公开(公告)号：US08735285B2

公开(公告)日：2014-05-27

申请号：US14096052

申请日：2013-12-04

Applicant: Micron Technology, Inc.

Inventor： Gurtej Sandhu ,  Scott Sills

IPC: H01L21/44 ,  H01L21/8238

CPC classification number: H01L27/10885 ,  H01L21/28008 ,  H01L21/28035 ,  H01L21/28518 ,  H01L21/3081 ,  H01L21/32139 ,  H01L21/76877 ,  H01L21/76895 ,  H01L21/823871 ,  H01L23/528 ,  H01L23/5283 ,  H01L27/10888 ,  H01L27/10891 ,  H01L2224/06138 ,  H01L2924/12044

Abstract: An integrated circuit and a method of formation provide a contact area formed at an angled end of at least one linearly extending conductive line. In an embodiment, conductive lines with contact landing pads are formed by patterning lines in a mask material, cutting at least one of the material lines to form an angle relative to the extending direction of the material lines, forming extensions from the angled end faces of the mask material, and patterning an underlying conductor by etching using said material lines and extension as a mask. In another embodiment, at least one conductive line is cut at an angle relative to the extending direction of the conductive line to produce an angled end face, and an electrical contact landing pad is formed in contact with the angled end face.

Abstract translation: 集成电路和形成方法提供形成在至少一个线性延伸导线的成角度端的接触区域。 在一个实施例中，具有接触着陆焊盘的导电线通过在掩模材料中图案化线形成，切割至少一条材料线以相对于材料线的延伸方向形成一角度，从所述材料线的成角度的端面形成延伸部 掩模材料，并通过使用所述材料线和延伸作为掩模进行蚀刻来图案化下面的导体。 在另一个实施例中，至少一条导线相对于导线的延伸方向以一定角度被切割，以产生成角度的端面，并且电接触着陆垫形成为与成角度的端面接触。

公开(公告)号：US20130210230A1

公开(公告)日：2013-08-15

申请号：US13751781

申请日：2013-01-28

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Gurtej Sandhu ,  Scott Sills

IPC: H01L21/308

CPC classification number: H01L27/10885 ,  H01L21/28008 ,  H01L21/28035 ,  H01L21/28518 ,  H01L21/3081 ,  H01L21/32139 ,  H01L21/76877 ,  H01L21/76895 ,  H01L21/823871 ,  H01L23/528 ,  H01L23/5283 ,  H01L27/10888 ,  H01L27/10891 ,  H01L2224/06138 ,  H01L2924/12044

Abstract: An integrated circuit and a method of formation provide a contact area formed at an angled end of at least one linearly extending conductive line. In an embodiment, conductive lines with contact landing pads are formed by patterning lines in a mask material, cutting at least one of the material lines to form an angle relative to the extending direction of the material lines, forming extensions from the angled end faces of the mask material, and patterning an underlying conductor by etching using said material lines and extension as a mask. In another embodiment, at least one conductive line is cut at an angle relative to the extending direction of the conductive line to produce an angled end face, and an electrical contact landing pad is formed in contact with the angled end face.

公开(公告)号：US09653315B2

公开(公告)日：2017-05-16

申请号：US14445478

申请日：2014-07-29

Applicant: Micron Technology, Inc.

Inventor： Scott Sills ,  Gurtej S. Sandhu ,  Anton deVilliers

IPC: H01L21/302 ,  H01L21/308 ,  G03F7/40 ,  H01L21/027 ,  H01L21/033 ,  H01L21/311

CPC classification number: H01L21/3088 ,  G03F7/40 ,  H01L21/0273 ,  H01L21/0337 ,  H01L21/0338 ,  H01L21/3086 ,  H01L21/31138

Abstract: A method of fabricating a substrate includes forming spaced first features over a substrate. An alterable material is deposited over the spaced first features and the alterable material is altered with material from the spaced first features to form altered material on sidewalls of the spaced first features. A first material is deposited over the altered material, and is of some different composition from that of the altered material. The first material is etched to expose the altered material and spaced second features comprising the first material are formed on sidewalls of the altered material. Then, the altered material is etched from between the spaced second features and the spaced first features. The substrate is processed through a mask pattern comprising the spaced first features and the spaced second features. Other embodiments are disclosed.

