CPP GMR and magnetostriction improvement by laminating Co90Fe10 free layer with thin Fe50Co50 layers
    1.
    发明申请
    CPP GMR and magnetostriction improvement by laminating Co90Fe10 free layer with thin Fe50Co50 layers 有权
    通过层压具有薄Fe50Co50层的Co90Fe10自由层的CPP GMR和磁致伸缩改进

    公开(公告)号:US20050186452A1

    公开(公告)日:2005-08-25

    申请号:US10786806

    申请日:2004-02-25

    摘要: A current-perpendicular-to-plane (CPP) giant magnetoresistive (GMR) sensor of the synthetic spin valve type and its method of formation are disclosed, the sensor including a novel laminated free layer having ultra-thin (less than 3 angstroms thickness) laminas of Fe50 Co50 (or any iron rich alloy of the form CoxFe1-x with x between 0.25 and 0.75) interspersed with thicker layers of Co90Fe10 and Cu spacer layers to produce a free layer with good coercivity, a coefficient of magnetostriction that can be varied between positive and negative values and a high GMR ratio, due to enhancement of the bulk scattering coefficient by the laminas. The configuration of the lamina and layers in periodic groupings allow the coefficient of magnetostriction to be finely adjusted and the coercivity and GMR ratio to be optimized. The sensor performance can be further improved by including layers of Cu and Fe50Co50 in the synthetic antiferromagnetic pinned layer.

    摘要翻译: 公开了合成自旋阀型的电流垂直平面(CPP)巨磁阻(GMR)传感器及其形成方法,该传感器包括具有超薄(小于3埃厚度)的新型层叠自由层, Fe O 50 Co 50(或任何形式为Fe x Fe 1-x x的任何富含铁的合金)的薄片与 x在0.25和0.75之间)散布有较厚层的Co 90 N 10 N 10和Cu间隔层,以产生具有良好矫顽力的自由层,可以变化的磁致伸缩系数 在正值和负值之间,高GMR比,由于片层散体系的增强。 周期性分组中的薄层和层的配置允许精细调节磁致伸缩系数,并优化矫顽力和GMR比。 通过在合成的反铁磁性钉扎层中包含Cu和Fe 50 Co 50层,可以进一步提高传感器性能。

    CPP GMR and magnetostriction improvement by laminating Co90Fe10 free layer with thin Fe50Co50 layers
    2.
    发明授权
    CPP GMR and magnetostriction improvement by laminating Co90Fe10 free layer with thin Fe50Co50 layers 有权
    通过层压具有薄Fe50Co50层的Co90Fe10自由层的CPP GMR和磁致伸缩改进

    公开(公告)号:US07141314B2

    公开(公告)日:2006-11-28

    申请号:US10786806

    申请日:2004-02-25

    IPC分类号: G11B5/39

    摘要: A current-perpendicular-to-plane (CPP) giant magnetoresistive (GMR) sensor of the synthetic spin valve type and its method of formation are disclosed, the sensor including a novel laminated free layer having ultra-thin (less than 3 angstroms thickness) laminas of Fe50 Co50 (or any iron rich alloy of the form CoxFe1−x with x between 0.25 and 0.75) interspersed with thicker layers of Co90Fe10 and Cu spacer layers to produce a free layer with good coercivity, a coefficient of magnetostriction that can be varied between positive and negative values and a high GMR ratio, due to enhancement of the bulk scattering coefficient by the laminas. The configuration of the lamina and layers in periodic groupings allow the coefficient of magnetostriction to be finely adjusted and the coercivity and GMR ratio to be optimized. The sensor performance can be further improved by including layers of Cu and Fe50Co50 in the synthetic antiferromagnetic pinned layer.

    摘要翻译: 公开了合成自旋阀型的电流垂直平面(CPP)巨磁阻(GMR)传感器及其形成方法,该传感器包括具有超薄(小于3埃厚度)的新型层叠自由层, Fe O 50 Co 50(或任何形式为Fe x Fe 1-x x的任何富含铁的合金)的薄片与 x在0.25和0.75之间)散布有较厚层的Co 90 N 10 N 10和Cu间隔层,以产生具有良好矫顽力的自由层,可以变化的磁致伸缩系数 在正值和负值之间,高GMR比,由于片层散体系的增强。 周期性分组中的薄层和层的配置允许精细调节磁致伸缩系数,并优化矫顽力和GMR比。 通过在合成的反铁磁性钉扎层中包含Cu和Fe 50 Co 50层,可以进一步提高传感器性能。

    Supplementary shield for CPP GMR read head
    4.
    发明授权
    Supplementary shield for CPP GMR read head 有权
    CPP GMR读取头补充屏蔽

    公开(公告)号:US07075758B2

    公开(公告)日:2006-07-11

    申请号:US10657504

    申请日:2003-09-08

    IPC分类号: G11B5/39

    摘要: Increases in the AP1 and AP2 thickness cause the free layer to be off-center in a CPP magnetic read head. This problem has been overcome by inserting supplementary magnetic shields within the spin valve, located as close as possible to the stack. These supplementary shields enable the read gap width to be reduced by about 430 Å and the free layer to shift back towards the center by about 30 Å.

