公开(公告)号：US20220246583A1

公开(公告)日：2022-08-04

申请号：US17430537

申请日：2019-09-02

Applicant: LG ELECTRONICS INC.

Inventor： Changseo PARK ,  Seongmin MOON ,  Kiseong JEON

IPC: H01L25/075 ,  H01L33/38 ,  H01L33/62 ,  H01L33/44

Abstract: A method for manufacturing a display device according to an embodiment of the present invention has a step for assembling semiconductor light-emitting devices on a substrate; a step for applying a photosensitive organic insulator onto the semiconductor light-emitting devices and the substrate; a step for removing the photosensitive organic insulator from the regions other than a space between the substrate and bottoms of the semiconductor light-emitting devices; and a step for curing the photosensitive organic insulator filled in the space.

公开(公告)号：US20200184859A1

公开(公告)日：2020-06-11

申请号：US16789053

申请日：2020-02-12

Applicant: LG ELECTRONICS INC.

Inventor： Changseo PARK ,  Seongmin MOON ,  Bongchu SHIM ,  Kiseong JEON ,  Hyunwoo CHO

IPC: G09F9/33 ,  H01L33/44 ,  H01L33/62 ,  H01L27/15

Abstract: Discussed in a method of fabricating a display device, the method including transferring a substrate to an assembly position, and placing a plurality of semiconductor light emitting devices each having a first conductive semiconductor layer and a second conductive semiconductor layer into a fluid chamber, guiding a movement of the plurality of semiconductor light emitting devices in the fluid chamber to assemble the plurality of semiconductor light emitting devices at preset positions of the substrate, etching at least one of the first conductive semiconductor layer and the second conductive semiconductor layer while the plurality of semiconductor light emitting devices are placed at the preset positions of the substrate and connecting a first wiring electrode and a second wiring electrode respectively to each of the plurality of semiconductor light emitting devices.

公开(公告)号：US20190325790A1

公开(公告)日：2019-10-24

申请号：US16415770

申请日：2019-05-17

Applicant: LG ELECTRONICS INC.

Inventor： Changseo PARK ,  Seongmin MOON ,  Bongchu SHIM ,  Kiseong JEON ,  Hyunwoo CHO

IPC: G09F9/33 ,  H01L27/15 ,  H01L33/44 ,  H01L33/62

Abstract: The present disclosure relates to a display device using semiconductor light emitting devices and a fabrication method thereof, and the display device according to the present disclosure can include a plurality of semiconductor light emitting devices, a first wiring electrode and a second wiring electrode respectively extended from the semiconductor light emitting devices to supply an electric signal to the semiconductor light emitting devices, a plurality of pair electrodes disposed on the substrate, and provided with a first electrode and a second electrode configured to generate an electric field when an electric current is supplied, and a dielectric layer formed to cover the pair electrodes, wherein the first wiring electrode and the second wiring electrode are formed on an opposite side to the plurality of the pair electrodes with respect to the semiconductor light emitting devices.

公开(公告)号：US20190140117A1

公开(公告)日：2019-05-09

申请号：US16242561

申请日：2019-01-08

Applicant: LG ELECTRONICS INC.

Inventor： Youngsung YANG ,  Junghoon CHOI ,  Changseo PARK ,  Hyungjin KWON

IPC: H01L31/0224 ,  H01L31/18 ,  H01L31/0216 ,  H01L31/0745

Abstract: A method for manufacturing a solar cell, the method includes forming a tunneling layer on a semiconductor substrate; forming a semiconductor layer on the tunneling layer, wherein the forming of the semiconductor layer includes depositing a semiconductor material; forming a capping layer on the semiconductor layer; and forming an electrode connected to the semiconductor layer, wherein the tunneling layer is formed under a temperature higher than room temperature and a pressure lower than atmospheric pressure, wherein a pressure of the forming of the semiconductor layer is smaller than the pressure of the forming of the tunneling layer, wherein the forming of the semiconductor layer further comprises doping the semiconductor layer with dopants, and wherein the capping layer is formed between the forming of the semiconductor layer and the forming of the electrode.

公开(公告)号：US20230043559A1

公开(公告)日：2023-02-09

申请号：US17793882

申请日：2020-02-13

Applicant: LG ELECTRONICS INC.

Inventor： Kisu KIM ,  Changseo PARK ,  Philwon YOON

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/62

Abstract: A self-assembly apparatus can include a fluid chamber for accommodating a fluid and semiconductor light-emitting elements, a conveyor to convey an assembly substrate so one surface of the assembly substrate is immersed in the fluid, the assembly substrate having a plurality of assembly electrodes, a magnet array spaced apart from the fluid chamber to apply a magnetic force to the semiconductor light-emitting elements, a power supply to apply power to the plurality of assembly electrodes disposed on the assembly substrate so that the semiconductor light-emitting elements are seated in a preset region on the assembly substrate, and a repair substrate disposed to face the one surface of the assembly substrate and including a plurality of pair electrodes on which an electric field is generated as power is supplied. The plurality of pair electrodes can be disposed at the same interval as the plurality of assembly electrodes.

