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公开(公告)号：US20200185359A1
公开(公告)日：2020-06-11
申请号：US16632029
申请日：2018-08-27
发明人： Junichi NAKASHIMA , Shota MORISAKI , Yoshiko TAMADA , Yasushi NAKAYAMA , Tetsu NEGISHI , Ryo TSUDA , Yukimasa HAYASHIDA , Ryutaro DATE
摘要： Gates of a plurality of semiconductor switching elements are electrically connected to a common gate control pattern by gate wires. Sources of the plurality of semiconductor switching elements are electrically connected to a common source control pattern by source wires. The gate control pattern is disposed to interpose the source control pattern between the gate control pattern and each of the plurality of semiconductor switching elements that are connected in parallel and that operate in parallel. Hence, each of the gate wires becomes longer than each of the source wires, and has an inductance larger than the source wire. Accordingly, gate oscillation is reduced or suppressed in the plurality of semiconductor switching elements that are connected in parallel and that operate in parallel.
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公开(公告)号：US20150351276A1
公开(公告)日：2015-12-03
申请号：US14655011
申请日：2013-03-21
发明人： Goro YASUTOMI , Yukimasa HAYASHIDA , Ryutaro DATE
IPC分类号： H05K7/14 , H01L23/498 , H01L23/053
CPC分类号： H05K7/1427 , H01L23/049 , H01L23/053 , H01L23/49811 , H01L2924/0002 , H05K7/1432 , H01L2924/00
摘要： An electrode (3) is joined to a wiring substrate (2). A nut box (7) is inserted in the bent portion (5) of the electrode (3) so that the nut (6) is positioned in alignment with the opening (4) of the electrode (3). A case (8) covers the wiring substrate (2). The nut box (7) and the case (8) are members separate from each other. The nut box (7) is fixed in the electrode (3) so as not to come off from the bent portion 5).
摘要翻译： 电极（3）与布线基板（2）接合。 螺母盒（7）插入电极（3）的弯曲部分（5）中，使得螺母（6）与电极（3）的开口（4）对齐。 壳体（8）覆盖布线基板（2）。 螺母盒（7）和壳体（8）是彼此分离的构件。 螺母盒（7）固定在电极（3）中，以便不从弯曲部分5）脱落。
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公开(公告)号：US20190206757A1
公开(公告)日：2019-07-04
申请号：US16098901
申请日：2016-09-20
IPC分类号： H01L23/31 , H01L23/00 , H01L23/34 , H01L23/48 , H01L23/488
摘要： A wiring board (2) is provided on a heat radiation plate (1). A semiconductor chip (8) is provided on the wiring board (2). A case housing (10) is provided on the heat radiation plate (1) and surrounds the wiring board (2) and the semiconductor chip (8). Adhesive agent (11) bonds a lower surface of the case housing (10) and an upper surface peripheral portion of the heat radiation plate (1). A sealing material (13) is filled in the case housing (10) and covers the wiring board (2) and the semiconductor chip (8). A step portion (16,17) is provided to at least one of the lower surface of the case housing (10) and the upper surface peripheral portion of the heat radiation plate (1). A side surface of the heat radiation plate (1) and an outer side surface of the case housing (10) are flush with each other.
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4.发明申请公开(公告)号：US20180294203A1
公开(公告)日：2018-10-11
申请号：US15768601
申请日：2016-01-14
发明人： Yukimasa HAYASHIDA , Hiroki SHIOTA
摘要： A radiation plate structure includes a radiation plate, and a solder resist disposed on a main surface of the radiation plate and having at least one opening. The solder resist is made of any of polyimide (PI), polyamide (PA), polypropylene (PP), polyphenylene sulfide (PPS), a resin containing particulate ceramic (e.g., aluminum nitride (AlN), silicon nitride (Si3N4), or aluminum oxide (Al2O3)), and a high-melting-point insulator made of, for instance, glass.
