公开(公告)号：US20230042942A1

公开(公告)日：2023-02-09

申请号：US17518391

申请日：2021-11-03

Applicant: LG ELECTRONICS INC. ,  LG Display Co., Ltd.

Inventor： Myoungsoo KIM ,  Changseo PARK ,  Minwoo LEE ,  Jungsub KIM

IPC: H01L25/075 ,  H01L33/62

Abstract: Discussed is a display device including a substrate, a plurality of first assembling wires on the substrate, a plurality of second assembling wires on the substrate, and separated from the plurality of first assembling wires; a first insulating layer disposed on the substrate, wherein a first hole is located on each of the plurality of second assembling wires, respectively, and wherein the first hole is not located on each of the plurality of first assembling wires; and a semiconductor light emitting device in the first hole.

公开(公告)号：US20230127225A1

公开(公告)日：2023-04-27

申请号：US17910275

申请日：2020-03-13

Applicant: LG ELECTRONICS INC.

Inventor： Jungsub KIM ,  Yeonhong JUNG ,  Sunghyun MOON ,  Myoungsoo KIM ,  Yoonchul KIM

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/52

Abstract: The display device according to the present invention comprises: a substrate; semiconductor light-emitting diodes disposed on the substrate; a planarization layer formed so as to cover the semiconductor light-emitting diodes; and wire electrodes electrically connected to the semiconductor light-emitting diodes, wherein the substrate comprises individual pixel areas in which the semiconductor light-emitting diodes are disposed, and the individual pixel areas are each any one of first individual pixel areas, in which the semiconductor light-emitting diodes are disposed and which emit the light output by the semiconductor light-emitting diodes, and second individual pixel areas, in which a repair layer is disposed so as to emit the light output by an adjacent first individual pixel area.

公开(公告)号：US20220367774A1

公开(公告)日：2022-11-17

申请号：US17761516

申请日：2019-09-18

Applicant: LG ELECTRONICS INC.

Inventor： Myoungsoo KIM ,  Sunghyun MOON ,  Jisoo KO ,  Jungsub KIM ,  Bongchu SHIM ,  Wonjae CHANG

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/00 ,  H01L33/22 ,  H01L33/44

Abstract: Discussed is a manufacturing method of a display device. The manufacturing method includes forming a semiconductor light emitting element comprising an assembly blocking layer formed on one surface of the semiconductor light emitting element; preparing an assembly substrate comprising an assembly recess and configured such that the semiconductor light emitting element is assembled in the assembly recess; putting the semiconductor light emitting element into a chamber filled with a fluid; locating the assembly substrate on an upper surface of the chamber, and assembling the semiconductor light emitting element in the assembly recess of the assembly substrate using a magnetic field and an electric field; and transferring the semiconductor light emitting element assembled in the assembly recess of the assembly substrate to a wiring substrate.

公开(公告)号：US20240038823A1

公开(公告)日：2024-02-01

申请号：US18214238

申请日：2023-06-26

Applicant: LG ELECTRONICS INC.

Inventor： Taesu OH ,  Sungjin PARK ,  Myoungsoo KIM ,  Jungsub KIM

IPC: H01L27/15 ,  G09G3/20 ,  H01L33/50 ,  H01L33/60 ,  H01L33/00

CPC classification number: H01L27/156 ,  G09G3/20 ,  H01L33/50 ,  H01L33/60 ,  H01L33/005 ,  G09G2300/0842

Abstract: A semiconductor light emitting device package can include a first layer having a first region and a second region surrounding the first region, a common electrode wiring on the first region of the first layer, a plurality of semiconductor light emitting devices on the common electrode wiring, a plurality of electrode wirings on upper sides of the plurality of semiconductor light emitting devices, a plurality of electrode pads on the second region of the first layer, and a second layer on the plurality of semiconductor light emitting devices, the plurality of electrode wirings, and the plurality of electrode pads. The first layer and the second layer can have an elliptical shape. The plurality of electrode pads can include a first electrode pad, a second electrode pad, a third electrode pad, and at least one or more common electrode pads.

公开(公告)号：US20240030182A1

公开(公告)日：2024-01-25

申请号：US18224319

申请日：2023-07-20

Applicant: LG ELECTRONICS INC.

Inventor： Wonjae CHANG ,  Sunghyun HWANG ,  Chunghyun LIM ,  Minwoo LEE ,  Myoungsoo KIM

IPC: H01L23/00 ,  H01L33/44 ,  H01L33/38

CPC classification number: H01L24/95 ,  H01L33/44 ,  H01L33/38 ,  H01L2224/95085 ,  H01L2224/95144 ,  H01L2924/01028

Abstract: Embodiment relates to a semiconductor light emitting device for a display pixel and a display device including the same. A semiconductor light emitting device for a display pixel according to an embodiment includes a light emitting structure including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer, the first conductivity type semiconductor layer in the semiconductor light emitting device for a display pixel, a first contact electrode electrically connected to, a metal layer disposed under the first conductivity-type semiconductor layer, a second contact electrode disposed on the second conductivity-type semiconductor layer, and a passivation disposed on the light emitting structure may contain layers. The metal layer may include a magnetic material, and a weight ratio of the magnetic material to the weight of the semiconductor light emitting device may be 0.25% to 36.75%.