    摘要翻译: AP 1和AP 2厚度的增加导致自由层在CPP磁读头中偏离中心。 通过在辅助磁屏蔽件内插入尽可能靠近堆叠的位置来克服这个问题。 这些辅助屏蔽使得读取间隙宽度可以减小约430埃,而自由层向中心向后移动大约30埃。

    CPP device with an enhanced dR/R ratio
    5.
    发明授权
    CPP device with an enhanced dR/R ratio 有权
    具有增强的dR / R比的CPP装置

    公开(公告)号:US08031441B2

    公开(公告)日:2011-10-04

    申请号:US11803057

    申请日:2007-05-11

    IPC分类号: G11B5/39

    摘要: A CPP-GMR spin valve having a composite spacer layer comprised of at least one metal (M) layer and at least one semiconductor or semi-metal (S) layer is disclosed. The composite spacer may have a M/S, S/M, M/S/M, S/M/S, M/S/M/S/M, or a multilayer (M/S/M)n configuration where n is an integer ≧1. The pinned layer preferably has an AP2/coupling/AP1 configuration wherein the AP2 portion is a FCC trilayer represented by CoZFe(100-Z)/FeYCo(100-Y)/CoZFe(100-Z) where y is 0 to 60 atomic %, and z is 75 to 100 atomic %. In one embodiment, M is Cu with a thickness from 0.5 to 50 Angstroms and S is ZnO with a thickness of 1 to 50 Angstroms. The S layer may be doped with one or more elements. The dR/R ratio of the spin valve is increased to 10% or greater while maintaining acceptable EM and RA performance.

    摘要翻译: 公开了具有由至少一个金属(M)层和至少一个半导体或半金属(S)层组成的复合间隔层的CPP-GMR自旋阀。 复合间隔物可以具有M / S,S / M,M / S / M,S / M / S,M / S / M / S / M或多层(M / S / M) 是整数≧1。 钉扎层优选具有AP2 /耦合/ AP1配置,其中AP2部分是由CoZFe(100-Z)/ FeYCo(100-Y)/ CoZFe(100-Z)表示的FCC三层,其中y为0至60原子% ,z为75〜100原子%。 在一个实施方案中,M是厚度为0.5至50埃的Cu,S是厚度为1至50埃的ZnO。 S层可以掺杂有一个或多个元素。 自旋阀的dR / R比提高到10%以上,同时保持可接受的EM和RA性能。

    CPP device with improved current confining structure and process
    6.
    发明授权
    CPP device with improved current confining structure and process 有权
    CPP器件具有改进的电流限制结构和工艺

    公开(公告)号:US08325449B2

    公开(公告)日:2012-12-04

    申请号:US11895719

    申请日:2007-08-27

    IPC分类号: G11B5/33 G11B5/127

    摘要: Plasma nitridation, in place of plasma oxidation, is used for the formation of a CCP layer. Al, Mg, Hf, etc. all form insulating nitrides under these conditions. Maintaining the structure at a temperature of at least 150° C. during plasma nitridation and/or performing post annealing at a temperature of 220° C. or higher, ensures that no copper nitride can form. Additionally, unintended oxidation by molecular oxygen of the exposed magnetic layers (mainly the pinned and free layers) is also avoided.

    摘要翻译: 等离子体氮化代替等离子体氧化,用于形成CCP层。 Al,Mg,Hf等都在这些条件下形成绝缘氮化物。 在等离子体氮化和/或在220℃以上的温度下进行后退火时,将结构维持在至少150℃的温度下,确保不会形成氮化铜。 此外,也避免了暴露的磁性层(主要是固定和自由层)的分子氧的非预期氧化。

    Novel CPP device with an enhanced dR/R ratio
    7.
    发明申请
    Novel CPP device with an enhanced dR/R ratio 审中-公开
    具有增强的dR / R比的新型CPP装置

    公开(公告)号:US20120009337A1

    公开(公告)日:2012-01-12

    申请号:US13200013

    申请日:2011-09-15

    IPC分类号: G11B5/31 C23C14/34

    摘要: A CPP-GMR spin valve having a composite spacer layer comprised of at least one metal (M) layer and at least one semiconductor or semi-metal (S) layer is disclosed. The composite spacer may have a M/S, S/M, M/S/M, S/M/S, M/S/M/S/M, or a multilayer (M/S/M)n configuration where n is an integer≧1. The pinned layer preferably has an AP2/coupling/AP1 configuration wherein the AP2 portion is a FCC trilayer represented by CoZFe(100-Z)/FeYCo(100-Y)/CoZFe(100-Z) where y is 0 to 60 atomic %, and z is 75 to 100 atomic %. In one embodiment, M is Cu with a thickness from 0.5 to 50 Angstroms and S is ZnO with a thickness of 1 to 50 Angstroms. The S layer may be doped with one or more elements. The dR/R ratio of the spin valve is increased to 10% or greater while maintaining acceptable EM and RA performance.

