公开(公告)号：US20230238038A1

公开(公告)日：2023-07-27

申请号：US18157945

申请日：2023-01-23

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Dean D. Gans ,  Daniel C. Skinner

IPC: G11C7/10

CPC classification number: G11C7/1045 ,  G11C7/109

Abstract: Apparatuses and methods for writing and storing parameter codes for operating parameters, and selecting between the parameter codes to set an operating condition for a memory are disclosed. An example apparatus includes a first mode register and a second mode register. The first mode register is configured to store first and second parameter codes for a same operating parameter. The second mode register is configured to store a parameter code for a control parameter to select between the first and second parameter codes to set a current operating condition for the operating parameter. An example method includes storing in a first register a first parameter code for an operating parameter used to set a first memory operating condition, and further includes storing in a second register a second parameter code for the operating parameter used to set a second memory operating condition.

公开(公告)号：US11698726B2

公开(公告)日：2023-07-11

申请号：US17645101

申请日：2021-12-20

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Dean D. Gans ,  Shunichi Saito

IPC: G06F12/10 ,  G06F3/06

CPC classification number: G06F3/0604 ,  G06F3/0629 ,  G06F3/0673 ,  G06F12/10 ,  G06F2212/1012

Abstract: Apparatuses and methods for configurable memory array bank architectures are described. An example apparatus includes a mode register configured to store information related to bank architecture and a memory array including a plurality of memory banks. The plurality of memory banks are configured to be arranged in a bank architecture based at least in part on the information related to bank architecture stored in the mode register.

公开(公告)号：US20230004492A1

公开(公告)日：2023-01-05

申请号：US17863987

申请日：2022-07-13

Applicant: Micron Technology, Inc.

Inventor： Robert Nasry Hasbun ,  Timothy M. Hollis ,  Jeffrey P. Wright ,  Dean D. Gans

IPC: G06F12/0806 ,  H04L5/00

Abstract: Methods, systems, and devices that support variable modulation schemes for memory are described. A device may switch between different modulation schemes for communication based on one or more operating parameters associated with the device or a component of the device. The modulation schemes may involve amplitude modulation in which different levels of a signal represent different data values. For instance, the device may use a first modulation scheme that represents data using two levels and a second modulation scheme that represents data using four levels. In one example, the device may switch from the first modulation scheme to the second modulation scheme when bandwidth demand is high, and the device may switch from the second modulation scheme to the first modulation scheme when power conservation is in demand. The device may also, based on the operating parameter, change the frequency of the signal pulses communicated using the modulation schemes.

公开(公告)号：US20220400038A1

公开(公告)日：2022-12-15

申请号：US17851533

申请日：2022-06-28

Applicant: Micron Technology, Inc.

Inventor： Robert Nasry Hasbun ,  Timothy M. Hollis ,  Jeffrey P. Wright ,  Dean D. Gans

IPC: H04L27/04 ,  G06F13/38 ,  H04L27/06 ,  H04L27/02 ,  H04L25/49 ,  G06F13/16 ,  G11C5/06 ,  G11C7/10

Abstract: Methods, systems, and devices for multiplexing distinct signals on a single pin of a memory device are described. Techniques are described herein to multiplex data using a modulation scheme having at least three levels. The modulated data may be communicated to multiple memory dies over a shared bus. Each of the dies may include a same or different type of memory cell and, in some examples, a multi-level signaling scheme may be pulse amplitude modulation (PAM). Each unique symbol of the modulated signal may be configured to represent a plurality of bits of data.

公开(公告)号：US20220148640A1

公开(公告)日：2022-05-12

申请号：US17455468

申请日：2021-11-18

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Dean D. Gans

IPC: G11C11/4076 ,  H03K5/156

Abstract: Embodiments of the disclosure are drawn to apparatuses and methods for a multi-bit duty cycle monitor. A clock signal may be provided to a memory in order to synchronize one or more operations of the memory. The clock signal may have a duty cycle which is adjusted by a duty cycle adjustor of the memory. The duty cycle of the adjusted clock signal may be monitored by a multi-bit duty cycle monitor. The multi-bit duty cycle monitor may provide a multi-bit signal which indicates if the duty cycle of the adjusted clock signal is above or below a target duty cycle value (or if the duty cycle is outside tolerances around the target duty cycle). The multi-bit duty cycle monitor may provide the multi-bit signal while access operations of the memory are occurring.

公开(公告)号：US20210357137A1

公开(公告)日：2021-11-18

申请号：US17392085

申请日：2021-08-02

Applicant: Micron Technology, Inc.