公开(公告)号：US20150171090A1

公开(公告)日：2015-06-18

申请号：US14633189

申请日：2015-02-27

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Gurtej Sandhu ,  Scott Sills

IPC: H01L27/108 ,  H01L21/768 ,  H01L21/28

CPC classification number: H01L27/10885 ,  H01L21/28008 ,  H01L21/28035 ,  H01L21/28518 ,  H01L21/3081 ,  H01L21/32139 ,  H01L21/76877 ,  H01L21/76895 ,  H01L21/823871 ,  H01L23/528 ,  H01L23/5283 ,  H01L27/10888 ,  H01L27/10891 ,  H01L2224/06138 ,  H01L2924/12044

Abstract: An integrated circuit and a method of formation provide a contact area formed at an angled end of at least one linearly extending conductive line. In an embodiment, conductive lines with contact landing pads are formed by patterning lines in a mask material, cutting at least one of the material lines to form an angle relative to the extending direction of the material lines, forming extensions from the angled end faces of the mask material, and patterning an underlying conductor by etching using said material lines and extension as a mask. In another embodiment, at least one conductive line is cut at an angle relative to the extending direction of the conductive line to produce an angled end face, and an electrical contact landing pad is formed in contact with the angled end face.

Abstract translation: 集成电路和形成方法提供形成在至少一个线性延伸导线的成角度端的接触区域。 在一个实施例中，具有接触着陆焊盘的导电线通过在掩模材料中图案化线形成，切割至少一条材料线以相对于材料线的延伸方向形成一角度，从所述材料线的成角度的端面形成延伸部 掩模材料，并通过使用所述材料线和延伸作为掩模进行蚀刻来图案化下面的导体。 在另一个实施例中，至少一条导线相对于导线的延伸方向以一定角度被切割，以产生成角度的端面，并且电接触着陆垫形成为与成角度的端面接触。

公开(公告)号：US20140335694A1

公开(公告)日：2014-11-13

申请号：US14445478

申请日：2014-07-29

Applicant: Micron Technology, Inc.

Inventor： Scott Sills ,  Gurtej S. Sandhu ,  Anton deVilliers

IPC: H01L21/308

CPC classification number: H01L21/3088 ,  G03F7/40 ,  H01L21/0273 ,  H01L21/0337 ,  H01L21/0338 ,  H01L21/3086 ,  H01L21/31138

Abstract: A method of fabricating a substrate includes forming spaced first features over a substrate. An alterable material is deposited over the spaced first features and the alterable material is altered with material from the spaced first features to form altered material on sidewalls of the spaced first features. A first material is deposited over the altered material, and is of some different composition from that of the altered material. The first material is etched to expose the altered material and spaced second features comprising the first material are formed on sidewalls of the altered material. Then, the altered material is etched from between the spaced second features and the spaced first features. The substrate is processed through a mask pattern comprising the spaced first features and the spaced second features. Other embodiments are disclosed.

Abstract translation: 一种制造衬底的方法包括：在衬底上方形成间隔开的第一特征。 可更换的材料沉积在间隔开的第一特征上，并且可变材料用来自间隔开的第一特征的材料改变，以在间隔开的第一特征的侧壁上形成改变的材料。 第一种材料沉积在改变的材料上，并且与改变的材料的组成不同。 蚀刻第一材料以暴露改变的材料并且包含第一材料的间隔开的第二特征形成在改变的材料的侧壁上。 然后，从间隔开的第二特征和间隔开的第一特征之间蚀刻改变的材料。 通过包括间隔开的第一特征和间隔开的第二特征的掩模图案处理基板。 公开了其他实施例。

公开(公告)号：US08987906B2

公开(公告)日：2015-03-24

申请号：US14258476

申请日：2014-04-22

Applicant: Micron Technology, Inc.

