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公开(公告)号：US20100093264A1
公开(公告)日：2010-04-15
申请号：US12287550
申请日：2008-10-10
申请人： Michael Vogtmann , Thomas A. Walsh
发明人： Michael Vogtmann , Thomas A. Walsh
IPC分类号： B24B27/00 , B24B41/047 , B24B47/00
CPC分类号： B24B27/0076 , B24B41/047 , B24B47/14
摘要： A grinding machine wherein coarse and fine grind wheels are mounted to a single rotating spindle. A multiple grind wheel mount is attached to the lower portion of the rotating spindle, the coarse and fine wheels being supported by the wheel mount, the wheel mount containing the mechanism for moving the inner coarse wheel down relative to the stationary outer fine wheel.
摘要翻译： 一种磨床，其中粗磨细轮被安装到单个旋转主轴上。 多个研磨轮安装件附接到旋转主轴的下部，粗轮和细轮由车轮支架支撑，车轮安装架包含用于相对于固定外细轮向下移动内粗轮的机构。
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公开(公告)号：US08133093B2
公开(公告)日：2012-03-13
申请号：US12287550
申请日：2008-10-10
申请人： Michael Vogtmann , Thomas A. Walsh
发明人： Michael Vogtmann , Thomas A. Walsh
CPC分类号： B24B27/0076 , B24B41/047 , B24B47/14
摘要： A grinding machine wherein coarse and fine grind wheels are mounted to a single rotating spindle. A multiple grind wheel mount is attached to the lower portion of the rotating spindle, the coarse and fine wheels being supported by the wheel mount, the wheel mount containing the mechanism for moving the inner coarse wheel down relative to the stationary outer fine wheel.
摘要翻译： 一种磨床，其中粗磨细轮被安装到单个旋转主轴上。 多个研磨轮安装件附接到旋转主轴的下部，粗轮和细轮由车轮支架支撑，车轮安装架包含用于相对于固定外细轮向下移动内粗轮的机构。
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公开(公告)号：US07156946B2
公开(公告)日：2007-01-02
申请号：US10425896
申请日：2003-04-28
IPC分类号： C23F1/00
CPC分类号： B24B37/30
摘要： A pivoting wafer carrier having a minimum of internal friction and a smooth, continuous pivoting motion. The pivot mechanism includes a lower ring mounted on a pressure plate, an upper ring mounted on a housing upper plate and ball transfer units disposed on the lower ring. Corresponding bearing wedges depend downwardly from the upper ring. As the pressure plate tilts during the polishing process, the load balls of the ball transfer units roll against the corresponding wedges, thus producing a smooth, continuous pivoting motion. A universal joint may be provided to the carrier to effect the rotation of the carrier and to aid the smooth, continuous pivoting motion of the wafer carrier.
摘要翻译： 具有最小内摩擦和平滑，连续的枢转运动的枢转晶片载体。 枢转机构包括安装在压板上的下环，安装在壳体上板上的上环和设置在下环上的球传递单元。 相应的轴承楔块从上环向下取向。 当在抛光过程中压板倾斜时，球传送装置的载荷球相对于相应的楔形物滚动，从而产生平滑，连续的旋转运动。 可以向载体提供万向接头以实现载体的旋转并且有助于晶片载体的平滑，连续的枢转运动。
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公开(公告)号：US08565919B2
公开(公告)日：2013-10-22
申请号：US13290900
申请日：2011-11-07
CPC分类号： B24B37/345 , B24B37/30 , H01L21/67161 , H01L21/67219 , H01L21/68785
摘要： The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end module can comprise a single robot, a transfer station, and a plurality of end effectors. The processing module is coupled with the front-end module such that the single robot delivers objects from the storage device to the processing module. The processing module comprising a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table.
摘要翻译： 本实施例提供了用于处理诸如晶片的物体的方法和系统，包括抛光和/或研磨晶片。 一些实施例提供了包括前端模块和处理模块的系统。 前端模块与存储用于处理的对象的存储设备耦合。 前端模块可以包括单个机器人，传送站和多个端部执行器。 处理模块与前端模块耦合，使得单个机器人将物体从存储装置传送到处理模块。 所述处理模块包括旋转台和具有承载件的主轴，所述托架被配置为检索所递送的物体并且处理所述旋转台上的物体。
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公开(公告)号：US07458878B2
公开(公告)日：2008-12-02
申请号：US11548213
申请日：2006-10-10
摘要： The present embodiments provide methods, systems and apparatuses for use in grinding work pieces, such as wafers. Some embodiments provide methods that position a grind spindle to contact a first grinding spindle to a face of a work piece, remove a portion of the face, and control the removing of the portion of the face according to a control algorithm. This control algorithm can comprise determining a force applied to the work piece during the removing of the portion of the face, adjusting a feed rate of the first grind spindle when the force applied to the work piece has a predefined relationship with a first threshold level; and dressing a portion of the first grinding portion when the force applied to the work piece has a predefined relationship with a second threshold level that is greater than the first threshold.
