Method for preparing organic electronic device

    公开(公告)号:US11545645B2

    公开(公告)日:2023-01-03

    申请号:US16643419

    申请日:2018-08-31

    申请人: LG CHEM, LTD.

    IPC分类号: H01L51/52 H01L51/56

    摘要: Provided is a method for preparing an organic electronic device, comprising steps of: applying an ink composition on a substrate, on which an organic electronic element is formed; applying heat thereto before curing the applied ink composition; and curing the applied ink composition by irradiating with light having a wavelength in a range of 300 nm to 450 nm. Also provided is an organic electronic device, comprising a substrate, an organic electronic element formed on the substrate, and an organic layer sealing the entire surface of the organic electronic element, wherein after the organic layer is maintained at 110° C. for 30 minutes, the out-gas amount measured using Purge & Trap-gas chromatography/mass spectrometry is less than 150 ppm.

    INK COMPOSITION
    5.
    发明申请

    公开(公告)号:US20210198502A1

    公开(公告)日:2021-07-01

    申请号:US16757174

    申请日:2018-10-19

    申请人: LG CHEM, LTD.

    摘要: The present application relates to an ink composition comprising a glycidyl ether compound and a method for forming an organic layer using the same, and provides an ink composition capable of forming an organic layer and adjusting haze in a curing process for an intended use, and a method of forming an organic layer using the same.

    Organic electronic device
    6.
    发明授权

    公开(公告)号:US11024827B2

    公开(公告)日:2021-06-01

    申请号:US16616268

    申请日:2018-05-24

    申请人: LG CHEM, LTD.

    IPC分类号: H01L51/52

    摘要: Provided is an organic electronic device and a method for manufacturing the same. The organic electronic device can effectively block moisture or oxygen from being introduced from the outside into the organic electronic device. The organic electronic device can secure the lifetime of an organic electronic element and has excellent durability while being applicable to a flexible device.

    Method for bonding substrate and substrate for display manufactured by the same

    公开(公告)号:US11306217B2

    公开(公告)日:2022-04-19

    申请号:US16327658

    申请日:2017-11-08

    申请人: LG Chem, Ltd.

    摘要: The present invention relates to a method of bonding substrates and a substrate for displays manufactured by the same. In an embodiment, the method comprises (a) printing a first photocurable adhesive ink on the lower substrate to form a pattern; (b) photocuring the pattern to form a spacer on the lower substrate; (c) printing a second photocurable adhesive ink on the lower substrate, which includes the spacer, to form an adhesive layer; (d) irradiating the adhesive layer with light; and (e) laminating the upper substrate to the lower substrate via the adhesive layer, wherein the upper and lower substrates are transparent or opaque, and wherein the upper and lower substrates comprise the same or different materials.

    Encapsulating composition
    9.
    发明授权

    公开(公告)号:US11171309B2

    公开(公告)日:2021-11-09

    申请号:US16467375

    申请日:2017-12-11

    申请人: LG CHEM, LTD.

    IPC分类号: H01L51/52 H01L51/00

    摘要: The present application relates to an encapsulating composition and an organic electronic device comprising the same, and provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside to secure the lifetime of the organic electronic device, is possible to realize a top emission type organic electronic device, is applicable to an inkjet method and can provide a thin display.