公开(公告)号：US20210036204A1

公开(公告)日：2021-02-04

申请号：US16963990

申请日：2019-01-30

Applicant: LG INNOTEK CO., LTD.

Inventor： Jin A GU

IPC: H01L35/32 ,  H01L35/08 ,  H01L35/10

Abstract: A thermoelectric device according to an embodiment of the present invention comprises: a first metal support; a first bonding layer disposed on the first metal support; a first resin layer disposed on the first bonding layer; a plurality of first electrodes arranged on the first resin layer; a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs arranged on the plurality of first electrodes; a plurality of second electrodes arranged on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; a second resin layer disposed on the plurality of second electrodes; a second bonding layer disposed on the second resin layer; and a second metal support disposed on the second bonding layer, wherein the thermoelectric device further comprises at least one dummy electrode disposed on the first resin layer, and the at least one dummy electrode is disposed on the side of at least one of the outermost row and the outermost column of the plurality of first electrodes.

公开(公告)号：US20200315004A1

公开(公告)日：2020-10-01

申请号：US16649913

申请日：2018-09-18

Applicant: LG INNOTEK CO., LTD.

Inventor： Jong Sik LEE ,  Jin A GU ,  Soo Jung YOON ,  Gyung Seok LEE ,  Hyun Gu IM

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/02 ,  H01L33/64 ,  H05K3/46 ,  C09C1/00 ,  C09C3/12 ,  C08K9/06 ,  C08K3/38

Abstract: A circuit board according to an embodiment of the present invention comprises: a first metal layer; an insulating layer disposed on the first metal layer and comprising boron nitride agglomerate particles coated with a resin; and a second metal layer disposed on the insulating layer, wherein: one of both surfaces of the first metal layer, on which the insulating layer is disposed, is in at least partial contact with one surface of the insulating layer; one of both surfaces of the second metal layer, on which the insulating layer is disposed, is in at least partial contact with the other surface of the insulating layer; a plurality of grooves are formed on a surface which is one of both surfaces of at least one of the first metal layer and the second metal layer and which has the insulating layer disposed thereon; at least some of the particles are arranged in at least some of the plurality of grooves; the width (W) of at least one of the plurality of grooves is 1 to 1.8 times D50 of the particles; and a ratio (D/W) of the depth (D) to the width (W) of at least one of the plurality of grooves is 0.2 to 0.3.

公开(公告)号：US20170130033A1

公开(公告)日：2017-05-11

申请号：US15320132

申请日：2015-06-19

Applicant: LG INNOTEK CO., LTD.

Inventor： Sung Jin YUN ,  Jae Man PARK ,  Hyun Gu IM ,  Jin A GU ,  Gun Young GIL ,  Se Woong NA ,  Sang A JU

IPC: C08K9/02 ,  H05K1/03 ,  C08K3/38

CPC classification number: C08K9/02 ,  C01B21/0648 ,  C01B21/0728 ,  C01B21/0828 ,  C04B35/62836 ,  C04B35/62897 ,  C04B2235/386 ,  C04B2235/5292 ,  C08K3/38 ,  C08K2003/385 ,  C09C1/00 ,  C09C3/063 ,  C09C3/10 ,  H05K1/0373 ,  H05K2201/0162 ,  C08L63/00

Abstract: An inorganic filler included in an epoxy resin composition includes a coating layer formed on a surface thereof, and the surface of the coating layer includes at least two elements selected from the group consisting of C, N and O.