摘要翻译： 本实施例提供了用于研磨诸如晶片的工件的方法，系统和装置。 一些实施例提供了一种方法，其定位研磨主轴以使第一研磨主轴接触工件的表面，去除面部的一部分，并且根据控制算法控制面部的部分的移除。 该控制算法可以包括确定在去除面部的部分期间施加到工件的力，当施加到工件的力具有与第一阈值水平的预定关系时，调节第一研磨主轴的进给速度; 以及当施加到所述工件上的力具有与大于所述第一阈值的第二阈值水平的预定关系时，修整所述第一研磨部的一部分。
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6.发明授权Lap shaping machine with oscillatable point cutter and selectively rotatable or oscillatable lap 失效具有可摆动点铣刀和选择性旋转或可摆动圈的搭接成型机
公开(公告)号：US4380412A
公开(公告)日：1983-04-19
申请号：US63036
申请日：1979-08-02
申请人： Thomas A. Walsh
发明人： Thomas A. Walsh
CPC分类号： B24B13/046 , Y10T409/504264
摘要： Programmable electric and hydraulic machine for shaping laps such as are used to form or polish opthalmic lenses, comprises vertically oscillatable, longitudinally displaceable arm carrying a point cutter which is functionally engageable by radially extensible, rotating lap carried by upstanding spindle. Alternately, spindle is operable by oscillating drive when lap is radially retracted. Toroidal or spherical laps having a large range of variance in two dimensions, i.e. curvatures, are thus obtained by using relevant cutter and lap locations, as well as appropriate drive settings. Concave laps are produced by exchanging locations of lap and cutter so workpiece is carried by vertical-moving arm.
摘要翻译： 可编程电动和液压机用于成型用于形成或抛光眼镜片的圈，包括垂直可摆动的纵向可移位的手臂，其承载点切割器，该切割器通过直立主轴承载的可径向延伸的旋转搭接功能可接合。 或者，主轴通过摆动驱动器在搭接径向缩回时可操作。 因此，通过使用相关的切割器和搭接位置以及适当的驱动设置来获得具有两维度（即曲率）的较大变化范围的环形或球面圈。 通过交叉位置和切割器产生凹坑，因此工件由垂直移动臂承载。
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公开(公告)号：US07040955B1
公开(公告)日：2006-05-09
申请号：US11046502
申请日：2005-01-28
申请人： William Kalenian , Thomas A. Walsh
发明人： William Kalenian , Thomas A. Walsh
IPC分类号： B24B1/00
CPC分类号： B24B49/16 , B24B37/042
摘要： The methods and devices described below allow users of CMP tools to quickly calibrate Spindle Force, Wafer Force, and Retaining Ring Force using mechanisms, load cells, a control computer, and force equations. The control computer can test a variety of pressures in the inflatable seal or the inflatable membrane, depending on the wafer carrier configuration, to determine a unique calibration in real time for the particular wafer carrier that is being tested and used during the polishing process.
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公开(公告)号：US3986433A
公开(公告)日：1976-10-19
申请号：US518498
申请日：1974-10-29
IPC分类号： B23C3/16
CPC分类号： B23C3/16 , Y10T409/300896 , Y10T409/30728 , Y10T409/30756
摘要： A programmable machine for automatically cutting and/or resurfacing a selected arcuate pattern upon either a convex or concave lap, particularly such laps as may then be used for forming and polishing opthalmic lenses. A lap positioning unit and a cutter positioning unit are located respectively on adjacent upright and horizontal supports so as to bring the lap and cutter into mutual engagement, each unit initially being longitudinally adjustable from a respective pivot point by a selected amount so as to determine the particular arcuate curvature obtained, which curvatures jointly form the two-dimentional arcuate pattern chosen for the lap face. In operation, the lap is oscillated vertically and a rotary milling cutter is driven back and forth transverse thereto. Each unit is associated with a longitudinal cam plate or guide of distally converging taper, the opposite edges of which serve to jog a contact roller which triggers a corresponding reversing switch, thus automatically limiting the length of swing of the particular unit. The arcuate stroke length of the oscillating lap and of the cutter are thus correlated with the amount of displacement from the particular pivot point.To change between concave and convex work surfaces, the lap-carrying unit and the cutter-carrying unit may each be rotated 180.degree. on their respective axes so that when brought together again each faces the opposite direction. An electric motor drives the rotary milling cutter, the oscillatory movements of the positioning units being effected hydraulically, and electric programming means enabling the machine to continue the set pattern to the end of a run and then return to starting position before shutting itself off, thus enabling an operator to replace successive workpieces (laps) in a series of such machines operating in sequential cycles.
