公开(公告)号：US11306217B2

公开(公告)日：2022-04-19

申请号：US16327658

申请日：2017-11-08

申请人： LG Chem, Ltd.

发明人： Seung A Back ,  Joon Hyung Kim

IPC分类号： C09D11/30 ,  B32B37/12 ,  B32B38/00 ,  C09D11/101 ,  C09J5/02

摘要： The present invention relates to a method of bonding substrates and a substrate for displays manufactured by the same. In an embodiment, the method comprises (a) printing a first photocurable adhesive ink on the lower substrate to form a pattern; (b) photocuring the pattern to form a spacer on the lower substrate; (c) printing a second photocurable adhesive ink on the lower substrate, which includes the spacer, to form an adhesive layer; (d) irradiating the adhesive layer with light; and (e) laminating the upper substrate to the lower substrate via the adhesive layer, wherein the upper and lower substrates are transparent or opaque, and wherein the upper and lower substrates comprise the same or different materials.