公开(公告)号：US20080193719A1

公开(公告)日：2008-08-14

申请号：US12103284

申请日：2008-04-15

申请人： Mark Arnold Delsman ,  Christoph Benno Luechinger

发明人： Mark Arnold Delsman ,  Christoph Benno Luechinger

IPC分类号： B32B3/26

CPC分类号： B23K20/106 ,  B23K20/004 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/4807 ,  H01L2224/48458 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/78313 ,  H01L2224/78315 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  Y10T428/24488 ,  Y10T428/24612 ,  Y10T428/24942 ,  Y10T428/2495 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/01006 ,  H01L2224/85399 ,  H01L2224/05599

摘要： An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 μm. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.

摘要翻译： 使用具有薄突起的华夫饼形状和突起之间的间隙的接合工具脚形成超声波接合。 使该工具与带状物接触深度，从而在下面的粘结表面形成约150μm或更小的带状凹陷。 然后将工具进一步下降到带状物中以接触凹陷之间的带状部分，例如额外的25至50um。 结果是在凹槽部分之下的轻度粘合区域和在突起的下方和键周围的高度粘合区域。 在另一个实施例中，沿带的部分宽度形成超声波接合。

公开(公告)号：US07934633B2

公开(公告)日：2011-05-03

申请号：US12103284

申请日：2008-04-15

申请人： Mark Arnold Delsman ,  Christoph Benno Luechinger

发明人： Mark Arnold Delsman ,  Christoph Benno Luechinger

IPC分类号： B23K20/10 ,  B29C65/08

CPC分类号： B23K20/106 ,  B23K20/004 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/4807 ,  H01L2224/48458 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/78313 ,  H01L2224/78315 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  Y10T428/24488 ,  Y10T428/24612 ,  Y10T428/24942 ,  Y10T428/2495 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/01006 ,  H01L2224/85399 ,  H01L2224/05599

摘要： An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 μm. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.

公开(公告)号：US07838101B2

公开(公告)日：2010-11-23

申请号：US12535928

申请日：2009-08-05

申请人： Mark Arnold Delsman ,  Christoph Benno Luechinger

发明人： Mark Arnold Delsman ,  Christoph Benno Luechinger

IPC分类号： B32B3/00 ,  H01L23/48

CPC分类号： B23K20/106 ,  B23K20/004 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/4807 ,  H01L2224/48458 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/78313 ,  H01L2224/78315 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  Y10T428/24488 ,  Y10T428/24612 ,  Y10T428/24942 ,  Y10T428/2495 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/01006 ,  H01L2224/85399 ,  H01L2224/05599

摘要： An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 μm. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.

摘要翻译： 使用具有薄突起的华夫饼形状和突起之间的间隙的接合工具脚形成超声波接合。 使该工具与丝带接触一段深度，以在距离下面的粘合表面大约150μm或更小的条带上产生凹陷。 然后将该工具进一步下降到带状物中以在凹部之间接触带的部分，例如额外的25至50μm。 结果是在凹槽部分之下的轻度粘合区域和在突起的下方和键周围的高度粘合区域。 在另一个实施例中，沿带的部分宽度形成超声波接合。

公开(公告)号：US07909228B2

公开(公告)日：2011-03-22

申请号：US12103226

申请日：2008-04-15

申请人： Mark Arnold Delsman ,  Christoph Benno Luechinger

发明人： Mark Arnold Delsman ,  Christoph Benno Luechinger

IPC分类号： B23K20/10

CPC分类号： B23K20/106 ,  B23K20/004 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/4807 ,  H01L2224/48458 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/78313 ,  H01L2224/78315 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  Y10T428/24488 ,  Y10T428/24612 ,  Y10T428/24942 ,  Y10T428/2495 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/01006 ,  H01L2224/85399 ,  H01L2224/05599

摘要： An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 μm. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.

