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    Conditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafers
    2.
    发明授权
    Conditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafers 有权
    用于半导体晶片的化学机械抛光装置中的调节机构

    公开(公告)号：US06645046B1

    公开(公告)日：2003-11-11

    申请号：US09607743

    申请日：2000-06-30

    申请人： Michael Vogtmann ,  Chris Frederickson ,  Jeff Gasparitsch ,  Gene Hempel ,  Erik Engdahl

    发明人： Michael Vogtmann ,  Chris Frederickson ,  Jeff Gasparitsch ,  Gene Hempel ,  Erik Engdahl

    IPC分类号： B24B4900

    CPC分类号： B24B53/017 ,  B24B21/04 ,  B24B49/16 ,  B24B53/10

    摘要： A method and apparatus for conditioning a polishing pad are described. The method includes steps of providing a chemical mechanical polishing apparatus having a polishing region and a conditioning region; cycling a polishing member through the apparatus; contacting the polishing member in the conditioning region with a conditioning member; and conditioning the polishing member. The apparatus includes an end effector adapted to receive a conditioning member, the end effector being attached to an arm that can be moved horizontally and vertically, and a strain gauge that monitors the force applied to a polishing member.

    摘要翻译： 描述了一种用于调节抛光垫的方法和装置。 该方法包括提供具有抛光区域和调节区域的化学机械抛光装置的步骤; 通过该装置循环抛光构件; 将调理区域中的抛光构件与调节构件接触; 并调理抛光部件。 该装置包括适于接收调节构件的末端执行器，末端执行器附接到可以水平和垂直移动的臂，以及应变计，其监测施加到抛光构件的力。

    Eccentric abrasive wheel for wafer processing
    4.
    发明授权
    Eccentric abrasive wheel for wafer processing 失效
    用于晶圆加工的偏心磨轮

    公开(公告)号：US06672943B2

    公开(公告)日：2004-01-06

    申请号：US09845710

    申请日：2001-04-30

    申请人： Michael Vogtmann ,  Krishna Vepa ,  Michael Wisnieski

    发明人： Michael Vogtmann ,  Krishna Vepa ,  Michael Wisnieski

    IPC分类号： B24G100

    CPC分类号： B24D7/06 ,  B24B7/228 ,  H01L2223/54493

    摘要： The present invention provides exemplary methods, systems and apparatus that provide improved substrate characteristics after grinding operations by avoiding or reducing overgrind damage to the wafers. In one embodiment, a grinding apparatus (100) includes a first spindle (110) having an eccentric-shaped abrasive matrix (112) coupled thereto and a second spindle (116) adapted to hold a substrate (118) to be ground. The second spindle is offset from said first spindle such that the abrasive matrix passes through the substrate surface center (134) for only a portion of the time during grinding operations.

    摘要翻译： 本发明提供了示例性的方法，系统和装置，其通过避免或减少对晶片的过度研磨损伤来在磨削操作之后提供改进的衬底特性。 在一个实施例中，磨削装置（100）包括具有与其联接的偏心形磨料矩阵（112）的第一心轴（110）和适于保持要研磨的衬底（118）的第二心轴（116）。 第二主轴偏离所述第一主轴，使得研磨基体仅在研磨操作期间的一部分时间通过基板表面中心（134）。

    Grinding apparatus having an extendable wheel mount
    5.
    发明申请
    Grinding apparatus having an extendable wheel mount 有权
    具有可延伸轮架的研磨装置

    公开(公告)号：US20100093264A1

    公开(公告)日：2010-04-15

    申请号：US12287550

    申请日：2008-10-10

    申请人： Michael Vogtmann ,  Thomas A. Walsh

    发明人： Michael Vogtmann ,  Thomas A. Walsh

    IPC分类号： B24B27/00 ,  B24B41/047 ,  B24B47/00

    CPC分类号： B24B27/0076 ,  B24B41/047 ,  B24B47/14

    摘要： A grinding machine wherein coarse and fine grind wheels are mounted to a single rotating spindle. A multiple grind wheel mount is attached to the lower portion of the rotating spindle, the coarse and fine wheels being supported by the wheel mount, the wheel mount containing the mechanism for moving the inner coarse wheel down relative to the stationary outer fine wheel.

