公开(公告)号：US20170256527A1

公开(公告)日：2017-09-07

申请号：US15600526

申请日：2017-05-19

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Wataru Tsukada ,  Masayuki Honda ,  Yoshihisa Fukushima ,  Scott Richard Cyr

IPC: H01L25/18 ,  G11C5/04 ,  G11C5/06 ,  H01L25/065

CPC classification number: H01L25/18 ,  G11C5/04 ,  G11C5/063 ,  G11C7/1048 ,  G11C29/025 ,  G11C29/50008 ,  G11C2207/105 ,  H01L23/5386 ,  H01L25/0655 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor module includes a module substrate, a line pattern provided to the module substrate, first and second semiconductor chips on the module substrate and coupled to the line pattern, and a termination resister on the module substrate and coupled to the line pattern, the termination resistor being located between the first and second semiconductor chips.

公开(公告)号：US20160064366A1

公开(公告)日：2016-03-03

申请号：US14839771

申请日：2015-08-28

Applicant: Micron Technology, Inc.

Inventor： Wataru Tsukada ,  Masayuki Honda ,  Yoshihisa Fukushima ,  Scott Richard Cyr

IPC: H01L25/18 ,  G11C5/02 ,  H01L23/522 ,  H01L25/065 ,  H01L23/498

CPC classification number: H01L25/18 ,  G11C5/04 ,  G11C5/063 ,  G11C7/1048 ,  G11C29/025 ,  G11C29/50008 ,  G11C2207/105 ,  H01L23/5386 ,  H01L25/0655 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor module includes a module substrate, a line pattern provided to the module substrate, first and second semiconductor chips on the module substrate and coupled to the line pattern, and a termination resister on the module substrate and coupled to the line pattern, the termination resistor being located between the first and second semiconductor chips.

Abstract translation: 半导体模块包括模块基板，提供给模块基板的线图案，模块基板上的第一和第二半导体芯片，并且耦合到线图案，以及模块基板上的端接电阻并耦合到线路图案，终端 电阻器位于第一和第二半导体芯片之间。

公开(公告)号：US10199363B2

公开(公告)日：2019-02-05

申请号：US15600526

申请日：2017-05-19

Applicant: Micron Technology, Inc.

Inventor： Wataru Tsukada ,  Masayuki Honda ,  Yoshihisa Fukushima ,  Scott Richard Cyr

IPC: H01L23/538 ,  H01L25/18 ,  H01L25/065 ,  G11C5/04 ,  G11C5/06 ,  G11C29/02 ,  G11C29/50 ,  G11C7/10

Abstract: A semiconductor module includes a module substrate, a line pattern provided to the module substrate, first and second semiconductor chips on the module substrate and coupled to the line pattern, and a termination resister on the module substrate and coupled to the line pattern, the termination resistor being located between the first and second semiconductor chips.

公开(公告)号：US09691744B2

公开(公告)日：2017-06-27

申请号：US14839771

申请日：2015-08-28

Applicant: Micron Technology, Inc.

Inventor： Wataru Tsukada ,  Masayuki Honda ,  Yoshihisa Fukushima ,  Scott Richard Cyr

IPC: H01L23/13 ,  H01L25/18 ,  H01L25/065 ,  G11C5/04 ,  G11C5/06 ,  G11C29/02 ,  G11C29/50 ,  G11C7/10 ,  H01L23/538

CPC classification number: H01L25/18 ,  G11C5/04 ,  G11C5/063 ,  G11C7/1048 ,  G11C29/025 ,  G11C29/50008 ,  G11C2207/105 ,  H01L23/5386 ,  H01L25/0655 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor module includes a module substrate, a line pattern provided to the module substrate, first and second semiconductor chips on the module substrate and coupled to the line pattern, and a termination resister on the module substrate and coupled to the line pattern, the termination resistor being located between the first and second semiconductor chips.