公开(公告)号：US20230042942A1

公开(公告)日：2023-02-09

申请号：US17518391

申请日：2021-11-03

Applicant: LG ELECTRONICS INC. ,  LG Display Co., Ltd.

Inventor： Myoungsoo KIM ,  Changseo PARK ,  Minwoo LEE ,  Jungsub KIM

IPC: H01L25/075 ,  H01L33/62

Abstract: Discussed is a display device including a substrate, a plurality of first assembling wires on the substrate, a plurality of second assembling wires on the substrate, and separated from the plurality of first assembling wires; a first insulating layer disposed on the substrate, wherein a first hole is located on each of the plurality of second assembling wires, respectively, and wherein the first hole is not located on each of the plurality of first assembling wires; and a semiconductor light emitting device in the first hole.

公开(公告)号：US20220416126A1

公开(公告)日：2022-12-29

申请号：US17780151

申请日：2019-12-18

Applicant: LG ELECTRONICS INC.

Inventor： Kisu KIM ,  Changseo PARK

IPC: H01L33/38 ,  H01L25/075 ,  H01L33/62 ,  H01L33/00

Abstract: Discussed is a display device including a base portion; a first electrode formed on the base portion; a dielectric layer stacked on one surface of the first electrode; a second electrode disposed on the dielectric layer at a predetermined interval; a barrier rib portion stacked on the dielectric layer to cover the second electrode while forming a plurality of cells; and semiconductor light emitting diodes seated in the plurality of cells, wherein the first electrode is spaced apart from the second electrode with the dielectric layer disposed therebetween.

公开(公告)号：US20190393366A1

公开(公告)日：2019-12-26

申请号：US16560384

申请日：2019-09-04

Applicant: LG ELECTRONICS INC.

Inventor： Changseo PARK ,  Yoonsil JIN ,  Youngho CHOE

IPC: H01L31/0216 ,  H01L31/068 ,  H01L31/18 ,  H01L31/0224

Abstract: A bifacial solar cell includes a silicon substrate; an emitter layer; a plurality of first electrodes locally on the emitter layer; a first aluminum oxide layer on the emitter layer; a first silicon oxide layer between the first aluminum oxide layer and the emitter layer; a first anti-reflection layer on the first aluminum oxide layer; a back surface field layer on the silicon substrate; a second aluminum oxide layer on the silicon substrate; a second silicon oxide layer between the second aluminum oxide layer and the silicon substrate; a second anti-reflection layer on the second aluminum oxide layer; and a plurality of second electrodes respectively on the back surface field layers through the second anti-reflection layer, the second aluminum oxide layer and the second silicon oxide layer.

公开(公告)号：US20140083498A1

公开(公告)日：2014-03-27

申请号：US14038159

申请日：2013-09-26

Applicant: LG Electronics Inc.

Inventor： Hyunho LEE ,  Kyoungsoo LEE ,  Changseo PARK

IPC: H01L31/0216

CPC classification number: H01L31/02167 ,  H01L31/022441 ,  H01L31/03682 ,  H01L31/068 ,  Y02E10/546 ,  Y02E10/547

Abstract: A solar cell is discussed. The solar cell includes a semiconductor substrate, a p-type conductive region formed at the semiconductor substrate and including a p-type impurity, and a passivation film formed on the p-type conductive region and including aluminum oxide. The passivation film has a thickness of 7 to 17 Å.

Abstract translation: 讨论太阳能电池。 太阳能电池包括半导体衬底，形成在半导体衬底处并包含p型杂质的p型导电区域，以及形成在p型导电区域上并包括氧化铝的钝化膜。 钝化膜的厚度为7至17埃。

公开(公告)号：US20220367757A1

公开(公告)日：2022-11-17

申请号：US17765763

申请日：2019-10-02

Applicant: LG ELECTRONICS INC.

Inventor： Seongmin MOON ,  Changseo PARK

IPC: H01L33/38 ,  H01L33/62 ,  H01L27/15 ,  H01L33/00

Abstract: The present disclosure provides a display device using semiconductor light-emitting elements mounted on an assembly substrate in fluid, and a method for manufacturing same. The assembly substrate on which semiconductor light-emitting elements are mounted (assembled) comprises first assembly electrodes and second assembly electrodes intersecting the first assembly electrodes. By a dielectrophoretic force generated by applying a voltage to the assembly electrodes, semiconductor light-emitting elements may be mounted at the intersections of the assembly electrodes. In addition, by using the assembly substrate as a repair substrate, a region of the substrate in which assembly defects have occurred can be repaired, after assembly or transfer of the semiconductor light-emitting elements.