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公开(公告)号：US12003076B2
公开(公告)日：2024-06-04
申请号：US16947351
申请日：2020-07-29
Applicant: Lumentum Operations LLC
Inventor： Ajit Vijay Barve , Matthew Glenn Peters , Eric R. Hegblom
CPC classification number: H01S5/423 , G01S7/4815 , G01S7/484 , G01S17/10 , H01S5/04252 , H01S5/1071 , H01S5/18305 , H01S5/18311
Abstract: A method for fabricating an array of emitters may include providing a first metallization layer for a first set of emitters of a first channel, wherein the first metallization layer comprises a first interchannel portion positioned between the first set of emitters and a second set of emitters of a second channel. The method may include depositing a dielectric layer on the first interchannel portion of the first metallization layer. The method may include providing a second metallization layer for the second set of emitters, wherein the second metallization layer comprises a second interchannel portion positioned between the first set of emitters and the second set of emitters, and wherein the second interchannel portion of the second metallization layer at least partially overlaps the first interchannel portion of the first metallization layer.
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公开(公告)号：US20200169062A1
公开(公告)日：2020-05-28
申请号：US16719270
申请日：2019-12-18
Applicant: Lumentum Operations LLC
Inventor： Albert Yuen , Eric R. Hegblom
IPC: H01S5/183
Abstract: A vertical-cavity surface-emitting laser (VCSEL) may include a substrate and a set of epitaxial layers on the substrate. The set of epitaxial layers may include a first mirror and a second mirror, an active region between the first mirror and the second mirror, and an oxidation layer to provide optical and electrical confinement in the VCSEL. The oxidation layer may be near the first mirror. The set of epitaxial layers may include an oxide lens to control a characteristic of an output beam emitted by the VCSEL. The oxide lens may be separate from the oxidation layer, and may be a lens that is separate from the first mirror and from the second mirror.
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公开(公告)号：US20190222002A1
公开(公告)日：2019-07-18
申请号：US16366458
申请日：2019-03-27
Applicant: Lumentum Operations LLC
Inventor： Ajit Vijay Barve , Eric R. Hegblom
CPC classification number: H01S5/423 , H01S5/18311 , H01S5/18344 , H01S5/18394
Abstract: A vertical cavity surface emitting laser (VCSEL) array may include a plurality of VCSELs. A size of an emission area of a first VCSEL, of the plurality of VCSELs, may be different from a size of an emission area of a second VCSEL of the plurality of VCSELs. The first VCSEL may be located closer to a center of the VCSEL array than the second VCSEL. A difference between the size of the emission area of the first VCSEL and the size of the emission area of the second VCSEL may be associated with reducing a difference in operating temperature between the first VCSEL and the second VCSEL, or reducing a difference in optical power output between the first VCSEL and the second VCSEL.
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公开(公告)号：US10205303B1
公开(公告)日：2019-02-12
申请号：US15787029
申请日：2017-10-18
Applicant: Lumentum Operations LLC
Inventor： Eric R. Hegblom
Abstract: A vertical-cavity surface-emitting laser (VCSEL) wafer, may include: a substrate layer, epitaxial layers grown on the substrate layer, and a strain compensating layer to control bowing of the VCSEL wafer after thinning of the VCSEL wafer. The strain compensating layer may be arranged on an epitaxial side of the substrate layer. The strain compensating layer may control bowing of the thinned VCSEL wafer by at least partially compensating for compressive strain in the epitaxial layers of the VCSEL wafer.
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5.发明授权公开(公告)号：US12126145B2
公开(公告)日：2024-10-22
申请号：US17247737
申请日：2020-12-21
Applicant: Lumentum Operations LLC
Inventor： Eric R. Hegblom , Kevin Wang
IPC: H01S5/42 , H01S5/02253 , H01S5/183 , H01S5/0234 , H01S5/042
CPC classification number: H01S5/423 , H01S5/02253 , H01S5/18305 , H01S5/0234 , H01S5/04257 , H01S2301/18
Abstract: A bottom-emitting vertical-cavity surface-emitting laser (VCSEL) chip may include a VCSEL array including plurality of VCSELs and an integrated optical element including a plurality of lens segments. The integrated optical element may direct beams provided by the plurality of VCSELs to a particular range of angles to create a diffusion pattern using the beams provided by the plurality of VCSELs. A surface of a first lens segment may be sloped to cause a beam from a first VCSEL to be steered at a first angle and a surface of a second (adjacent) lens segment may be sloped to cause a beam from a second VCSEL to be steered at a second angle. A direction of the second angle with respect to a surface of the VCSEL array may be opposite to a direction of the first angle with respect to the surface of the VCSEL array.
