- 专利标题： FABRICATION METHOD OF SEMICONDUCTOR DIE AND CHIP-ON-PLASTIC PACKAGING OF SEMICONDUCTOR DIE
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申请号： US17747124申请日： 2022-05-18
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公开(公告)号： US20220278064A1公开(公告)日： 2022-09-01
- 发明人: Jin Won JEONG , Jae Sik CHOI , Byeung Soo SONG
- 申请人： MagnaChip Semiconductor, Ltd.
- 申请人地址： KR Cheongju-si
- 专利权人： MagnaChip Semiconductor, Ltd.
- 当前专利权人： MagnaChip Semiconductor, Ltd.
- 当前专利权人地址： KR Cheongju-si
- 优先权： KR10-2020-0033842 20200319
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L21/3065 ; H01L21/268 ; H01L21/304 ; H01L51/00 ; H01L51/56 ; H01L25/16 ; H01L21/78
摘要：
A semiconductor chip packaging method includes forming a bump on a wafer, forming a coating film covering the bump, laser grooving the wafer, plasma etching the wafer on which the laser grooving is performed, exposing the bump by removing the coating film covering the bump, fabricating a semiconductor die by performing mechanical sawing of the wafer, and packaging the semiconductor die.
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