Ferroelectric memory
    1.
    发明授权
    Ferroelectric memory 有权
    铁电存储器

    公开(公告)号:US07279342B2

    公开(公告)日:2007-10-09

    申请号:US11210010

    申请日:2005-08-23

    IPC分类号: H01L21/00

    CPC分类号: H01L27/11502 H01L27/11507

    摘要: A ferroelectric memory includes a base member, a first dielectric layer formed above the base member, a second dielectric layer formed above the first dielectric layer, a contact hole that penetrates the first and second dielectric layers, a plug formed in the contact hole, and a barrier layer formed above the plug, and a ferroelectric capacitor formed from a lower electrode, a ferroelectric layer and an upper electrode successively laminated in a region including above the plug. The second dielectric layer has a property that is more difficult to be polished than the plug and the first dielectric layer.

    摘要翻译: 铁电存储器包括基底构件,形成在基底构件上的第一电介质层,形成在第一电介质层上方的第二电介质层,穿透第一和第二电介质层的接触孔,形成在接触孔中的插塞,以及 形成在插塞上方的阻挡层,以及由下电极,强电介质层和上电极形成的强电介质电容器,其连续地层压在包括在插塞上方的区域中。 第二电介质层具有比插塞和第一电介质层更难以抛光的性质。

    Ferroelectric memory and its manufacturing method
    2.
    发明申请
    Ferroelectric memory and its manufacturing method 审中-公开
    铁电记忆及其制造方法

    公开(公告)号:US20060043452A1

    公开(公告)日:2006-03-02

    申请号:US11210011

    申请日:2005-08-23

    IPC分类号: H01L29/94

    CPC分类号: H01L28/55 H01L28/65

    摘要: A ferroelectric memory includes a base member, a dielectric layer formed above the base member, a contact hole that penetrates the dielectric layer, a plug formed inside the contact hole, a barrier layer formed above the plug, and including a first portion with a portion formed in the contact hole and a second portion formed integrally with the first portion and above the dielectric layer, and a ferroelectric capacitor formed from a lower electrode, a ferroelectric layer and an upper electrode successively laminated in a region including above the plug.

    摘要翻译: 铁电存储器包括基底构件,形成在基底构件上方的电介质层,穿透电介质层的接触孔,形成在接触孔内部的塞子,形成在插塞上方的阻挡层,并且包括第一部分, 形成在所述接触孔中的第二部分和与所述第一部分和所述介电层一体形成的第二部分,以及由下电极,强电介质层和上电极形成的强电介质电容器,所述铁电电容器依次层压在所述插塞之上的区域中。

    Ferroelectric memory and its manufacturing method
    3.
    发明申请
    Ferroelectric memory and its manufacturing method 有权
    铁电记忆及其制造方法

    公开(公告)号:US20060046318A1

    公开(公告)日:2006-03-02

    申请号:US11210010

    申请日:2005-08-23

    IPC分类号: H01L21/00

    CPC分类号: H01L27/11502 H01L27/11507

    摘要: A ferroelectric memory includes a base member, a first dielectric layer formed above the base member, a second dielectric layer formed above the first dielectric layer, a contact hole that penetrates the first and second dielectric layers, a plug formed in the contact hole, and a barrier layer formed above the plug, and a ferroelectric capacitor formed from a lower electrode, a ferroelectric layer and an upper electrode successively laminated in a region including above the plug. The second dielectric layer has a property that is more difficult to be polished than the plug and the first dielectric layer.

