公开(公告)号：US20170138868A1

公开(公告)日：2017-05-18

申请号：US15325877

申请日：2015-07-14

Applicant: NOVA MEASURING INSTRUMENTS LTD.

Inventor： Gilad BARAK ,  Elad DOTAN ,  Alon BELLELI

IPC: G01N21/956 ,  G01N21/88 ,  G06T7/00 ,  G01N21/95

CPC classification number: G01N21/95692 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/9501 ,  G01N21/95607 ,  G01N2021/8822 ,  G01N2021/8825 ,  G01N2021/8848 ,  G06T7/0004 ,  G06T7/0008 ,  G06T7/001 ,  G06T7/136 ,  G06T2207/10056 ,  G06T2207/30148

Abstract: An inspection system and method are presented for inspecting structures having a pattern formed by an array of elongated grooves having high aspect-ratio geometry, such as semiconductor wafers formed with vias. The inspection system comprises an imaging system and a control unit. The imaging system is configured and operable for imaging the structure with a dark-field imaging scheme and generating a dark-field image. The control unit comprises an analyzer module for analyzing pixels brightness in the dark-field image for identifying a defective groove, being a groove characterized by pixels brightness in the dark-field image lower than nominal brightness by a predetermined factor.