Inventor： Dean D. Gans ,  Yoshiro Riho ,  Shunichi Saito ,  Osamu Nagashima

IPC: G06F3/06 ,  G11C7/10 ,  G06F13/16

Abstract: Methods, systems, and apparatuses related to memory operation with multiple sets of latencies are disclosed. A memory device or system that includes a memory device may be operable with one or several sets of latencies (e.g., read, write, or write recovery latencies), and the memory device or system may apply a set of latencies depending on which features of the memory device are enabled. For example, control circuitry may be configured to enable one or more features during operations on a memory array, and the control circuitry may apply a set of latency values based on a number or type of features that are enabled. The sets of latency values may depend, for example, on whether various control features (e.g., dynamic voltage frequency scaling) are enabled, and a device may operate within certain frequency ranges irrespective of other characteristics (e.g., mode register values) or latencies applied.

公开(公告)号：US20210326072A1

公开(公告)日：2021-10-21

申请号：US17307651

申请日：2021-05-04

Applicant: Micron Technology, Inc.

Inventor： Robert Nasry Hasbun ,  Dean D. Gans ,  Sharookh Daruwalla

IPC: G06F3/06

Abstract: Methods, systems, and devices for prefetch signaling in a memory system or sub-system are described. A memory device (e.g., a local memory controller of memory device) of a main memory may transmit a prefetch indicator indicating a size of prefetch data associated with a first set of data requested by an interface controller. The size of the prefetch data may be equal to or different than the size of the first set of data. The main memory may, in some examples, store the size of prefetch data along with the first set of data. The memory device may transmit the prefetch indicator (e.g., an indicator signal) to the interface controller using a pin compatible with an industry standard or specification and/or a separate pin configured for transmitting command or control information. The memory device may transmit the prefetch indicator while the first set of data is being transmitted.

公开(公告)号：US20210280225A1

公开(公告)日：2021-09-09

申请号：US17212708

申请日：2021-03-25

Applicant: Micron Technology, Inc.

Inventor： Robert Nasry Hasbun ,  Timothy M. Hollis ,  Jeffrey P. Wright ,  Dean D. Gans

IPC: G11C7/10 ,  G06F1/3234 ,  G06F13/42 ,  G11C11/22

Abstract: Methods, systems, and devices for multiple concurrent modulation schemes in a memory system are described. Techniques are provided herein to communicate data using a modulation scheme having at least three levels and using a modulation scheme having at least two levels within a common system or memory device. Such communication with multiple modulation schemes may be concurrent. The modulated data may be communicated to a memory die through distinct signal paths that may correspond to a particular modulation scheme. An example of a modulation scheme having at least three levels may be pulse amplitude modulation (PAM) and an example of a modulation scheme having at least two levels may be non-return-to-zero (NRZ).

公开(公告)号：US20210191631A1

公开(公告)日：2021-06-24

申请号：US17193248

申请日：2021-03-05

Applicant: Micron Technology, Inc.

Inventor： Dean D. Gans

IPC: G06F3/06 ,  G06F12/0802

Abstract: Methods, systems, and devices related to a memory system or scheme that includes a first memory device configured for low-energy access operations and a second memory device configured for storing high-density information and operations of the same are described. The memory system may include an array configured for high-density information and may interface with a host via a controller and a cache or another array of a relatively fast memory type. The memory system may support signals communicated according to one or several modulation schemes, including a modulation scheme or schemes that employ two, three, or more voltage levels (e.g., NRZ, PAM4). The memory system may include, e.g., separate channels configured to communicate using different modulation schemes between a host and between memory arrays or memory types within the memory system.

公开(公告)号：US10978116B2

公开(公告)日：2021-04-13

申请号：US16530525

申请日：2019-08-02

Applicant: Micron Technology, Inc.

Inventor： Robert Nasry Hasbun ,  Timothy M. Hollis ,  Jeffrey P. Wright ,  Dean D. Gans

IPC: G06F7/10 ,  G11C7/10 ,  G06F1/3234 ,  G06F13/42 ,  G11C11/22 ,  G11C11/4093

Abstract: Methods, systems, and devices for multiple concurrent modulation schemes in a memory system are described. Techniques are provided herein to communicate data using a modulation scheme having at least three levels and using a modulation scheme having at least two levels within a common system or memory device. Such communication with multiple modulation schemes may be concurrent. The modulated data may be communicated to a memory die through distinct signal paths that may correspond to a particular modulation scheme. An example of a modulation scheme having at least three levels may be pulse amplitude modulation (PAM) and an example of a modulation scheme having at least two levels may be non-return-to-zero (NRZ).