    摘要翻译: 铁电存储器包括基底构件,形成在基底构件上的第一电介质层,形成在第一电介质层上方的第二电介质层,穿透第一和第二电介质层的接触孔,形成在接触孔中的插塞,以及 形成在插塞上方的阻挡层,以及由下电极,强电介质层和上电极形成的强电介质电容器,其连续地层压在包括在插塞上方的区域中。 第二电介质层具有比插塞和第一电介质层更难以抛光的性质。

    Ferroelectric memory and its manufacturing method
    4.
    发明申请
    Ferroelectric memory and its manufacturing method 审中-公开
    铁电记忆及其制造方法

    公开(公告)号:US20080020492A1

    公开(公告)日:2008-01-24

    申请号:US11893049

    申请日:2007-08-14

    IPC分类号: H01L21/20

    CPC分类号: H01L27/11502 H01L27/11507

    摘要: A ferroelectric memory includes a base member, a first dielectric layer formed above the base member, a second dielectric layer formed above the first dielectric layer, a contact hole that penetrates the first and second dielectric layers, a plug formed in the contact hole, and a barrier layer formed above the plug, and a ferroelectric capacitor formed from a lower electrode, a ferroelectric layer and an upper electrode successively laminated in a region including above the plug. The second dielectric layer has a property that is more difficult to be polished than the plug and the first dielectric layer.

    摘要翻译: 铁电存储器包括基底构件,形成在基底构件上的第一电介质层,形成在第一电介质层上方的第二电介质层,穿透第一和第二电介质层的接触孔,形成在接触孔中的插塞,以及 形成在插塞上方的阻挡层,以及由下电极,强电介质层和上电极形成的强电介质电容器,其连续地层压在包括在插塞上方的区域中。 第二电介质层具有比插塞和第一电介质层更难以抛光的性质。

    Apparatus and method for mobile communication by using non-volatile memory device
    7.
    发明授权
    Apparatus and method for mobile communication by using non-volatile memory device 有权
    使用非易失性存储器件进行移动通信的装置和方法

    公开(公告)号:US08295875B2

    公开(公告)日:2012-10-23

    申请号:US11941230

    申请日:2007-11-16

    申请人: Kazuhiro Masuda

    发明人: Kazuhiro Masuda

    IPC分类号: H04M1/00

    CPC分类号: H04M19/04 G06F12/0246

    摘要: A mobile communication apparatus configured to communicate with an opposite communication device is provided. The mobile communication apparatus includes a transceiver configured to receive an incoming signal sent from the opposite communication device. The transceiver is configured to produce an interrupt signal upon receiving the incoming signal. The mobile communication apparatus includes a first memory device and a non-volatile second memory device. The mobile communication apparatus includes a controller connected to the transceiver, the first memory device and the second memory device. The controller is configured to perform garbage collection of the second memory device, to load data stored in one of the first memory device and the second memory device into another of the first memory device and the second memory device, to access the first memory device if the transceiver produces the interrupt signal.

    摘要翻译: 提供了一种被配置为与相对的通信设备通信的移动通信设备。 移动通信装置包括:收发器,被配置为接收从相对的通信设备发送的输入信号。 收发器被配置为在接收到输入信号时产生中断信号。 移动通信装置包括第一存储装置和非易失性第二存储装置。 移动通信设备包括连接到收发器,第一存储器设备和第二存储器设备的控制器。 控制器被配置为执行第二存储器设备的垃圾收集,将存储在第一存储器设备和第二存储器设备之一中的数据加载到第一存储器设备和第二存储器设备中的另一个中以访问第一存储器设备,如果 收发器产生中断信号。

    Method of forming coating film
    10.
    发明授权
    Method of forming coating film 失效
    涂膜成膜方法

    公开(公告)号:US07473444B2

    公开(公告)日:2009-01-06

    申请号:US10500140

    申请日:2003-01-20

    IPC分类号: B05D3/02 B05D3/06

    摘要: The present invention provides a method of forming a coating film on a substrate comprising the steps of: (i) coating the substrate with a thermosetting and photocurable coating composition to form a wet coating film, (ii) heating the wet coating film to semicure the coating film, and (iii) irradiating the semicured coating film with light to cure the coating film.

    摘要翻译: 本发明提供了一种在基材上形成涂膜的方法,包括以下步骤:(i)用热固性和可光固化的涂料组合物涂布基材以形成湿涂膜,(ii)加热湿涂膜以使 涂膜,(iii)用光照射半固化涂膜以固化涂膜。