摘要:
Provided is an epitaxial substrate for a semiconductor device, which has excellent schottky contact characteristics that are stable over time. The epitaxial substrate for a semiconductor device includes a base substrate, a channel layer formed of a first group III nitride containing at least Ga and having a composition of Inx1Aly1Gaz1N (x1+y1+z1=1), and a barrier layer formed of a second group III nitride containing at least In and Al and having a composition of Inx2Aly2Gaz2N (x2+y2+z2=1), wherein the barrier layer has tensile strains in an in-plane direction, and pits are formed on a surface of the barrier layer at a surface density of 5×107/cm2 or more and 1×109/cm2 or less.
摘要:
Provided is an epitaxial substrate for use in a semiconductor element, having excellent characteristics and capable of suitably suppressing diffusion of elements from a cap layer. An epitaxial substrate for use in a semiconductor element, in which a group of group-III nitride layers are laminated on a base substrate such that a (0001) crystal plane of the group of group-III nitride layers is substantially in parallel with a substrate surface of the base substrate, includes: a channel layer made of a first group-III nitride having a composition of Inx1Aly1Gaz1N (x1+y1+z1=1, z1>0); a barrier layer made of a second group-III nitride having a composition of Inx2Aly2N (x2+y2=1, x2>0, y2>0); an anti-diffusion layer made of AlN and having a thickness of 3 nm or more; and a cap layer made of a third group-III nitride having a composition of Inx3Aly3Gaz3N (x3+y3+z3=1, z3>0).
摘要:
Provided is a crack-free epitaxial substrate having excellent breakdown voltage properties in which a silicon substrate is used as a base substrate thereof. The epitaxial substrate includes: a (111) single crystal Si substrate and a buffer layer including a plurality of composition modulation layers each formed of a first composition layer made of AlN and a second composition layer made of AlxGa1-xN (0≦x x(n) is satisfied, where n represents the number of laminations of each of the first and the second composition layer, and x(i) represents the value of x in i-th one of the second composition layers as counted from the base substrate side. Each of the second composition layers is formed so as to be in a coherent state relative to the first composition layer.
摘要翻译:本发明提供一种无硅外延基板,其具有优良的击穿电压特性,其中使用硅基板作为其基底。 外延衬底包括:(111)单晶Si衬底和包括多个组成调制层的缓冲层,每个组成调制层由由AlN制成的第一组成层和由Al x Ga 1-x N(0& )交替层压。 x(1)≥x(2)≥的关系。 。 。 ≧x(n-1)≥x(n)和x(1)> x(n),其中n表示第一和第二组合物层中的每一个的叠层数,x(i) 从基底侧计数的第i组合物层中的第i个的x值。 每个第二组合物层相对于第一组合物层形成为相干状态。
摘要:
A semiconductor device having small leakage current and high breakdown voltage during reverse blocking, small on-state resistance and large output current at forward conduction, short reverse recovery time at shutoff, and high peak surge current value is provided. An n-type layer is made of a group-III nitride, and a p-type layer is made of a group-IV semiconductor material having a smaller band gap than the group-III nitride. The energy level at the top of the valence band of the n-type layer is lower than the energy level at the top of the valence band of the p-type layer, so that a P-N junction semiconductor device satisfying the above requirements is obtained. Further, a combined structure of P-N junction and Schottky junction by additionally providing an anode electrode to be in Schottky contact with the n-type layer also achieves the effect of decreasing voltage at the rising edge of current resulting from the Schottky junction.
摘要:
Provided is a crack-free epitaxial substrate having excellent breakdown voltage properties in which a silicon substrate is used as a base substrate thereof. The epitaxial substrate includes: a (111) single crystal Si substrate and a buffer layer including a composition modulation layer that is formed of a first composition layer made of AlN and a second composition layer made of AlxGa1-xN (0≦x x(n) is satisfied, where n represents the number of laminations of each of the first and the second composition layer (n is a natural number equal to or greater than two), and x(i) represents the value of x in i-th one of the second composition layers as counted from the base substrate side, to thereby cause a compressive strain to exist such that the compressive strain increases in a portion more distant from the base substrate.
摘要翻译:本发明提供一种无硅外延基板,其具有优良的击穿电压特性,其中使用硅基板作为其基底。 外延衬底包括:(111)单晶Si衬底和包括由AlN制成的第一组成层和由Al x Ga 1-x N(0< 1; x 1)制成的第二组成层形成的组成调制层的缓冲层; 交替层压。 x(1)≥x(2)≥的关系。 。 。 ≧x(n-1)≥x(n)和x(1)> x(n),其中n表示第一和第二组合物层中的每一个的叠层数(n是等于 或大于2),并且x(i)表示从基底侧计数的第i组合物层中的x的值,从而导致压缩应变存在,使得压缩应变在 部分比基底更远。
摘要:
Provided is a crack-free epitaxial substrate having a small amount of dislocations in which a silicon substrate is used as a base substrate. An epitaxial substrate includes a substrate made of (111) single crystal silicon and a base layer group in which a plurality of base layers are laminated. Each of the plurality of base layers includes a first group-III nitride layer made of AlN and a second group-III nitride layer made of AlyyGazzN formed on the first group-III nitride layer. The first group-III nitride layer has many crystal defects. An interface between the first and second group-III nitride layers is a three-dimensional concavo-convex surface. In the base layer other than the base layer formed immediately above the base substrate, the first group-III nitride layer has a thickness of 50 nm or more and 100 nm or less and the second group-III nitride layer satisfies 0≦yy≦0.2.
