公开(公告)号：US5305947A

公开(公告)日：1994-04-26

申请号：US87073

申请日：1993-07-07

申请人： Mitsuo Osada ,  Kenichiro Kohmoto

发明人： Mitsuo Osada ,  Kenichiro Kohmoto

IPC分类号： B22F5/00 ,  B22F3/11 ,  B22F7/08 ,  H01L23/14 ,  H01L23/373 ,  H01L21/48

CPC分类号： H01L23/3736 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195

摘要： A method for manufacturing heat-radiative substrates on which semiconductor devices such as ICs and transistors are mounted and packages using the substrates, wherein a plurality of CuW or CuMo composite materials obtained by the infiltration method or the mixed powder sintering method are joined together with Cu interposed therebetween. Accordingly, the remaining empty holes within the CuW or CuMo materials are filled sufficiently with Cu, allowing high-quality packages having a successful thermal characteristic to be obtained.

摘要翻译： 一种用于制造其上安装诸如IC和晶体管的半导体器件的热辐射基板的方法和使用该基板的封装，其中通过浸渗法或混合粉末烧结方法获得的多个CuW或CuMo复合材料与Cu 插入其间。 因此，CuW或CuMo材料中的剩余的空孔充满了Cu填充，从而获得具有成功的热特性的高质量封装。

公开(公告)号：US5451817A

公开(公告)日：1995-09-19

申请号：US181313

申请日：1994-01-13

申请人： Mitsuo Osada ,  Kenichiro Kohmoto

发明人： Mitsuo Osada ,  Kenichiro Kohmoto

IPC分类号： B22F5/00 ,  B22F3/11 ,  B22F7/08 ,  H01L23/14 ,  H01L23/373 ,  H01L23/58 ,  G01T1/24 ,  H01L29/66

CPC分类号： H01L23/3736 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195

摘要： A method for manufacturing heat-radiative substrates on which semiconductor devices such as ICs and transistors are mounted and packages using the substrates, wherein a plurality of CuW or CuMo composite materials obtained by the infiltration method or the mixed powder sintering method are joined together with Cu interposed therebetween. Accordingly, the remaining empty holes within the CuW or CuMo materials are filled sufficiently with Cu, allowing high-quality packages having a successful thermal characteristic to be obtained.

摘要翻译： 一种用于制造其上安装诸如IC和晶体管的半导体器件的热辐射基板的方法和使用该基板的封装，其中通过浸渗法或混合粉末烧结方法获得的多个CuW或CuMo复合材料与Cu 插入其间。 因此，CuW或CuMo材料中的剩余的空孔充满了Cu填充，从而获得具有成功的热特性的高质量封装。

公开(公告)号：US5481136A

公开(公告)日：1996-01-02

申请号：US420901

申请日：1995-04-11

申请人： Kenichiro Kohmoto ,  Mitsuo Osada

发明人： Kenichiro Kohmoto ,  Mitsuo Osada

IPC分类号： H01L23/367 ,  H01L23/34 ,  H01L23/52

CPC分类号： H01L23/3677 ,  H01L2224/32188 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195

摘要： A semiconductor-mounting heat-sink base for use with a plastic package or flexible printed wiring board which eliminates the possibility of semiconductor or package reliability being adversely affected due to a difference in thermal expansion coefficient between the heat sink base and the semiconductor or plastic package. The heat-sink base has a semiconductor-mounting portion comprising a Cu--W or Cu--Mo composite alloy containing 5 to 25 wt. % of copper made by an infiltration process, and a portion adjacent to a plastic package which comprises a copper or copper alloy containing not less than 95% of copper.

摘要翻译： 一种与塑料封装或柔性印刷电路板一起使用的半导体安装散热器基座，其消除了由于散热器基座和半导体或塑料封装之间的热膨胀系数的差异而导致半导体或封装可靠性受到不利影响的可能性 。 散热器底座具有包含Cu-W或Cu-Mo复合合金的半导体安装部分，其含有5至25wt。 通过渗透方法制造的铜的百分比，以及与包含不少于95％铜的铜或铜合金的塑料封装相邻的部分。

公开(公告)号：US06900512B2

公开(公告)日：2005-05-31

申请号：US10373186

申请日：2003-02-26

申请人： Kenichiro Kohmoto ,  Takeshi Sekiguchi ,  Motoyoshi Tanaka ,  Makoto Ito

发明人： Kenichiro Kohmoto ,  Takeshi Sekiguchi ,  Motoyoshi Tanaka ,  Makoto Ito

IPC分类号： H01L31/02 ,  H01L27/14 ,  H01L29/06 ,  H01L31/00 ,  H01L31/0203 ,  H01L31/0232

CPC分类号： H01L25/167 ,  H01L31/0203 ,  H01L2224/05554 ,  H01L2224/48137 ,  H01L2224/49171 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00

摘要： This invention relates to a light-receiving module in which transmission impedance of lead terminals are matched by simple method. The module has a semiconductor light-receiving device, such as a photo diode, a plurality of lead terminals for transmitting an electrical signal converted by the semiconductor device, and a metal base with a plurality of through holes, the lead terminals passes therethrough. The diameter of the lead terminal for signal transmission is smaller as compared with that of other lead terminal and the diameter of the through holes is adjusted and filled by a sealant glass with a dielectric constant so as to match the impedance thereof.