Inventor： Gurtej Sandhu ,  Scott Sills

IPC: H01L23/528 ,  H01L21/3213 ,  H01L21/768 ,  H01L27/108 ,  H01L21/308 ,  H01L21/28 ,  H01L21/285 ,  H01L21/8238

CPC classification number: H01L27/10885 ,  H01L21/28008 ,  H01L21/28035 ,  H01L21/28518 ,  H01L21/3081 ,  H01L21/32139 ,  H01L21/76877 ,  H01L21/76895 ,  H01L21/823871 ,  H01L23/528 ,  H01L23/5283 ,  H01L27/10888 ,  H01L27/10891 ,  H01L2224/06138 ,  H01L2924/12044

Abstract: An integrated circuit and a method of formation provide a contact area formed at an angled end of at least one linearly extending conductive line. In an embodiment, conductive lines with contact landing pads are formed by patterning lines in a mask material, cutting at least one of the material lines to form an angle relative to the extending direction of the material lines, forming extensions from the angled end faces of the mask material, and patterning an underlying conductor by etching using said material lines and extension as a mask. In another embodiment, at least one conductive line is cut at an angle relative to the extending direction of the conductive line to produce an angled end face, and an electrical contact landing pad is formed in contact with the angled end face.

Abstract translation: 集成电路和形成方法提供形成在至少一个线性延伸导线的成角度端的接触区域。 在一个实施例中，具有接触着陆焊盘的导电线通过在掩模材料中图案化线形成，切割至少一条材料线以相对于材料线的延伸方向形成一角度，从所述材料线的成角度的端面形成延伸部 掩模材料，并通过使用所述材料线和延伸作为掩模进行蚀刻来图案化下面的导体。 在另一个实施例中，至少一条导线相对于导线的延伸方向以一定角度被切割，以产生成角度的端面，并且电接触着陆垫形成为与成角度的端面接触。

公开(公告)号：US09224742B2

公开(公告)日：2015-12-29

申请号：US14633189

申请日：2015-02-27

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Gurtej Sandhu ,  Scott Sills

IPC: H01L27/108 ,  H01L21/3213 ,  H01L21/768 ,  H01L23/528 ,  H01L21/308 ,  H01L21/28 ,  H01L21/285 ,  H01L21/8238

CPC classification number: H01L27/10885 ,  H01L21/28008 ,  H01L21/28035 ,  H01L21/28518 ,  H01L21/3081 ,  H01L21/32139 ,  H01L21/76877 ,  H01L21/76895 ,  H01L21/823871 ,  H01L23/528 ,  H01L23/5283 ,  H01L27/10888 ,  H01L27/10891 ,  H01L2224/06138 ,  H01L2924/12044

Abstract: An integrated circuit and a method of formation provide a contact area formed at an angled end of at least one linearly extending conductive line. In an embodiment, conductive lines with contact landing pads are formed by patterning lines in a mask material, cutting at least one of the material lines to form an angle relative to the extending direction of the material lines, forming extensions from the angled end faces of the mask material, and patterning an underlying conductor by etching using said material lines and extension as a mask. In another embodiment, at least one conductive line is cut at an angle relative to the extending direction of the conductive line to produce an angled end face, and an electrical contact landing pad is formed in contact with the angled end face.