    摘要翻译： 一种磨床，其中粗磨细轮被安装到单个旋转主轴上。 多个研磨轮安装件附接到旋转主轴的下部，粗轮和细轮由车轮支架支撑，车轮安装架包含用于相对于固定外细轮向下移动内粗轮的机构。

    Method and apparatus for cleaning a probe card
    6.
    发明申请
    Method and apparatus for cleaning a probe card 有权
    用于清洁探针卡的方法和设备

    公开(公告)号：US20070028946A1

    公开(公告)日：2007-02-08

    申请号：US11195926

    申请日：2005-08-02

    申请人： Michael Vogtmann ,  Rolf Hagenlocher ,  Uday Nayak

    发明人： Michael Vogtmann ,  Rolf Hagenlocher ,  Uday Nayak

    IPC分类号： B08B7/00 ,  B08B7/04

    CPC分类号： G01R31/2887 ,  B08B1/00 ,  G01R1/07307 ,  G01R3/00

    摘要： A cleaning device for use in a semiconductor processing. The device comprises a substrate supporter for supporting a substrate to be cleaned, a scrub pad mounting plate, and a chuck coupling to the substrate supporter and the scrub pad mounting plate. The chuck is configured to move the substrate supporter and the scrub pad mounting plate. The device further comprises a scrub pad mountable to and moveable from the scrub pad mounting plate. The scrub pad, when mounted to the scrub pad mounting plate, is higher than the substrate when mounted on the substrate supporter. The scrub pad mounting plate and the substrate supporter can both be coupled to the chuck so that the chuck moves both the scrub pad mounting plate and the substrate supporter in one action.

    摘要翻译： 一种用于半导体处理的清洁装置。 该装置包括用于支撑待清洁的基底的衬底支撑件，擦洗垫安装板和耦合到衬底支撑件和擦洗垫安装板的卡盘。 卡盘构造成移动基板支撑件和擦洗垫安装板。 该装置还包括可安装到擦洗垫安装板并可从擦洗垫安装板移动的擦洗垫。 当安装到擦洗垫安装板上时，擦拭垫在安装在基底支撑件上时高于基底。 擦洗垫安装板和基板支撑件都可以联接到卡盘，使得卡盘在一个动作中移动擦洗垫安装板和基板支撑件。

    Grinding apparatus having an extendable wheel mount
    8.
    发明授权
    Grinding apparatus having an extendable wheel mount 有权
    具有可延伸轮架的研磨装置

    公开(公告)号：US08133093B2

    公开(公告)日：2012-03-13

    申请号：US12287550

    申请日：2008-10-10

    申请人： Michael Vogtmann ,  Thomas A. Walsh

    发明人： Michael Vogtmann ,  Thomas A. Walsh

    IPC分类号： B24B49/00 ,  B24B7/00

    CPC分类号： B24B27/0076 ,  B24B41/047 ,  B24B47/14

    摘要： A grinding machine wherein coarse and fine grind wheels are mounted to a single rotating spindle. A multiple grind wheel mount is attached to the lower portion of the rotating spindle, the coarse and fine wheels being supported by the wheel mount, the wheel mount containing the mechanism for moving the inner coarse wheel down relative to the stationary outer fine wheel.

    摘要翻译： 一种磨床，其中粗磨细轮被安装到单个旋转主轴上。 多个研磨轮安装件附接到旋转主轴的下部，粗轮和细轮由车轮支架支撑，车轮安装架包含用于相对于固定外细轮向下移动内粗轮的机构。

    Method and apparatus for cleaning a probe card
    9.
    发明授权
    Method and apparatus for cleaning a probe card 有权
    用于清洁探针卡的方法和设备

    公开(公告)号：US07345466B2

    公开(公告)日：2008-03-18

    申请号：US11195926

    申请日：2005-08-02

    申请人： Michael Vogtmann ,  Rolf Hagenlocher ,  Uday Nayak

    发明人： Michael Vogtmann ,  Rolf Hagenlocher ,  Uday Nayak

    IPC分类号： G01R31/28

    CPC分类号： G01R31/2887 ,  B08B1/00 ,  G01R1/07307 ,  G01R3/00

    摘要： A cleaning device for use in a semiconductor processing. The device comprises a substrate supporter for supporting a substrate to be cleaned, a scrub pad mounting plate, and a chuck coupling to the substrate supporter and the scrub pad mounting plate. The chuck is configured to move the substrate supporter and the scrub pad mounting plate. The device further comprises a scrub pad mountable to and moveable from the scrub pad mounting plate. The scrub pad, when mounted to the scrub pad mounting plate, is higher than the substrate when mounted on the substrate supporter. The scrub pad mounting plate and the substrate supporter can both be coupled to the chuck so that the chuck moves both the scrub pad mounting plate and the substrate supporter in one action.

    摘要翻译： 一种用于半导体处理的清洁装置。 该装置包括用于支撑待清洁的基底的衬底支撑件，擦洗垫安装板和耦合到衬底支撑件和擦洗垫安装板的卡盘。 卡盘构造成移动基板支撑件和擦洗垫安装板。 该装置还包括可安装到擦洗垫安装板并可从擦洗垫安装板移动的擦洗垫。 当安装到擦洗垫安装板上时，擦拭垫在安装在基底支撑件上时高于基底。 擦洗垫安装板和基板支撑件都可以联接到卡盘，使得卡盘在一个动作中移动擦洗垫安装板和基板支撑件。