公开(公告)号：US20210407854A1

公开(公告)日：2021-12-30

申请号：US17231074

申请日：2021-04-15

申请人： MagnaChip Semiconductor, Ltd.

发明人： Jin Won JEONG ,  Jae Sik CHOI ,  Byeung Soo SONG

IPC分类号： H01L21/78 ,  H01L21/304 ,  H01L21/67 ,  H01L21/268

摘要： A semiconductor die forming method includes preparing a wafer, forming a low-k dielectric layer on the wafer, forming a metal pad on the low-k dielectric layer, forming a passivation layer on the metal pad, patterning the passivation layer, laser grooving the low-k dielectric layer using an ultrashort pulse laser, and cutting the wafer by mechanical sawing to form one or more semiconductor dies.

公开(公告)号：US20210296271A1

公开(公告)日：2021-09-23

申请号：US16934338

申请日：2020-07-21

申请人： MagnaChip Semiconductor, Ltd.

发明人： Jin Won JEONG ,  Jae Sik CHOI ,  Byeung Soo SONG

IPC分类号： H01L23/00 ,  H01L21/78 ,  H01L21/3065 ,  H01L21/268 ,  H01L21/304 ,  H01L51/00 ,  H01L51/56 ,  H01L25/16

摘要： A semiconductor chip packaging method includes forming a bump on a wafer, forming a coating film covering the bump, laser grooving the wafer, plasma etching the wafer on which the laser grooving is performed, exposing the bump by removing the coating film covering the bump, fabricating a semiconductor die by performing mechanical sawing of the wafer, and packaging the semiconductor die.

公开(公告)号：US20200312715A1

公开(公告)日：2020-10-01

申请号：US16526020

申请日：2019-07-30

申请人： MagnaChip Semiconductor, Ltd.

发明人： Jae Sik CHOI ,  Jin Won JEONG ,  Byeung Soo SONG ,  Dong Ki SHIM ,  Jin Han BAE

IPC分类号： H01L21/78 ,  H01L21/768 ,  H01L23/00 ,  H01L21/304

摘要： A manufacturing and packaging method for a semiconductor die is provided. The method prepares a wafer which has a seal-ring region, forms a first interlayer insulating film on the wafer, forms a metal wiring in the first interlayer insulating film, forms a second interlayer insulating film on the first interlayer insulating film, forms metal pads on the second interlayer insulating film, forms a passivation layer on the metal pads, removes a portion of the passivation layer in a region adjacent to the seal-ring region to expose the second interlayer insulating film, etches a portion of the second interlayer insulating film, forms a bump on the metal pads, removes the first interlayer insulating film and the second interlayer insulating film in the region adjacent to the seal-ring region by a laser grooving process, and dices the wafer into a first semiconductor die and a second semiconductor die.

公开(公告)号：US20220278064A1

公开(公告)日：2022-09-01

申请号：US17747124

申请日：2022-05-18

申请人： MagnaChip Semiconductor, Ltd.

发明人： Jin Won JEONG ,  Jae Sik CHOI ,  Byeung Soo SONG

IPC分类号： H01L23/00 ,  H01L21/3065 ,  H01L21/268 ,  H01L21/304 ,  H01L51/00 ,  H01L51/56 ,  H01L25/16 ,  H01L21/78

摘要： A semiconductor chip packaging method includes forming a bump on a wafer, forming a coating film covering the bump, laser grooving the wafer, plasma etching the wafer on which the laser grooving is performed, exposing the bump by removing the coating film covering the bump, fabricating a semiconductor die by performing mechanical sawing of the wafer, and packaging the semiconductor die.

公开(公告)号：US20200035644A1

公开(公告)日：2020-01-30

申请号：US16392388

申请日：2019-04-23

申请人： Magnachip Semiconductor, Ltd.

发明人： Jae Sik CHOI ,  Jin Won JEONG ,  Do Young KIM ,  Hye Ji LEE ,  Byeung Soo SONG

IPC分类号： H01L23/00 ,  H01L23/498 ,  H01L23/60

摘要： A semiconductor package manufacturing method includes preparing a flexible film including input wire patterns and output wire patterns, preparing a semiconductor chip including metal bumps, attaching the semiconductor chip to one side of the flexible film, such that the metal bumps are connected to either one or both of the input wire patterns and the output wire patterns, and attaching a first absorbing and shielding tape to another side of the flexible film, wherein the first absorbing and shielding tape includes an absorption film and a protective insulating film disposed on the absorption film.