摘要:
Provided is a crack-free epitaxial substrate having a small amount of warping, in which a silicon substrate is used as a base substrate. The epitaxial substrate includes: a (111) single crystal Si substrate and a buffer layer formed of a plurality of lamination units being continuously laminated. The lamination unit includes: a composition modulation layer formed of a first and a second unit layer having different compositions being alternately and repeatedly laminated such that a compressive strain exists therein; a termination layer formed on an uppermost portion of the composition modulation layer, the termination layer acting to maintain the compressive strain existing in the composition modulation layer; and a strain reinforcing layer formed on the termination layer, the strain reinforcing layer acting to enhance the compressive strain existing in the composition modulation layer.
摘要:
Provided is a semiconductor device of normally-off operation type having a low on-resistance. An epitaxial substrate for it includes: a base substrate; a channel layer made of a first group-III nitride having a composition of Inx1Aly1Gaz1N at least containing Al and Ga and x1=0 and 0≦y1≦0.3; and a barrier layer made of a second group-III nitride having a composition of Inx2Aly2Gaz2N at least containing In and Al. The composition of the second group-III nitride is, in a ternary phase diagram for InN, AlN, and GaN, in a certain range that is determined in accordance with the composition of the first group-III nitride. The barrier layer has a thickness of 3 nm or less. A low-crystallinity insulating layer is further formed on the barrier layer. The low-crystallinity insulating layer is made of silicon nitride and has a thickness of 3 nm or less.
摘要翻译:提供具有低导通电阻的常关操作型半导体器件。 其外延衬底包括:基底; 至少包含Al和Ga以及x1 = 0和0 @ y1 @ 0.3的具有Inx1Aly1Gaz1N组成的第一III族氮化物的沟道层; 以及由具有至少含有In和Al的In x Al 2 Al 2 Ga 2 N 3的组成的第二III族氮化物制成的阻挡层。 在根据第一III族氮化物的组成确定的一定范围内,InN,AlN和GaN的三元相图中的第二III族氮化物的组成。 阻挡层的厚度为3nm以下。 在阻挡层上进一步形成低结晶度绝缘层。 低结晶度绝缘层由氮化硅制成,厚度为3nm以下。
摘要:
Provided is a crack-free epitaxial substrate having excellent breakdown voltage properties in which a silicon substrate is used as a base. The epitaxial substrate includes a (111) single crystal Si substrate and a buffer layer including a plurality of first lamination units. Each of those units includes a composition modulation layer formed of a first composition layer made of AlN and a second composition layer made of AlxGa1-xN being alternately laminated, and a first intermediate layer made of AlyGa1-yN (0≦y≦1). The relationship of x(1)≧x(2)≧ . . . ≧x(n−1)≧x(n) and x(1)≧x(n) is satisfied, where n represents the number of laminations of each of the first and second composition layers, and x(i) represents the value of x in i-th one of the second composition layers as counted from the base substrate side. The second composition layer is coherent to the first composition layer, and the first intermediate layer is coherent to the composition modulation layer.
摘要翻译:本发明提供一种无硅外延基板,其以硅基板为基体,具有优异的击穿电压特性。 外延衬底包括(111)单晶Si衬底和包括多个第一层压单元的缓冲层。 这些单元中的每一个包括由AlN制成的第一组合物层和由Al x Ga 1-x N交替层压的第二组合物层和由Al y Ga 1-y N(0< 1,y&n 1; 1)制成的第一中间层形成的组成调制层。 x(1)≥x(2)≥的关系。 。 。 ≧x(n-1)≥X(n)和x(1)≧x(n),其中n表示第一和第二组合物层中的每一个的叠层数,x(i) 从基底侧计数的第二组合物层的第i个中的x。 第二组合物层与第一组合物层相干,第一中间层与组成调制层相干。
摘要:
Provided is a crack-free epitaxial substrate. The epitaxial substrate includes: a (111) single crystal Si substrate and a buffer layer formed of a first and a second lamination unit being alternately laminated such that each of an uppermost and a lowermost portion of the buffer layer is formed of the first lamination unit. The first lamination unit is formed of a first and a second composition layer having different compositions being alternately laminated so as to increase the thickness of the second composition layer in a portion more distant from the base substrate side, to thereby cause a compressive strain to exist in the first lamination unit such that it increases in a portion more distant from the base substrate. The second lamination unit is formed as an intermediate layer that is substantially strain-free and formed with a thickness of 15 nm or more and 150 nm or less.