摘要翻译： 使用具有薄突起的华夫饼形状和突起之间的间隙的接合工具脚形成超声波接合。 使该工具与丝带接触一段深度，以在距离下面的粘合表面大约150μm或更小的条带上产生凹陷。 然后将该工具进一步下降到带状物中以在凹部之间接触带的部分，例如额外的25至50μm。 结果是在凹槽部分之下的轻度粘合区域和在突起的下方和键周围的高度粘合区域。 在另一个实施例中，沿带的部分宽度形成超声波接合。

公开(公告)号：US20090297786A1

公开(公告)日：2009-12-03

申请号：US12535928

申请日：2009-08-05

申请人： Mark Arnold Delsman ,  Christoph Benno Luechinger

发明人： Mark Arnold Delsman ,  Christoph Benno Luechinger

IPC分类号： B32B3/10

CPC分类号： B23K20/106 ,  B23K20/004 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/4807 ,  H01L2224/48458 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/78313 ,  H01L2224/78315 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  Y10T428/24488 ,  Y10T428/24612 ,  Y10T428/24942 ,  Y10T428/2495 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/01006 ,  H01L2224/85399 ,  H01L2224/05599

摘要： An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 μm. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.

摘要翻译： 使用具有薄突起的华夫饼形状和突起之间的间隙的接合工具脚形成超声波接合。 使该工具与带状物接触深度，从而在下面的粘结表面形成约150μm或更小的带状凹陷。 然后将工具进一步下降到带状物中以接触凹陷之间的带状部分，例如额外的25至50um。 结果是在凹槽部分之下的轻度粘合区域和在突起的下方和键周围的高度粘合区域。 在另一个实施例中，沿带的部分宽度形成超声波接合。

公开(公告)号：US20080190993A1

公开(公告)日：2008-08-14

申请号：US12103226

申请日：2008-04-15

申请人： Mark Arnold Delsman ,  Christoph Benno Luechinger

发明人： Mark Arnold Delsman ,  Christoph Benno Luechinger

IPC分类号： B23K20/10

CPC分类号： B23K20/106 ,  B23K20/004 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/4807 ,  H01L2224/48458 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/78313 ,  H01L2224/78315 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  Y10T428/24488 ,  Y10T428/24612 ,  Y10T428/24942 ,  Y10T428/2495 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/01006 ,  H01L2224/85399 ,  H01L2224/05599

摘要： An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 μm. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.

公开(公告)号：US08651354B2

公开(公告)日：2014-02-18

申请号：US13809020

申请日：2011-07-18

申请人： Christoph Benno Luechinger ,  Orlando Luis Valentin

发明人： Christoph Benno Luechinger ,  Orlando Luis Valentin

IPC分类号： B23K3/00 ,  B23K37/04 ,  B23K20/10

CPC分类号： B23K20/10 ,  H01L31/0504 ,  Y02E10/50

摘要： An ultrasonic ribbon bonding system is provided. The ultrasonic ribbon bonding system includes a workholder for supporting a workpiece during a ribbon bonding operation. The workholder defines a first plurality of standoffs extending above a surface of the workholder, the first plurality of standoffs configured to contact the workpiece during the ribbon bonding operation. The ultrasonic ribbon bonding system also includes a bond head assembly carrying a ribbon bonding tool, the ribbon bonding tool being configured to bond a ribbon to the workpiece during the ribbon bonding operation.

摘要翻译： 提供超声波带接合系统。 超声波带接合系统包括在色带接合操作期间用于支撑工件的工件。 所述夹持器限定在所述夹持器的表面之上延伸的第一多个支座，所述第一多个支座被配置成在所述带状接合操作期间接触所述工件。 超声波带接合系统还包括承载带状接合工具的接合头组件，所述带状接合工具被配置为在带状接合操作期间将带粘合到工件。

公开(公告)号：US20120205028A1

公开(公告)日：2012-08-16

申请号：US13450637

申请日：2012-04-19

申请人： Christoph Benno Luechinger ,  Orlando Luis Valentin

发明人： Christoph Benno Luechinger ,  Orlando Luis Valentin

IPC分类号： B32B37/20

CPC分类号： B23K20/10 ,  B23K2101/36 ,  H01L31/0504 ,  H01L31/188 ,  Y02E10/50

摘要： An ultrasonic solar substrate bonding system is provided. The system includes a first ribbon bonder including a first bonding tool, and a first ribbon feeding system configured to continuously supply a first ribbon material to the first bonding tool during bonding of the first ribbon material to a backside of each of a plurality of solar substrates. The system also includes a mechanism configured to manipulate each of the plurality of solar substrates after bonding by the first ribbon bonder to expose an opposite, frontside of each of the plurality of solar substrates for bonding. The system also includes a second ribbon bonder including a second bonding tool, and a second ribbon feeding system configured to continuously supply a second ribbon material to the second bonding tool during bonding of the second ribbon material to the frontside of each of the plurality of solar substrates.