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Patent Agency Ranking
公开(公告)号：US11462888B2
公开(公告)日：2022-10-04
申请号：US16587866
申请日：2019-09-30
Applicant: Lumentum Operations LLC
Inventor： Eric R. Hegblom
Abstract: An optical device may include an emitter array including a plurality of emitter groups. Each emitter group may be independently addressable from other emitter groups, of the plurality of emitter groups, for independently lasing. Emitters of the plurality of emitter groups may be interspersed within the emitter array such that a minimum emitter-to-emitter distance within the emitter array is less than a minimum emitter-to-emitter distance within any of the emitter groups.
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7.发明授权公开(公告)号：US11340290B2
公开(公告)日：2022-05-24
申请号：US16915246
申请日：2020-06-29
Applicant: Lumentum Operations LLC
Inventor： Eric R. Hegblom
Abstract: A testing device may include a stage associated with holding an emitter wafer during testing of an emitter. The stage may be arranged such that light emitted by the emitter passes through the stage. The testing device may include a heat sink arranged such that the light emitted by the emitter during the testing is emitted in a direction away from the heat sink, and such that a first surface of the heat sink is near a surface of the emitter wafer during the testing but does not contact the surface of the emitter wafer. The testing device may include a probe card, associated with performing the testing of the emitter, that is arranged over a second surface of the heat sink such that, during the testing of the emitter, a probe of the probe card contacts a probe pad for the emitter through an opening in the heat sink.
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8.发明申请公开(公告)号：US20190148918A1
公开(公告)日：2019-05-16
申请号：US16146180
申请日：2018-09-28
Applicant: Lumentum Operations LLC
Inventor： Matthew Glenn Peters , David Venables , Eric R. Hegblom , Ajit Vijay Barve
Abstract: A die may comprise a plurality of adjacent emitters and a potential dislocation line. The plurality of adjacent emitters and the potential dislocation line may be offset from each other within a range of angles based on a relative rotation of the plurality of adjacent emitters and the potential dislocation line.
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9.发明授权公开(公告)号：US11698411B2
公开(公告)日：2023-07-11
申请号：US17664448
申请日：2022-05-23
Applicant: Lumentum Operations LLC
Inventor： Eric R. Hegblom
CPC classification number: G01R31/2891 , G01R31/44 , H01S3/04 , H01S3/0405 , H01S5/0042 , H01S5/183 , H01S5/18305 , H01S5/423
Abstract: A testing device may include a stage associated with holding an emitter wafer during testing of an emitter. The stage may be arranged such that light emitted by the emitter passes through the stage. The testing device may include a heat sink arranged such that the light emitted by the emitter during the testing is emitted in a direction away from the heat sink, and such that a first surface of the heat sink is near a surface of the emitter wafer during the testing but does not contact the surface of the emitter wafer. The testing device may include a probe card, associated with performing the testing of the emitter, that is arranged over a second surface of the heat sink such that, during the testing of the emitter, a probe of the probe card contacts a probe pad for the emitter through an opening in the heat sink.
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公开(公告)号：US11581705B2
公开(公告)日：2023-02-14
申请号：US16795172
申请日：2020-02-19
Applicant: Lumentum Operations LLC
Inventor： Eric R. Hegblom , Albert Yuen
Abstract: An emitter may include a substrate, a conductive layer on at least a bottom surface of a trench, and a first metal layer to provide a first electrical contact of the emitter on an epitaxial side of the substrate. The first metal layer may be within the trench such that the first metal layer contacts the conductive layer within the trench. The emitter may further include a second metal layer to provide a second electrical contact of the emitter on the epitaxial side of the substrate, and an isolation implant to block lateral current flow between the first electrical contact and the second electrical contact.
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