or vapor phase of the substance passing through the exposed material; and a controller coupled to the first and second sensors and configured to generate a liquid detection signal in response to a time delay between the first signal and the second signal that exceeds a threshold time delay.
Abstract:
Disclosed is an integrated circuit comprising a substrate (10) carrying plurality of circuit elements (20); a metallization stack (30) over said substrate for providing interconnections to at least some of said circuit elements, the metallization stack comprising a plurality of patterned metal layers (31) spatially separated from each other by respective electrically insulating layers (32), at least some of said electrically insulating layers comprising conductive portions (33) that electrically interconnect portions of adjacent metal layers, wherein at least one of the patterned metallization layers comprises a plurality of ion-sensitive electrodes (34), each ion-sensitive electrode being electrically connected to at least one of said circuit elements, a plurality of sample volumes (50) extending into said metallization stack, each sample volume terminating at one of said ion-sensitive electrodes; and an ion-sensitive layer lining at least the ion-sensitive electrodes in said sample volumes. A method of manufacturing such an IC is also disclosed.
Abstract:
One example discloses a first communications device, including: a first transceiver; a second transceiver; wherein the first transceiver is configured as responsive to a third transceiver in a second communications device; wherein the second transceiver is configured as responsive to a fourth transceiver in the second communications device; wherein the second transceiver has a lower-power state and a higher-power state; wherein the first and third transceivers communicate within a first distance at a first data-rate; wherein the second and fourth transceivers communicate within a second distance at a second data-rate; wherein the first distance is greater than the second distance; wherein the first data-rate is less than the second data-rate; and wherein the first communications device is configured to switch the second transceiver from the lower-power state to the higher-power state in response to the first transceiver first detecting a signal from the third transceiver in the second communications device.
Abstract:
There is provided a lateral flow immunoassay test device. The test device comprises a test strip. The test strip comprises a test membrane having a translucent section including a control zone and a test zone. The device is adapted to house the test strip such that at least the translucent section is exposable to ambient light. The device comprises a backing structure for backing the test strip which comprises a first optical detector for detecting ambient light which has passed through the test zone, and a second optical detector for detecting ambient light which has passed through the translucent section in a further zone outside of the test and control zones. Using the detector outputs an amount of analyte in a test liquid may be calculated.
Abstract:
One example discloses a substance detection device, including: a substrate configured to carry a substance; wherein the substrate has a length and a substance loss along the length of the substrate; a test region coupled to the substrate and configured to bond to at least a portion of the substance; a sensor coupled to the substrate at a fixed location along the length and having a sensing signal output; an integration circuit coupled to the sensor and configured to integrate, over a time interval, a signal from the sensing signal output; and a detection circuit coupled to the integration circuit and configured to output a substance detected signal if the integrated sensing signal output signal deviates from the substance loss corresponding to the fixed sensor location.
Abstract:
Disclosed is an integrated circuit comprising a substrate (10) carrying plurality of circuit elements (20); a metallization stack (30) over said substrate for providing interconnections to at least some of said circuit elements, the metallization stack comprising a plurality of patterned metal layers (31) spatially separated from each other by respective electrically insulating layers (32), at least some of said electrically insulating layers comprising conductive portions (33) that electrically interconnect portions of adjacent metal layers, wherein at least one of the patterned metallization layers comprises a plurality of ion-sensitive electrodes (34), each ion-sensitive electrode being electrically connected to at least one of said circuit elements, a plurality of sample volumes (50) extending into said metallization stack, each sample volume terminating at one of said ion-sensitive electrodes; and an ion-sensitive layer lining at least the ion-sensitive electrodes in said sample volumes. A method of manufacturing such an IC is also disclosed.
Abstract:
One example discloses a substance detection device, including: a substrate configured to carry a substance; wherein the substrate has a length and a substance loss along the length of the substrate; a test region coupled to the substrate and configured to bond to at least a portion of the substance; a sensor coupled to the substrate at a fixed location along the length and having a sensing signal output; an integration circuit coupled to the sensor and configured to integrate, over a time interval, a signal from the sensing signal output; and a detection circuit coupled to the integration circuit and configured to output a substance detected signal if the integrated sensing signal output signal deviates from the substance loss corresponding to the fixed sensor location.
Abstract:
There is provided a lateral flow immunoassay test device. The test device comprises a test strip. The test strip comprises a test membrane having a translucent section including a control zone and a test zone. The device is adapted to house the test strip such that at least the translucent section is exposable to ambient light. The device comprises a backing structure for backing the test strip which comprises a first optical detector for detecting ambient light which has passed through the test zone, and a second optical detector for detecting ambient light which has passed through the translucent section in a further zone outside of the test and control zones. Using the detector outputs an amount of analyte in a test liquid may be calculated.
Abstract:
Embodiments of a buffer device, an electronic system, and a method for operating a buffer device are disclosed. In an embodiment, a buffer device includes buffer bus connections, a peripheral bus interface connectable to a peripheral bus, a buffer memory module, and a buffer memory controller connected between the buffer bus connections, the peripheral bus interface, and the buffer memory module. Each of the buffer bus connections is connectable to a respective peripheral device. The buffer memory module comprises memory segments corresponding to the peripheral devices. The buffer memory controller is configured to control data communications between the buffer bus connections, the peripheral bus interface, and the buffer memory module.