公开(公告)号：US20240359445A1

公开(公告)日：2024-10-31

申请号：US18766841

申请日：2024-07-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kosuke NISHIO ,  Takayuki SHIMAMURA ,  Sunao FUKUTAKE

IPC: B32B27/36 ,  B32B3/26 ,  B32B7/05 ,  B32B7/08 ,  B32B27/08 ,  B32B33/00 ,  G02F1/00 ,  G02F1/1333 ,  G02F1/1345

CPC classification number: B32B27/36 ,  B32B3/266 ,  B32B7/05 ,  B32B7/08 ,  B32B27/08 ,  B32B33/00 ,  G02F1/0045 ,  G02F1/133365 ,  G02F1/13452 ,  B32B2305/55 ,  B32B2307/202 ,  B32B2307/704 ,  B32B2307/724 ,  B32B2367/00

Abstract: A multilayer body includes liquid crystal polymer layers including first, second, and third liquid crystal polymer layers stacked on each other in a Z-axis direction. The first liquid crystal polymer layer is located farther toward a positive side of the Z axis than the rest of the plural liquid crystal polymer layers. The third liquid crystal polymer layer is located farther toward a negative side of the Z axis than the rest of the plural liquid crystal polymer layers. At least one first conductive layer is located between the first liquid crystal polymer layer and the second liquid crystal polymer layer and/or between the second liquid crystal polymer layer and the third liquid crystal polymer layer. A gas permeability amount of the first liquid crystal polymer layer per unit volume and that of the third liquid crystal polymer layer are greater than that of the second liquid crystal polymer layer.

公开(公告)号：US20230145378A1

公开(公告)日：2023-05-11

申请号：US18096613

申请日：2023-01-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takayuki SHIMAMURA ,  Tomohiro FURUMURA ,  Sunao FUKUTAKE

IPC: H05K1/03 ,  H05K1/02 ,  B32B7/02 ,  B32B15/20 ,  B32B27/36 ,  B32B27/32 ,  B32B27/28 ,  B32B27/20 ,  B32B27/08 ,  B32B15/085

CPC classification number: H05K1/036 ,  H05K1/0373 ,  H05K1/0237 ,  B32B7/02 ,  B32B15/20 ,  B32B27/36 ,  B32B27/322 ,  B32B27/281 ,  B32B27/20 ,  B32B27/08 ,  B32B15/085 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/0209 ,  B32B2305/55 ,  B32B2307/206 ,  B32B2307/202 ,  B32B2457/08 ,  B32B2270/00 ,  B32B2305/30

Abstract: A circuit board includes, in order in a stacking direction, a first insulating layer, a second insulating layer in contact with the first insulating layer, and a conductor layer, the first insulating layer includes a liquid crystal polymer as a main component, and the second insulating layer includes a fluoropolymer including at least one of polytetrafluoroethylene and a perfluoroalkoxy alkane and includes a polyimide resin with an imidization rate of about 90% or more, the polyimide resin being present in an amount of about 0.5 parts or more by weight and less than about 20 parts by weight per 100 parts by weight of the fluoropolymer.

公开(公告)号：US20230118261A1

公开(公告)日：2023-04-20

申请号：US18082619

申请日：2022-12-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takayuki SHIMAMURA ,  Yusuke KAMITSUBO ,  Ryutatsu MIZUKAMI ,  Sunao FUKUTAKE

IPC: H05K3/46 ,  H05K1/02 ,  H05K3/40

Abstract: A multilayer substrate includes a resin multilayer body including, in a lamination direction, first and second laminate portions respectively including first and second thermoplastic resin layers, and a first interlayer connection conductor extending through the first thermoplastic resin layer. A storage elastic modulus of the first thermoplastic resin layer is lower than that of the second thermoplastic resin layer at a measurement temperature equal to or higher than a minimum melting point among melting points of metallic elements included in the first interlayer connection conductors and equal to or lower than melting points of the first thermoplastic resin layer and the second thermoplastic resin layer.

公开(公告)号：US20240365477A1

公开(公告)日：2024-10-31

申请号：US18765420

申请日：2024-07-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kosuke NISHIO ,  Takayuki SHIMAMURA

IPC: H05K3/46 ,  H05K1/02

CPC classification number: H05K3/4605 ,  H05K1/0298 ,  H05K3/4652

Abstract: An interlayer connection conductor is inside a through-hole extending through first and second insulator layers in a Z-axis direction. A first conductor layer is on a negative main surface of an insulator layer farther in a negative direction of the Z-axis than the second insulator layer, and in contact with an end portion of the interlayer connection conductor in the negative direction of the Z-axis. A second conductor layer is on a positive main surface of the second insulator layer and in contact with an end portion of the interlayer connection conductor in a positive direction of the Z-axis. A surface roughness of a portion in the second insulator layer inside the through-hole is larger than a surface roughness of a portion in the first insulator layer inside the through-hole. No conductor layer in contact with the interlayer connection conductor is provided between the first and second insulator layers.