公开(公告)号：US20210396511A1

公开(公告)日：2021-12-23

申请号：US17309318

申请日：2019-11-17

Applicant: NOVA MEASURING INSTRUMENTS LTD.

Inventor： Elad DOTAN ,  Moshe VANHOTSKER ,  Shimon YALOV ,  Valery DEICH ,  Roi RINGEL ,  Beni SHULMAN ,  Yossi BAR ON ,  Shahar BASSON

IPC: G01B11/02 ,  G01B5/00 ,  G01N21/956

Abstract: A measurement system is presented configured for integration with a processing equipment for applying optical measurements to a structure. The measurement system comprises: a support assembly for holding a structure under measurements in a measurement plane, configured and operable for rotation in a plane parallel to the measurement plane and for movement along a first lateral axis in said measurement plane; an optical system defining illumination and collection light channels of normal and oblique optical schemes and comprising an optical head comprising at least three lens units located in the illumination and collection channels; a holder assembly comprising: a support unit for carrying the optical head, and a guiding unit for guiding a sliding movement of the support unit along a path extending along a second lateral axis perpendicular to said first lateral axis; and an optical window arrangement comprising at least three optical windows made in a faceplate located between the optical head at a certain distance from the measurement plane. The optical windows are aligned with the illumination and collection channels for, respectively, propagation of illuminating light from the optical head and propagation of light returned from an illuminated region to the optical head, in accordance with the normal and oblique optical schemes.

公开(公告)号：US20170138868A1

公开(公告)日：2017-05-18

申请号：US15325877

申请日：2015-07-14

Applicant: NOVA MEASURING INSTRUMENTS LTD.

Inventor： Gilad BARAK ,  Elad DOTAN ,  Alon BELLELI

IPC: G01N21/956 ,  G01N21/88 ,  G06T7/00 ,  G01N21/95

CPC classification number: G01N21/95692 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/9501 ,  G01N21/95607 ,  G01N2021/8822 ,  G01N2021/8825 ,  G01N2021/8848 ,  G06T7/0004 ,  G06T7/0008 ,  G06T7/001 ,  G06T7/136 ,  G06T2207/10056 ,  G06T2207/30148

Abstract: An inspection system and method are presented for inspecting structures having a pattern formed by an array of elongated grooves having high aspect-ratio geometry, such as semiconductor wafers formed with vias. The inspection system comprises an imaging system and a control unit. The imaging system is configured and operable for imaging the structure with a dark-field imaging scheme and generating a dark-field image. The control unit comprises an analyzer module for analyzing pixels brightness in the dark-field image for identifying a defective groove, being a groove characterized by pixels brightness in the dark-field image lower than nominal brightness by a predetermined factor.