公开(公告)号：US20230415483A1

公开(公告)日：2023-12-28

申请号：US18034782

申请日：2020-11-06

Applicant: LG ELECTRONICS INC.

Inventor： Wonjae CHANG ,  Jinsung KIM ,  Byungjun KANG ,  Myoungsoo KIM ,  Junghoon KIM

IPC: B41J2/145 ,  B41J2/10 ,  B41J2/045

CPC classification number: B41J2/145 ,  B41J2/10 ,  B41J2/04573

Abstract: An inkjet head device comprises a body comprising light emitting devices, a nozzle installed on a lower side of the body to spray the light emitting devices onto the substrate in units of droplets, and a first guide part disposed in the body to guide the light emitting devices to the nozzle in a line. Since the light emitting devices arranged in a line by the first guide part are dropped on the substrate in units of a predetermined amount of droplets, the number of light emitting devices included in each droplet may be the same or similar. Thus, since the same or similar number of light-emitting elements are disposed or aligned in each sub-pixel, the luminance in each sub-pixel obtained by the light-emitting elements can be uniform.

公开(公告)号：US20230378141A1

公开(公告)日：2023-11-23

申请号：US18030394

申请日：2020-10-13

Applicant: LG ELECTRONICS INC.

Inventor： Myoungsoo KIM ,  Jinsung KIM ,  Wonjae CHANG ,  Byungjun KANG ,  Junghoon KIM

IPC: H01L25/075 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L33/62

Abstract: A display device comprises a substrate comprises a substrate comprising a plurality of sub pixels, a first electrode in the plurality of sub pixels, a second electrode in the plurality of sub pixels, and adjacent to the first electrode, a first magnetic layer between the first electrode and the second electrode, and a plurality of light emitting elements between the first electrode and the second electrode. The light emitting element comprises at least one second magnetic layer in contact with the magnetic layer.

公开(公告)号：US20240055412A1

公开(公告)日：2024-02-15

申请号：US18232042

申请日：2023-08-09

Applicant: LG ELECTRONICS INC.

Inventor： Myoungsoo KIM ,  Changseo PARK ,  Gunho KIM ,  Jungsub KIM

IPC: H01L25/075 ,  H01L33/38 ,  H01L33/00

CPC classification number: H01L25/0753 ,  H01L33/38 ,  H01L33/0075 ,  H01L33/0093 ,  H01L33/44

Abstract: Discussed is a semiconductor light emitting device package for a display pixel The semiconductor light emitting device package can include a first semiconductor light emitting device of a first color having a first material and a second semiconductor light emitting device of a second color having a second material disposed on the first semiconductor light emitting device. The first semiconductor light emitting device can include a first semiconductor light emitting structure having an inner recess, and a first-first electrode and first-second electrode layer electrically connected to a first side and a second side of the first semiconductor light emitting structure, respectively. The second semiconductor light emitting device can be disposed in the inner recess of the first semiconductor light emitting device.

公开(公告)号：US20230337100A1

公开(公告)日：2023-10-19

申请号：US17934005

申请日：2022-09-21

Applicant: LG ELECTRONICS INC.

Inventor： Hongsuk KIM ,  Sunghoon JUNG ,  Myoungsoo KIM

IPC: H04W36/32 ,  H04W36/00

CPC classification number: H04W36/32 ,  H04W36/0083 ,  H04W36/0016

Abstract: The present disclosure relates to a mobility enhancement in wireless communications. According to an embodiment of the present disclosure, a user equipment (UE) may perform an optimized mobility based on validity information informing which cells/mobility commands are valid for the optimized mobility. Therefore, the UE may identify one or more cells among all neighbor cells in a cell list to which optimized mobility is possible without receiving an additional signaling for the cell list, and prevent mobility failure caused by a mobility to a wrong cell.

公开(公告)号：US20230060259A1

公开(公告)日：2023-03-02

申请号：US17736812

申请日：2022-05-04

Applicant: LG ELECTRONICS INC.

Inventor： Myoungsoo KIM ,  Changseo PARK ,  Gunho KIM ,  Minwoo LEE ,  Jungsub KIM

IPC: H01L25/075 ,  H01L33/38

Abstract: An overlapping assembly substrate structure for semiconductor light emitting devices, includes a first assembly substrate structure and a second assembly substrate structure disposed spaced apart from each other. The first assembly substrate structure can include a first electrode and a second electrode spaced apart by a first distance and a first partition wall having a circular first assembly hole to accommodate a semiconductor light emitting device having a circular shape. Further, the second assembly substrate structure can include a third electrode and a fourth electrode spaced apart by a second distance greater than the first distance and a second partition wall having an elliptical second assembly hole to accommodate a semiconductor light emitting device having an elliptical shape.