摘要翻译： 本发明涉及通过简单的方法匹配引线端子的传输阻抗的光接收模块。 该模块具有诸如光电二极管的半导体光接收装置，用于传输由半导体器件转换的电信号的多个引线端子和具有多个通孔的金属基座，引线端子穿过其中。 用于信号传输的引线端子的直径与其它引线端子的直径相比较小，并且通孔的直径由具有介电常数的密封剂玻璃调节和填充以匹配其阻抗。

公开(公告)号：US06806547B2

公开(公告)日：2004-10-19

申请号：US10397839

申请日：2003-03-27

申请人： Kenichiro Kohmoto ,  Takeshi Sekiguchi ,  Makoto Ito

发明人： Kenichiro Kohmoto ,  Takeshi Sekiguchi ,  Makoto Ito

IPC分类号： H01L310203

CPC分类号： H01L31/0203 ,  G02B6/4263 ,  G02B6/4279 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/48137 ,  H01L2224/48465 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00

摘要： An optical module comprises a photodiode, an amplifying device, and a die capacitor. The die capacitor has at least a center pad, the photodiode is mounted thereon, and other pads on both side of the center pad. The die capacitor is mounted on a mounting surface of the module so as to locate the photodiode to be center of the surface. The amplifying device has a signal pad and a plural ground pad surrounding the signal pad. The signal pad is connected to the photodiode, while the ground pads are connected to the mounting surface through other pads on both side of the die capacitor.

摘要翻译： 光学模块包括光电二极管，放大器件和管芯电容器。 管芯电容器至少具有中心焊盘，光电二极管安装在其上，以及位于中心焊盘两侧的其它焊盘。 模具电容器安装在模块的安装表面上，以将光电二极管定位在表面的中心。 放大装置具有信号焊盘和围绕信号焊盘的多个接地焊盘。 信号焊盘连接到光电二极管，而接地焊盘通过芯片电容器两侧的其他焊盘连接到安装表面。

公开(公告)号：US06977423B2

公开(公告)日：2005-12-20

申请号：US11057217

申请日：2005-02-15

申请人： Kenichiro Kohmoto ,  Takeshi Sekiguchi ,  Motoyoshi Tanaka ,  Makoto Ito

发明人： Kenichiro Kohmoto ,  Takeshi Sekiguchi ,  Motoyoshi Tanaka ,  Makoto Ito

IPC分类号： H01L31/02 ,  H01L27/14 ,  H01L29/06 ,  H01L31/00 ,  H01L31/0203

CPC分类号： H01L25/167 ,  H01L31/0203 ,  H01L2224/05554 ,  H01L2224/48137 ,  H01L2224/49171 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00

摘要： This invention relates to a light-receiving module in which transmission impedance of lead terminals are matched by simple method. The module has a semiconductor light-receiving device, such as a photo diode, a plurality of lead terminals for transmitting an electrical signal converted by the semiconductor device, and a metal base with a plurality of through holes, the lead terminals passes therethrough. The diameter of the lead terminal for signal transmission is smaller as compared with that of other lead terminal and the diameter of the through holes is adjusted and filled by a sealant glass with a dielectric constant so as to match the impedance thereof.

摘要翻译： 本发明涉及通过简单的方法匹配引线端子的传输阻抗的光接收模块。 该模块具有诸如光电二极管的半导体光接收装置，用于传输由半导体器件转换的电信号的多个引线端子和具有多个通孔的金属基座，引线端子穿过其中。 用于信号传输的引线端子的直径与其它引线端子的直径相比较小，并且通孔的直径由具有介电常数的密封剂玻璃调节和填充以匹配其阻抗。

公开(公告)号：US20050156151A1

公开(公告)日：2005-07-21

申请号：US11057217

申请日：2005-02-15

申请人： Kenichiro Kohmoto ,  Takeshi Sekiguchi ,  Motoyoshi Tanaka ,  Makoto Ito

发明人： Kenichiro Kohmoto ,  Takeshi Sekiguchi ,  Motoyoshi Tanaka ,  Makoto Ito

IPC分类号： H01L31/02 ,  H01L27/14 ,  H01L29/06 ,  H01L31/00 ,  H01L31/0203

CPC分类号： H01L25/167 ,  H01L31/0203 ,  H01L2224/05554 ,  H01L2224/48137 ,  H01L2224/49171 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00

摘要： This invention relates to a light-receiving module in which transmission impedance of lead terminals are, matched by simple method. The module has a semiconductor light-receiving device, such as a photo diode, a plurality of lead terminals for transmitting an electrical signal converted by the semiconductor device, and a metal base with a plurality of through holes, the lead terminals passes therethrough. The diameter of the lead terminal for signal transmission is smaller as compared with that of other lead terminal and the diameter of the through holes is adjusted and filled by a sealant glass with a dielectric constant so as to match the impedance thereof.

摘要翻译： 本发明涉及通过简单的方法匹配引线端子的传输阻抗的光接收模块。 该模块具有诸如光电二极管的半导体光接收装置，用于传输由半导体器件转换的电信号的多个引线端子和具有多个通孔的金属基座，引线端子穿过其中。 用于信号传输的引线端子的直径与其它引线端子的直径相比较小，并且通孔的直径由具有介电常数的密封剂玻璃调节和填充以匹配其阻抗。