公开(公告)号：US20140225264A1

公开(公告)日：2014-08-14

申请号：US14258476

申请日：2014-04-22

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Gurtej Sandhu ,  Scott Sills

IPC: H01L23/528

CPC classification number: H01L27/10885 ,  H01L21/28008 ,  H01L21/28035 ,  H01L21/28518 ,  H01L21/3081 ,  H01L21/32139 ,  H01L21/76877 ,  H01L21/76895 ,  H01L21/823871 ,  H01L23/528 ,  H01L23/5283 ,  H01L27/10888 ,  H01L27/10891 ,  H01L2224/06138 ,  H01L2924/12044

Abstract: An integrated circuit and a method of formation provide a contact area formed at an angled end of at least one linearly extending conductive line. In an embodiment, conductive lines with contact landing pads are formed by patterning lines in a mask material, cutting at least one of the material lines to form an angle relative to the extending direction of the material lines, forming extensions from the angled end faces of the mask material, and patterning an underlying conductor by etching using said material lines and extension as a mask. In another embodiment, at least one conductive line is cut at an angle relative to the extending direction of the conductive line to produce an angled end face, and an electrical contact landing pad is formed in contact with the angled end face.

Abstract translation: 集成电路和形成方法提供形成在至少一个线性延伸导线的成角度端的接触区域。 在一个实施例中，具有接触着陆焊盘的导电线通过在掩模材料中图案化线形成，切割至少一条材料线以相对于材料线的延伸方向形成一角度，从所述材料线的成角度的端面形成延伸部 掩模材料，并通过使用所述材料线和延伸作为掩模进行蚀刻来图案化下面的导体。 在另一个实施例中，至少一条导线相对于导线的延伸方向以一定角度被切割，以产生成角度的端面，并且电接触着陆垫形成为与成角度的端面接触。

公开(公告)号：US20140094026A1

公开(公告)日：2014-04-03

申请号：US14096052

申请日：2013-12-04

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Gurtej Sandhu ,  Scott Sills

IPC: H01L21/285 ,  H01L21/768 ,  H01L21/28

CPC classification number: H01L27/10885 ,  H01L21/28008 ,  H01L21/28035 ,  H01L21/28518 ,  H01L21/3081 ,  H01L21/32139 ,  H01L21/76877 ,  H01L21/76895 ,  H01L21/823871 ,  H01L23/528 ,  H01L23/5283 ,  H01L27/10888 ,  H01L27/10891 ,  H01L2224/06138 ,  H01L2924/12044

Abstract: An integrated circuit and a method of formation provide a contact area formed at an angled end of at least one linearly extending conductive line. In an embodiment, conductive lines with contact landing pads are formed by patterning lines in a mask material, cutting at least one of the material lines to form an angle relative to the extending direction of the material lines, forming extensions from the angled end faces of the mask material, and patterning an underlying conductor by etching using said material lines and extension as a mask. In another embodiment, at least one conductive line is cut at an angle relative to the extending direction of the conductive line to produce an angled end face, and an electrical contact landing pad is formed in contact with the angled end face.

公开(公告)号：US08629051B2

公开(公告)日：2014-01-14

申请号：US13751781

申请日：2013-01-28

Applicant: Micron Technology, Inc.

Inventor： Gurtej Sandhu ,  Scott Sills

IPC: H01L21/44

CPC classification number: H01L27/10885 ,  H01L21/28008 ,  H01L21/28035 ,  H01L21/28518 ,  H01L21/3081 ,  H01L21/32139 ,  H01L21/76877 ,  H01L21/76895 ,  H01L21/823871 ,  H01L23/528 ,  H01L23/5283 ,  H01L27/10888 ,  H01L27/10891 ,  H01L2224/06138 ,  H01L2924/12044

Abstract: An integrated circuit and a method of formation provide a contact area formed at an angled end of at least one linearly extending conductive line. In an embodiment, conductive lines with contact landing pads are formed by patterning lines in a mask material, cutting at least one of the material lines to form an angle relative to the extending direction of the material lines, forming extensions from the angled end faces of the mask material, and patterning an underlying conductor by etching using said material lines and extension as a mask. In another embodiment, at least one conductive line is cut at an angle relative to the extending direction of the conductive line to produce an angled end face, and an electrical contact landing pad is formed in contact with the angled end face.