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    HEAT-RADIATING SUBSTRATE
    4.
    发明申请
    HEAT-RADIATING SUBSTRATE 审中-公开

    公开(公告)号：US20200369935A1

    公开(公告)日：2020-11-26

    申请号：US16959740

    申请日：2018-12-19

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Se Woong NA ,  Jae Man PARK

    IPC: C09K5/14 ,  C09J163/00 ,  C09J11/04 ,  H01L33/64 ,  B32B7/12 ,  B32B15/01 ,  B32B15/20

    Abstract: A heat-radiating substrate according to an embodiment of the present invention comprises: a first metal layer; an insulating layer disposed on the first metal layer and including an epoxy resin and an inorganic filler; and a second metal layer disposed on the insulating layer, wherein the insulating layer comprises: a first region comprising a first surface in contact with the first metal layer; and a second region comprising a second surface in contact with the second metal layer, wherein the inorganic filler comprises a boron nitride aggregate and aluminum oxide, wherein the weight ratio of the aluminum oxide to the total weight of the inorganic filler on the first face is 0.95 to 1.05 times the weight ratio of the aluminum oxide to the total weight of the inorganic filler on the second face.

    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
    5.
    发明申请
    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR 审中-公开

    公开(公告)号：US20200236789A1

    公开(公告)日：2020-07-23

    申请号：US16651143

    申请日：2018-09-18

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Hee Young CHUNG ,  Jae Man PARK ,  Moo Seong KIM

    IPC: H05K3/06 ,  H05K1/11 ,  H05K3/26

    Abstract: A printed circuit board according to one embodiment of the present invention comprises an insulation board and a plurality of metal electrodes disposed on the insulation board, wherein: the plurality of metal electrodes include a first electrode and a second electrode; the first electrode includes a first surface parallel to an upper surface of the insulation board, a second surface facing the first surface, a first side surface disposed between the first surface and the second surface, and a second side surface facing the first side surface; a part of the first side surface and a part of the second side surface protrude toward the outside of the first electrode in the direction parallel to the upper surface of the insulation board; the first side surface protrudes farther in an area adjacent to the first surface than in an area adjacent to the second surface; and the second side surface protrudes farther in the area adjacent to the second surface than in the area adjacent to the first surface.

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