- 专利标题: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND MOVING BODY
-
申请号: US16487017申请日: 2017-05-10
-
公开(公告)号: US20200243411A1公开(公告)日: 2020-07-30
- 发明人: Yukimasa HAYASHIDA
- 申请人: Mitsubishi Electric Corporation
- 申请人地址: JP Tokyo
- 专利权人: Mitsubishi Electric Corporation
- 当前专利权人: Mitsubishi Electric Corporation
- 当前专利权人地址: JP Tokyo
- 国际申请: PCT/JP2017/017672 WO 20170510
- 主分类号: H01L23/31
- IPC分类号: H01L23/31 ; H01L23/24 ; H01L25/18
摘要:
An object is to provide a technique capable of fixing a cover to a container body without using a dedicated fixation mechanism and fixation member. A semiconductor device includes: a container body having a space with an opening; a semiconductor element disposed in the space in the container body; a sealing member disposed in the space in the container body to cover the semiconductor element; and a cover covering the opening of the container body, wherein a convex portion protruding into the space is provided on the cover, and the cover is fixed to the container body only by embedding at least a tip portion of the convex portion in the sealing member which has been cured.
公开/授权文献
信息查询
IPC分类: