公开(公告)号：US20200286817A1

公开(公告)日：2020-09-10

申请号：US16503897

申请日：2019-07-05

申请人： MagnaChip Semiconductor, Ltd.

发明人： Jae Sik CHOI ,  Do Young KIM ,  Jin Won JEONG ,  Hye Ji LEE

IPC分类号： H01L23/498 ,  H01L27/12 ,  H01L23/528

摘要： A semiconductor package includes a first metal interconnection disposed in a semiconductor chip, a first bump group configured to be connected to the first metal interconnection, a first inner lead pattern group configured to be connected to the first bump group, a second metal interconnection disposed in the semiconductor chip, a second bump group configured to be connected to the second metal interconnection; and a second inner lead pattern group configured to be connected to the second bump group, wherein a density of the first metal interconnection is greater than a density of the second metal interconnection, such that a first pitch of the first lead pattern group is greater than a second pitch of the second lead pattern group.

公开(公告)号：US20200035644A1

公开(公告)日：2020-01-30

申请号：US16392388

申请日：2019-04-23

申请人： Magnachip Semiconductor, Ltd.

发明人： Jae Sik CHOI ,  Jin Won JEONG ,  Do Young KIM ,  Hye Ji LEE ,  Byeung Soo SONG

IPC分类号： H01L23/00 ,  H01L23/498 ,  H01L23/60

摘要： A semiconductor package manufacturing method includes preparing a flexible film including input wire patterns and output wire patterns, preparing a semiconductor chip including metal bumps, attaching the semiconductor chip to one side of the flexible film, such that the metal bumps are connected to either one or both of the input wire patterns and the output wire patterns, and attaching a first absorbing and shielding tape to another side of the flexible film, wherein the first absorbing and shielding tape includes an absorption film and a protective insulating film disposed on the absorption film.