公开(公告)号：US08133761B2

公开(公告)日：2012-03-13

申请号：US12486596

申请日：2009-06-17

申请人： Mark A Gerber ,  Kurt P Wachtler ,  Abram M. Castro

发明人： Mark A Gerber ,  Kurt P Wachtler ,  Abram M. Castro

IPC分类号： H01L21/44

CPC分类号： H01L23/49811 ,  H01L21/4853 ,  H01L23/3128 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/16 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19011

摘要： A semiconductor system (200) of one or more semiconductor interposers (201) with a certain dimension (210), conductive vias (212) extending from the first to the second surface, with terminals and attached non-reflow metal studs (215) at the ends of the vias. A semiconducting interposer surface may include discrete electronic components or an integrated circuit. One or more semiconductor chips (202, 203) have a dimension (220, 230) narrower than the interposer dimension, and an active surface with terminals and non-reflow metal studs (224, 234). One chip is flip-attached to the first interposer surface, and another chip to the second interposer surface, so that the interposer dimension projects over the chip dimension. An insulating substrate (204) has terminals and reflow bodies (242) to connect to the studs of the projecting interposer.

摘要翻译： 具有一定尺寸（210）的一个或多个半导体插入件（201）的半导体系统（200），从第一表面延伸到第二表面的导电通孔（212），端子和附接的非回流金属螺柱（215）在 通孔的末端。 半导体插入器表面可以包括分立的电子部件或集成电路。 一个或多个半导体芯片（202,203）具有比插入件尺寸窄的尺寸（220,230）以及具有端子和非回流金属柱（224,234）的活性表面。 一个芯片被翻转连接到第一插入器表面，另一个芯片被翻转连接到第二插入器表面，使得插入器尺寸突出在芯片尺寸上。 绝缘基板（204）具有端子和回流体（242），以连接到突出插入件的螺柱。

公开(公告)号：US08430969B2

公开(公告)日：2013-04-30

申请号：US12823485

申请日：2010-06-25

申请人： Mark A Gerber ,  Kurt P Wachtler

发明人： Mark A Gerber ,  Kurt P Wachtler

IPC分类号： B08B7/00

CPC分类号： H01L25/50 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A process flow exposing and cleaning contact surfaces employing a liquid cleaning agent such as flux to penetrate the interface between the glassy coats and the surface of metal and to delaminate the coats from the metal, and then, at elevated temperatures, to use the agent's vapor pressure to break up the glassy coats into smaller pieces. The glassy coats are prevented by their low density to penetrate into the molten solder. Finally, at ambient temperature, the floating filler debris is water-washed and rinsed away. Cleaning agents include low-viscosity liquids (oils) and flux, which do not decompose at elevated temperatures and are mixed with components operable to provide, at the elevated temperatures, the fumes for sufficient vapor pressure to break up and dislodge the coats from the metal contacts.

摘要翻译： 使用液体清洁剂（例如助熔剂）暴露和清洁接触表面的工艺流程以渗透玻璃涂层和金属表面之间的界面并使涂层从金属分层，然后在升高的温度下使用试剂的蒸气 将玻璃大衣分解成更小的部分的压力。 通过其低密度防止玻璃状涂层渗透到熔融焊料中。 最后，在环境温度下，漂浮的填料碎片进行水洗和冲洗。 清洁剂包括低粘度液体（油）和助熔剂，其在升高的温度下不分解并与可操作以在升高的温度下提供足够的蒸气压使烟雾分散并从金属中除去的组分混合 联系人

公开(公告)号：US08030137B2

公开(公告)日：2011-10-04

申请号：US13048112

申请日：2011-03-15

申请人： Kurt P Wachtler

发明人： Kurt P Wachtler

IPC分类号： H01L21/00

CPC分类号： H01L25/0657 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5387 ,  H01L25/162 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  H05K1/028 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/041 ,  H05K2201/10378 ,  H01L2224/05599

摘要： A semiconductor device with a first (101) and a second (111) semiconductor chip assembled on an insulating flexible interposer (120). The interposer, preferably about 25 to 50 μm thick, has conductive traces (121), a central planar rectangular area and on each side of the rectangle a wing bent at an angle from the central plane. The central area has metal studs (122, 123) on the top and the bottom surface, which match the terminals of the chips, further conductive vias of a pitch center-to-center about 50 μm or less. The side wings have contact pads (130) with metallic connectors (131) on the bottom surface; the connectors may be solder balls, metal studs, or anisotropic conductive films. The second chip is adhesively attached to a substrate, whereby the interposer faces away from the substrate. The interposer side wings have a convex bending (150) downwardly along the second chip and a concave bending (151) over the substrate; the side wing connectors are attached to the matching substrate sites.