摘要翻译： 一种可编程机器，用于在凸起或凹圈之间自动切割和/或重新选择弓形图案，特别是可以用于形成和抛光眼镜片的这样的圈。 分针定位单元和切割器定位单元分别位于相邻的竖直和水平支撑件上，以使搭接和切割器相互接合，每个单元最初可以从相应的枢轴点纵向调节选定的量，以便确定 获得的特定弓形曲率，其曲率共同形成为搭接面选择的二维弧形图案。 在操作中，膝部垂直摆动，并且旋转铣刀横向于其前后驱动。 每个单元与纵向凸轮板或远端会聚锥形导向件相关联，其相对边缘用于使接触辊微动，该接触辊触发相应的换向开关，从而自动限制特定单元的摆动长度。 因此，振荡圈和切割器的弓形行程长度与从特定枢轴点的位移量相关。
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公开(公告)号：US07118446B2
公开(公告)日：2006-10-10
申请号：US10407833
申请日：2003-04-04
摘要： A grinding assembly for shaping work pieces that includes one or more grind spindles. Each of the grind spindles include two independent grinding wheels driven by a single spindle drive. The grind spindles translate horizontally to perform both edge and face grinding with a single grind spindle. A non-contact position sensor in a work spindle measures work spindle displacement during grinding and provides feedback to the grind spindle to regulate the force imparted on the work piece by the grind spindle. In variations, an abrasive wheel disposed radially with respect to an axis of spindle rotation is utilized to perform edge grinding of the work piece. In other variations cleaning, polishing and grinding are carried out in a single grinding assembly. In yet other variations, a wheel dressing apparatus is utilized to dress the wheel when one or more forces to maintain productivity of the grind wheel exceed a threhold.
摘要翻译： 一种用于成形工件的磨削组件，其包括一个或多个研磨主轴。 每个研磨主轴包括由单个主轴驱动器驱动的两个独立的砂轮。 研磨主轴水平平移，用单个研磨主轴进行边缘和面磨削。 工作主轴中的非接触位置传感器可测量研磨过程中的工作主轴位移，并向研磨主轴提供反馈，以调节由研磨主轴施加在工件上的力。 在变型中，利用相对于主轴旋转轴径向放置的砂轮来执行工件的边缘磨削。 在其他变型中，清洁，抛光和研磨在单个研磨组件中进行。 在另一些变型中，当用于保持研磨轮的生产率的一个或多个力超过最大限度时，使用轮子修整装置来修整车轮。
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公开(公告)号：US5605487A
公开(公告)日：1997-02-25
申请号：US242560
申请日：1994-05-13
IPC分类号： B24B37/04 , H01L21/00 , H01L21/304 , H01L21/687 , B24B49/00
CPC分类号： H01L21/67219 , B24B37/04 , H01L21/68707
摘要： Apparatus for polishing semiconductor wafers comprises a housing, a mounting apparatus within the housing for wax mounting a first face of a semiconductor wafer to a first face of a polishing block, and a first semiconductor wafer polisher within the housing for polishing a second face of the semiconductor wafer. The second face of the semiconductor wafer is opposite the first face of the semiconductor wafer. A first transfer mechanism is within the housing for delivering the polishing block and semiconductor wafer from the mounting apparatus to adjacent the first semiconductor wafer polisher. A controller controls operation of the mounting apparatus, the first semiconductor wafer polisher, and the first transfer mechanism.
摘要翻译： 用于抛光半导体晶片的装置包括壳体，壳体内的安装装置，用于蜡将半导体晶片的第一面安装到抛光块的第一面，以及在壳体内的第一半导体晶片抛光机，用于抛光半导体晶片的第二面 半导体晶片。 半导体晶片的第二面与半导体晶片的第一面相对。 第一传送机构在壳体内，用于将抛光块和半导体晶片从安装设备传送到与第一半导体晶片抛光机相邻。 控制器控制安装设备，第一半导体晶片抛光机和第一传送机构的操作。
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