- 专利标题： SEMICONDUCTOR DIE FORMING AND PACKAGING METHOD USING ULTRASHORT PULSE LASER MICROMACHINING
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申请号： US17231074申请日： 2021-04-15
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公开(公告)号： US20210407854A1公开(公告)日： 2021-12-30
- 发明人: Jin Won JEONG , Jae Sik CHOI , Byeung Soo SONG
- 申请人： MagnaChip Semiconductor, Ltd.
- 申请人地址： KR Cheongju-si
- 专利权人： MagnaChip Semiconductor, Ltd.
- 当前专利权人： MagnaChip Semiconductor, Ltd.
- 当前专利权人地址： KR Cheongju-si
- 优先权： KR10-2020-0078137 20200626
- 主分类号： H01L21/78
- IPC分类号： H01L21/78 ; H01L21/304 ; H01L21/67 ; H01L21/268
摘要：
A semiconductor die forming method includes preparing a wafer, forming a low-k dielectric layer on the wafer, forming a metal pad on the low-k dielectric layer, forming a passivation layer on the metal pad, patterning the passivation layer, laser grooving the low-k dielectric layer using an ultrashort pulse laser, and cutting the wafer by mechanical sawing to form one or more semiconductor dies.
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