摘要翻译： 提供超声波太阳能基板接合系统。 该系统包括：第一带状物接合器，包括第一接合工具;以及第一带状馈送系统，其配置成在将第一带状材料接合到多个太阳能基板中的每一个的背面时，将第一带状材料连续地供应到第一接合工具 。 该系统还包括一种机构，其构造成在通过第一带状键合器接合之后操纵多个太阳能基板中的每一个以暴露多个太阳能基板中的每一个的相对的前侧，用于接合。 该系统还包括包括第二接合工具的第二带状接合器和配置成在将第二带状材料接合到多个太阳能电池中的每一个的前侧时将第二带状材料连续地供应到第二接合工具的第二带状馈送系统 底物。

公开(公告)号：US08196798B2

公开(公告)日：2012-06-12

申请号：US13269796

申请日：2011-10-10

申请人： Christoph Benno Luechinger ,  Orlando Luis Valentin

发明人： Christoph Benno Luechinger ,  Orlando Luis Valentin

IPC分类号： B23K1/06 ,  B23K37/04

CPC分类号： B23K20/10 ,  B23K2101/36 ,  H01L31/0504 ,  H01L31/188 ,  Y02E10/50

摘要： An ultrasonic solar substrate bonding system is provided. The system includes a first ribbon bonder including a first bonding tool, and a first ribbon feeding system configured to continuously supply a first ribbon material to the first bonding tool during bonding of the first ribbon material to a backside of each of a plurality of solar substrates. The system also includes a mechanism configured to manipulate each of the plurality of solar substrates after bonding by the first ribbon bonder to expose an opposite, frontside of each of the plurality of solar substrates for bonding. The system also includes a second ribbon bonder including a second bonding tool, and a second ribbon feeding system configured to continuously supply a second ribbon material to the second bonding tool during bonding of the second ribbon material to the frontside of each of the plurality of solar substrates.

摘要翻译： 提供超声波太阳能基板接合系统。 该系统包括：第一带状物接合器，包括第一接合工具;以及第一带状馈送系统，其配置成在将第一带状材料接合到多个太阳能基板中的每一个的背面时，将第一带状材料连续地供应到第一接合工具 。 该系统还包括一种机构，其构造成在通过第一带状键合器接合之后操纵多个太阳能基板中的每一个以暴露多个太阳能基板中的每一个的相对的前侧，用于接合。 该系统还包括包括第二接合工具的第二带状接合器和配置成在将第二带状材料接合到多个太阳能电池中的每一个的前侧时将第二带状材料连续地供应到第二接合工具的第二带状馈送系统 底物。

公开(公告)号：US08251274B1

公开(公告)日：2012-08-28

申请号：US13450637

申请日：2012-04-19

申请人： Christoph Benno Luechinger ,  Orlando Luis Valentin

发明人： Christoph Benno Luechinger ,  Orlando Luis Valentin

IPC分类号： B23K1/06

CPC分类号： B23K20/10 ,  B23K2101/36 ,  H01L31/0504 ,  H01L31/188 ,  Y02E10/50

摘要： An ultrasonic solar substrate bonding system is provided. The system includes a first ribbon bonder including a first bonding tool, and a first ribbon feeding system configured to continuously supply a first ribbon material to the first bonding tool during bonding of the first ribbon material to a backside of each of a plurality of solar substrates. The system also includes a mechanism configured to manipulate each of the plurality of solar substrates after bonding by the first ribbon bonder to expose an opposite, frontside of each of the plurality of solar substrates for bonding. The system also includes a second ribbon bonder including a second bonding tool, and a second ribbon feeding system configured to continuously supply a second ribbon material to the second bonding tool during bonding of the second ribbon material to the frontside of each of the plurality of solar substrates.