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公开(公告)号：US20210217675A1
公开(公告)日：2021-07-15
申请号：US17058283
申请日：2018-08-08
发明人： Daisuke OYA , Yukimasa HAYASHIDA , Tetsuo MOTOMIYA
IPC分类号： H01L23/057 , H01L23/08 , H01L29/417
摘要： A semiconductor device includes a first electrode; a second electrode; a resin case surrounding the first electrode and the second electrode; and a resin insulating part made of a material the same as a material of the resin case and covering part of the first electrode and part of the second electrode inside the resin case. The resin insulating part contacts an inner wall of the resin case or is separated from the inner wall of the resin case. A move positioned between the first electrode and the second electrode is formed at the resin insulating part, and thus a space in which the resin insulating part does not exist or a material different from the resin insulating part is provided between the first electrode and the second electrode.
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6.发明申请公开(公告)号：US20200243411A1
公开(公告)日：2020-07-30
申请号：US16487017
申请日：2017-05-10
发明人： Yukimasa HAYASHIDA
摘要： An object is to provide a technique capable of fixing a cover to a container body without using a dedicated fixation mechanism and fixation member. A semiconductor device includes: a container body having a space with an opening; a semiconductor element disposed in the space in the container body; a sealing member disposed in the space in the container body to cover the semiconductor element; and a cover covering the opening of the container body, wherein a convex portion protruding into the space is provided on the cover, and the cover is fixed to the container body only by embedding at least a tip portion of the convex portion in the sealing member which has been cured.
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公开(公告)号：US20200111772A1
公开(公告)日：2020-04-09
申请号：US16088735
申请日：2016-08-10
发明人： Yukimasa HAYASHIDA , Ryo TSUDA , Ryutaro DATE
摘要： First and second circuit patterns (5,6) are provided on an insulating substrate (1). First and second semiconductor chips (7,8) are provided on the first circuit pattern (5). A relay circuit pattern (10) is provided between the first semiconductor chip (7) and the second semiconductor chip (8) on the insulating substrate (1). A wire (11) is continuously connected to the first semiconductor chip (7), the relay circuit pattern (10), the second semiconductor chip (8) and the second circuit pattern (6) which are sequentially arranged in one direction.
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公开(公告)号：US20200185315A1
公开(公告)日：2020-06-11
申请号：US16638071
申请日：2017-11-17
IPC分类号： H01L23/498 , H01L23/31 , H01L23/00 , H01L23/544 , H01L25/07 , H01L25/18
摘要： A semiconductor module includes: an insulating substrate; a metal pattern provided on the insulating substrate; a solder resist provided on the metal pattern; a semiconductor chip mounted on the metal pattern at an opening portion of the solder resist; and a sealing material sealing the metal pattern, the solder resist and the semiconductor chip, wherein a suction area surrounded by a groove is provided in a portion of the solder resist.
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公开(公告)号：US20180261517A1
公开(公告)日：2018-09-13
申请号：US15758349
申请日：2015-12-04
发明人： Shoko ARAKI , Yukimasa HAYASHIDA , Ryutaro DATE
摘要： An object of the present invention to provide a technique which can put flexibility into positions, positional relationships, and sizes of constituent elements. A power semiconductor device includes: a substrate on which a semiconductor chip is disposed; an electrode which has one end fixed to the substrate and stands upright on the substrate; and an insulating case which houses the electrode and has a part opposed to the other end of the electrode. The power semiconductor device includes a conductive nut which is inserted into the case in the part of the case and a conductive component which electrically connects the other end of the electrode and the nut.
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公开(公告)号：US20180204778A1
公开(公告)日：2018-07-19
申请号：US15742608
申请日：2015-09-29
发明人： Shigeru HASEGAWA , Isao UMEZAKI , Ryo TSUDA , Yukimasa HAYASHIDA , Ryutaro DATE
CPC分类号： H01L23/13 , H01L23/3735 , H01L24/49 , H01L25/072 , H01L25/18 , H01L2224/0603 , H01L2224/48137 , H01L2224/4917 , H01L2924/1203 , H01L2924/13055
摘要： It is an object of the present invention to provide a semiconductor device which allows an increase in the number of semiconductor elements mounted in parallel and prevents a shape of an insulating substrate onto which the semiconductor elements are mounted, from being laterally long, and provide a semiconductor module including such semiconductor device. A semiconductor device according to the present invention includes an insulating substrate, a metal pattern which is a continuous piece and is bonded to one main surface of the insulating substrate, and a plurality of switching elements which are bonded to a surface opposite to the insulating substrate on the metal pattern, and the plurality of switching elements are arranged in a matrix of two or more rows and two or more columns on the metal pattern.
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