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公开(公告)号：US20080193719A1
公开(公告)日：2008-08-14
申请号：US12103284
申请日：2008-04-15
IPC分类号： B32B3/26
CPC分类号： B23K20/106 , B23K20/004 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/4807 , H01L2224/48458 , H01L2224/48472 , H01L2224/48599 , H01L2224/48699 , H01L2224/78313 , H01L2224/78315 , H01L2224/85205 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/13091 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , Y10T428/24488 , Y10T428/24612 , Y10T428/24942 , Y10T428/2495 , H01L2924/00 , H01L2924/00015 , H01L2924/2075 , H01L2924/01006 , H01L2224/85399 , H01L2224/05599
摘要： An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 μm. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.
摘要翻译： 使用具有薄突起的华夫饼形状和突起之间的间隙的接合工具脚形成超声波接合。 使该工具与带状物接触深度，从而在下面的粘结表面形成约150μm或更小的带状凹陷。 然后将工具进一步下降到带状物中以接触凹陷之间的带状部分，例如额外的25至50um。 结果是在凹槽部分之下的轻度粘合区域和在突起的下方和键周围的高度粘合区域。 在另一个实施例中，沿带的部分宽度形成超声波接合。
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公开(公告)号：US07934633B2
公开(公告)日：2011-05-03
申请号：US12103284
申请日：2008-04-15
CPC分类号： B23K20/106 , B23K20/004 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/4807 , H01L2224/48458 , H01L2224/48472 , H01L2224/48599 , H01L2224/48699 , H01L2224/78313 , H01L2224/78315 , H01L2224/85205 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/13091 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , Y10T428/24488 , Y10T428/24612 , Y10T428/24942 , Y10T428/2495 , H01L2924/00 , H01L2924/00015 , H01L2924/2075 , H01L2924/01006 , H01L2224/85399 , H01L2224/05599
摘要： An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 μm. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.
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公开(公告)号：US07838101B2
公开(公告)日：2010-11-23
申请号：US12535928
申请日：2009-08-05
CPC分类号： B23K20/106 , B23K20/004 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/4807 , H01L2224/48458 , H01L2224/48472 , H01L2224/48599 , H01L2224/48699 , H01L2224/78313 , H01L2224/78315 , H01L2224/85205 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/13091 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , Y10T428/24488 , Y10T428/24612 , Y10T428/24942 , Y10T428/2495 , H01L2924/00 , H01L2924/00015 , H01L2924/2075 , H01L2924/01006 , H01L2224/85399 , H01L2224/05599
摘要： An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 μm. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.
摘要翻译： 使用具有薄突起的华夫饼形状和突起之间的间隙的接合工具脚形成超声波接合。 使该工具与丝带接触一段深度，以在距离下面的粘合表面大约150μm或更小的条带上产生凹陷。 然后将该工具进一步下降到带状物中以在凹部之间接触带的部分，例如额外的25至50μm。 结果是在凹槽部分之下的轻度粘合区域和在突起的下方和键周围的高度粘合区域。 在另一个实施例中，沿带的部分宽度形成超声波接合。
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公开(公告)号：US20090297786A1
公开(公告)日：2009-12-03
申请号：US12535928
申请日：2009-08-05
IPC分类号： B32B3/10
CPC分类号： B23K20/106 , B23K20/004 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/4807 , H01L2224/48458 , H01L2224/48472 , H01L2224/48599 , H01L2224/48699 , H01L2224/78313 , H01L2224/78315 , H01L2224/85205 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/13091 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , Y10T428/24488 , Y10T428/24612 , Y10T428/24942 , Y10T428/2495 , H01L2924/00 , H01L2924/00015 , H01L2924/2075 , H01L2924/01006 , H01L2224/85399 , H01L2224/05599
摘要： An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 μm. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.
摘要翻译： 使用具有薄突起的华夫饼形状和突起之间的间隙的接合工具脚形成超声波接合。 使该工具与带状物接触深度，从而在下面的粘结表面形成约150μm或更小的带状凹陷。 然后将工具进一步下降到带状物中以接触凹陷之间的带状部分，例如额外的25至50um。 结果是在凹槽部分之下的轻度粘合区域和在突起的下方和键周围的高度粘合区域。 在另一个实施例中，沿带的部分宽度形成超声波接合。
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公开(公告)号：US20080190993A1
公开(公告)日：2008-08-14
申请号：US12103226
申请日：2008-04-15
IPC分类号： B23K20/10
CPC分类号： B23K20/106 , B23K20/004 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/4807 , H01L2224/48458 , H01L2224/48472 , H01L2224/48599 , H01L2224/48699 , H01L2224/78313 , H01L2224/78315 , H01L2224/85205 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/13091 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , Y10T428/24488 , Y10T428/24612 , Y10T428/24942 , Y10T428/2495 , H01L2924/00 , H01L2924/00015 , H01L2924/2075 , H01L2924/01006 , H01L2224/85399 , H01L2224/05599
摘要： An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 μm. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.
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公开(公告)号：US07909228B2
公开(公告)日：2011-03-22
申请号：US12103226
申请日：2008-04-15
IPC分类号： B23K20/10
CPC分类号： B23K20/106 , B23K20/004 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/4807 , H01L2224/48458 , H01L2224/48472 , H01L2224/48599 , H01L2224/48699 , H01L2224/78313 , H01L2224/78315 , H01L2224/85205 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/13091 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , Y10T428/24488 , Y10T428/24612 , Y10T428/24942 , Y10T428/2495 , H01L2924/00 , H01L2924/00015 , H01L2924/2075 , H01L2924/01006 , H01L2224/85399 , H01L2224/05599
摘要： An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 μm. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.
摘要翻译： 使用具有薄突起的华夫饼形状和突起之间的间隙的接合工具脚形成超声波接合。 使该工具与丝带接触一段深度，以在距离下面的粘合表面大约150μm或更小的条带上产生凹陷。 然后将该工具进一步下降到带状物中以在凹部之间接触带的部分，例如额外的25至50μm。 结果是在凹槽部分之下的轻度粘合区域和在突起的下方和键周围的高度粘合区域。 在另一个实施例中，沿带的部分宽度形成超声波接合。
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