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公开(公告)号：US11569787B2
公开(公告)日：2023-01-31
申请号：US17211072
申请日：2021-03-24
摘要： Provided is a power amplification module that includes: a first transistor, a first signal being inputted to a base thereof; a second transistor, the first signal being inputted to a base thereof and a collector thereof being connected to a collector of the first transistor; a first resistor, a first bias current being supplied to one end thereof and another end thereof being connected to the base of the first transistor; a second resistor, one end thereof being connected to the one end of the first resistor and another end thereof being connected to the base of the second transistor; and a third resistor, a second bias current being supplied to one end thereof and another end thereof being connected to the base of the second transistor.
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公开(公告)号：US11388612B2
公开(公告)日：2022-07-12
申请号：US17142430
申请日：2021-01-06
IPC分类号： H04W16/26 , H04B17/318 , H01Q1/27 , H04W88/04
摘要： A communication terminal device is a glasses-type communication terminal device having an optically transmissive display mounted thereon. The communication terminal device includes first and second radio-frequency modules that perform radio-frequency signal processing and a baseband module that is connected to the first and second radio-frequency modules via communication lines so as to be communicable and that performs baseband signal processing. The first and second radio-frequency modules are selectively switched by the baseband module to perform a reception operation. When the first radio-frequency module performs the reception operation, a reception signal received by the first radio-frequency module is retransmitted from the second radio-frequency module.
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公开(公告)号：US11310908B2
公开(公告)日：2022-04-19
申请号：US16902062
申请日：2020-06-15
发明人： Masashi Omuro , Yu Ishiwata , Yasuhisa Yamamoto
摘要： A power supply circuit board includes a substrate, a first line that is provided on a first main surface of the substrate and that has a land, a second line that is provided on the first main surface of the substrate and that has a land, an inductor that is connected to the land of the first line and the land of the second line and that is made of a ferrite material, and an open stub that is connected to at least one of the first line and the second line.
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公开(公告)号：US10965325B2
公开(公告)日：2021-03-30
申请号：US16285584
申请日：2019-02-26
摘要： A communication unit includes the following elements. A first transmit circuit outputs a first signal or a second signal from a first input signal. A first amplifier amplifies the first signal and outputs a first amplified signal. A first signal generating circuit generates a third signal having a frequency higher than a frequency of the second signal, based on the second signal and a first reference signal. A first filter circuit receives the third signal and allows one of a frequency component representing a sum of the frequency of the second signal and a frequency of the first reference signal and a frequency component representing a difference therebetween to pass through the first filter circuit and attenuates the other one of the frequency components. A second amplifier amplifies the third signal output from the first filter circuit and outputs a second amplified signal.
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公开(公告)号：US10957617B2
公开(公告)日：2021-03-23
申请号：US16374674
申请日：2019-04-03
发明人： Masao Kondo , Isao Obu , Yasunari Umemoto , Yasuhisa Yamamoto , Masahiro Shibata , Takayuki Tsutsui
IPC分类号： H01L23/367 , H01L23/498 , H01L23/31 , H01L23/00 , H01L23/48 , H03F1/30 , H03F3/68
摘要： A semiconductor chip includes an active element on a first surface of a substrate. A heat-conductive film having a higher thermal conductivity than the substrate is disposed at a position different from a position of the active element. An insulating film covering the active element and heat-conductive film is disposed on the first surface. A bump electrically connected to the heat-conductive film is disposed on the insulating film. A via-hole extends from a second surface opposite to the first surface to the heat-conductive film. A heat-conductive member having a higher thermal conductivity than the substrate is continuously disposed from a region of the second surface overlapping the active element in plan view to an inner surface of the via-hole. The bump is connected to a land of a printed circuit board facing the first surface. The semiconductor chip is sealed with a resin.
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公开(公告)号：US10734952B2
公开(公告)日：2020-08-04
申请号：US16371349
申请日：2019-04-01
发明人： Shota Ishihara , Yasuhisa Yamamoto
摘要： A power amplifier module includes a power amplifier circuit and a control IC. The power amplifier circuit includes a bipolar transistor that amplifies power of an RF signal and outputs an amplified signal. The control IC includes an FET, which serves as a bias circuit that supplies a bias signal to the bipolar transistor. The FET is operable at a threshold voltage lower than that of the bipolar transistor, thereby making it possible to decrease the operating voltage of the power amplifier module.
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公开(公告)号：US10256849B2
公开(公告)日：2019-04-09
申请号：US15490073
申请日：2017-04-18
摘要： A communication unit includes the following elements. A first transmit circuit outputs a first signal or a second signal from a first input signal. A first amplifier amplifies the first signal and outputs a first amplified signal. A first signal generating circuit generates a third signal having a frequency higher than a frequency of the second signal, based on the second signal and a first reference signal. A first filter circuit receives the third signal and allows one of a frequency component representing a sum of the frequency of the second signal and a frequency of the first reference signal and a frequency component representing a difference therebetween to pass through the first filter circuit and attenuates the other one of the frequency components. A second amplifier amplifies the third signal output from the first filter circuit and outputs a second amplified signal.
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公开(公告)号：US11942685B2
公开(公告)日：2024-03-26
申请号：US17673798
申请日：2022-02-17
发明人： Hideki Ueda , Yasuhisa Yamamoto , Masashi Omuro , Kazunari Kawahata , Satoshi Tanaka , Ryuken Mizunuma
摘要： A first antenna, a second antenna, and a waveguide structure are housed in a single cabinet. An operating frequency of the second antenna is higher than an operating frequency of the first antenna. The second antenna is an array antenna including a plurality of radiating elements. The waveguide structure is present outside a range of a half-value angle of a main beam as viewed from the first antenna, includes a unit waveguide disposed in a route of a radio wave received by the second antenna, and further attenuates a radio wave with the operating frequency of the first antenna.
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公开(公告)号：US11368131B2
公开(公告)日：2022-06-21
申请号：US17083037
申请日：2020-10-28
摘要： A power amplifier circuit amplifies a radio-frequency signal in a transmit frequency band. The power amplifier circuit includes an amplifier, a bias circuit, and an impedance circuit. The amplifier amplifies power of a radio-frequency signal and outputs an amplified signal. The impedance circuit is connected between a signal input terminal of the amplifier and a bias-current output terminal of the bias circuit and has frequency characteristics in which attenuation is obtained in the transmit frequency band. The impedance circuit includes first and second impedance circuits. The first impedance circuit is connected to the signal input terminal. The second impedance circuit is connected between the first impedance circuit and the bias-current output terminal.
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公开(公告)号：US11264952B2
公开(公告)日：2022-03-01
申请号：US17024245
申请日：2020-09-17
摘要： Provided is a power amplification circuit that includes: an amplifier that amplifies an input signal and outputs an amplified signal; a first bias circuit that supplies a first bias current or voltage to the amplifier; a second bias circuit that supplies a second bias current or voltage to the amplifier; a first control circuit that controls the first bias current or voltage; and a second control circuit that controls the second bias current or voltage. The current supplying capacity of the first bias circuit is different from the current supplying capacity of the second bias circuit.
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