公开(公告)号：US20160010215A1

公开(公告)日：2016-01-14

申请号：US14428189

申请日：2013-09-12

Applicant: NISSAN CHEMICAL INDUSTRIES, LTD.

Inventor： Daigo SAITO ,  Keisuke KOJIMA

IPC: C23C18/31 ,  C23C18/16

CPC classification number: C23C18/31 ,  C23C18/165 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/206 ,  C23C18/2066 ,  C23C18/30

Abstract: It is an object of the present invention to provide a novel primer for use in pretreatment steps in electroless plating which is environmentally friendly, by which process is easy with fewer steps, and which can realize cost reduction. A primer for forming a metal plating film on a base material by electroless plating, the primer including: a hyperbranched polymer having an ammonium group at a molecular terminal and a weight-average molecular weight of 500 to 5,000,000; a metal fine particle; and an alkoxysilane.

Abstract translation: 本发明的目的是提供一种用于化学镀中的预处理步骤的新型底漆，其是环保的，通过该步骤，步骤更简单，并且可以实现成本降低。 一种用于通过化学镀在基材上形成金属电镀膜的底漆，所述底漆包括：在分子末端具有铵基并且重均分子量为500至5,000,000的超支化聚合物; 金属微粒; 和烷氧基硅烷。

公开(公告)号：US20170260400A1

公开(公告)日：2017-09-14

申请号：US15508972

申请日：2015-09-07

Applicant: NISSAN CHEMICAL INDUSTRIES, LTD.

Inventor： Yudai MORIMOTO ,  Keisuke KOJIMA

IPC: C09D4/06 ,  C23C18/16 ,  C08F257/02 ,  C23C18/20 ,  C09D5/00 ,  C08F8/32

CPC classification number: C09D4/06 ,  C08F2/44 ,  C08F2/50 ,  C08F8/30 ,  C08F8/32 ,  C08F257/02 ,  C09D5/00 ,  C09D5/002 ,  C09D201/02 ,  C23C18/1641 ,  C23C18/18 ,  C23C18/2086 ,  G03F7/004 ,  G03F7/027 ,  G03F7/033

Abstract: A new primer for electroless plating for use in the pretreatment process for electroless plating, which is environmentally friendly, can be easily treated in fewer process steps, and can provide sufficient adhesion to the substrate. A photocurable primer for forming a metal plating film on a base material through an electroless plating process, having (a) a hyperbranched polymer having an ammonium group at a molecular terminal and a weight average molecular weight of 1,000 to 5,000,000, (b) metal fine particles, (c) a polymerizable compound having a (meth)acryloyl group, and (d) a photopolymerization initiator.

公开(公告)号：US20190359771A1

公开(公告)日：2019-11-28

申请号：US16533304

申请日：2019-08-06

Applicant: NISSAN CHEMICAL INDUSTRIES, LTD. ,  KYUSHU UNIVERSITY

Inventor： Keisuke KOJIMA ,  Akihiro TANAKA ,  Keisuke ODOI ,  Hideo NAGASHIMA ,  Takashi SUE

IPC: C08G73/00 ,  B01J31/02 ,  B01F17/00 ,  C08K3/08 ,  H01M4/86 ,  B01J31/06

Abstract: A complex that includes a metal fine particle dispersant including a branched polymer compound having an ammonium group and having a weight average molecular weight of 500 to 5,000,000; and a metal fine particle, wherein the metal fine particle includes platinum (Pt) or palladium (Pd), the metal fine particle dispersant includes a branched polymer compound of Formula (1):

公开(公告)号：US20170240764A1

公开(公告)日：2017-08-24

申请号：US15508969

申请日：2015-09-07

Applicant: NISSAN CHEMICAL INDUSTRIES, LTD.

Inventor： Keisuke KOJIMA

IPC: C09D151/00 ,  G03F7/031 ,  G03F7/033 ,  C23C18/31 ,  G03F7/20 ,  G03F7/26 ,  G03F7/40 ,  C09D4/00 ,  G03F7/16

CPC classification number: C09D151/003 ,  C08F8/30 ,  C08F220/20 ,  C09D4/00 ,  C23C18/31 ,  G03F7/0047 ,  G03F7/031 ,  G03F7/033 ,  G03F7/11 ,  G03F7/162 ,  G03F7/2004 ,  G03F7/26 ,  G03F7/40 ,  G03F7/405

Abstract: A new primer for electroless plating for use in a pretreatment process of electroless plating, is environmentally friendly, can be treated in fewer process steps, and can facilitate formation of fine-pitch wiring with a width of a few μm by photolithography. A photosensitive primer for forming a metal plating film on a base material through an electroless plating process has (a) a hyperbranched polymer having an ammonium group at a molecular terminal and a weight-average molecular weight of 1,000 to 5,000,000, (b) metal fine particles, (c) a polymerizable compound having three or more (meth)acryloyl groups in a molecule, and (d) a photopolymerization initiator.

公开(公告)号：US20140288264A1

公开(公告)日：2014-09-25

申请号：US14218469

申请日：2014-03-18

Applicant: KYUSHU UNIVERSITY ,  NISSAN CHEMICAL INDUSTRIES, LTD.

Inventor： Keisuke KOJIMA ,  Akihiro TANAKA ,  Keisuke ODOI ,  Hideo NAGASHIMA ,  Takashi SUE

IPC: C08G73/00

CPC classification number: C08G73/00 ,  B01F17/0007 ,  B01F17/005 ,  B01J31/0239 ,  B01J31/06 ,  B01J2231/643 ,  B01J2231/645 ,  B01J2531/828 ,  C08K3/08 ,  H01M4/8668 ,  H01M4/90

Abstract: A metal fine particle dispersant for forming a disperse system of metal fine particles, the metal fine particle dispersant having a branched polymer compound having an ammonium group and having a weight average molecular weight of 500 to 5,000,000.

Abstract translation: 一种用于形成金属微粒分散系的金属微粒分散剂，该金属微粒分散剂具有具有铵基的分支聚合物化合物，其重均分子量为500至5,000,000。