    摘要翻译: 公开了具有由至少一个金属(M)层和至少一个半导体或半金属(S)层组成的复合间隔层的CPP-GMR自旋阀。 复合间隔物可以具有M / S,S / M,M / S / M,S / M / S,M / S / M / S / M或多层(M / S / M) 是整数≧1。 钉扎层优选具有AP2 /耦合/ AP1配置,其中AP2部分是由CoZFe(100-Z)/ FeYCo(100-Y)/ CoZFe(100-Z)表示的FCC三层,其中y为0至60原子% ,z为75〜100原子%。 在一个实施方案中,M是厚度为0.5至50埃的Cu,S是厚度为1至50埃的ZnO。 S层可以掺杂有一个或多个元素。 自旋阀的dR / R比提高到10%以上,同时保持可接受的EM和RA性能。

    CPP device with improved current confining structure and process
    9.
    发明申请
    CPP device with improved current confining structure and process 有权
    CPP器件具有改进的电流限制结构和工艺

    公开(公告)号:US20090059441A1

    公开(公告)日:2009-03-05

    申请号:US11895719

    申请日:2007-08-27

    IPC分类号: G11B5/33 B05D5/12

    摘要: Plasma nitridation, in place of plasma oxidation, is used for the formation of a CCP layer. Al, Mg, Hf, etc. all form insulating nitrides under these conditions. Maintaining the structure at a temperature of at least 150° C. during plasma nitridation and/or performing post annealing at a temperature of 220° C. or higher, ensures that no copper nitride can form. Additionally, unintended oxidation by molecular oxygen of the exposed magnetic layers (mainly the pinned and free layers) is also avoided

    摘要翻译: 等离子体氮化代替等离子体氧化,用于形成CCP层。 Al,Mg,Hf等都在这些条件下形成绝缘氮化物。 在等离子体氮化和/或在220℃以上的温度下进行后退火时,将结构维持在至少150℃的温度下,确保不会形成氮化铜。 此外,也避免了暴露的磁性层(主要是固定和自由层)的分子氧的非预期氧化

    CPP device with a plurality of metal oxide templates in a confining current path (CCP) spacer
    10.
    发明授权
    CPP device with a plurality of metal oxide templates in a confining current path (CCP) spacer 有权
    CPP装置,其在限制电流路径(CCP)间隔件中具有多个金属氧化物模板

    公开(公告)号:US07978442B2

    公开(公告)日:2011-07-12

    申请号:US11906716

    申请日:2007-10-03

    IPC分类号: G11B5/39

    摘要: A novel CCP scheme is disclosed for a CPP-GMR sensor in which an amorphous metal/alloy layer such as Hf is inserted between a lower Cu spacer and an oxidizable layer such as Al, Mg, or AlCu prior to performing a pre-ion treatment (PIT) and ion assisted oxidation (IAO) to transform the amorphous layer into a first metal oxide template and the oxidizable layer into a second metal oxide template both having Cu metal paths therein. The amorphous layer promotes smoothness and smaller grain size in the oxidizable layer to minimize variations in the metal paths and thereby improves dR/R, R, and dR uniformity by 50% or more. An amorphous Hf layer may be used without an oxidizable layer, or a thin Cu layer may be inserted in the CCP scheme to form a Hf/PIT/IAO or Hf/Cu/Al/PIT/IAO configuration. A double PIT/IAO process may be used as in Hf/PIT/IAO/Al/PIT/IAO or Hf/PIT/IAO/Hf/PIT/IAO schemes.

    摘要翻译: 公开了一种用于CPP-GMR传感器的新型CCP方案,其中在执行预离子处理之前,在诸如Al,Mg或AlCu的下部Cu间隔物和可氧化层之间插入诸如Hf的非晶态金属/合金层 (PIT)和离子辅助氧化(IAO),以将非晶层转变为第一金属氧化物模板,并将可氧化层转变成其中具有Cu金属路径的第二金属氧化物模板。 无定形层促进可氧化层中的平滑度和较小的晶粒尺寸以最小化金属路径的变化,从而将dR / R,R和DR均匀度提高50%以上。 可以使用无氧Hf层,或者可以在CCP方案中插入薄Cu层以形成Hf / PIT / IAO或Hf / Cu / Al / PIT / IAO配置。 可以使用双重PIT / IAO工艺,如Hf / PIT / IAO / Al / PIT / IAO或Hf / PIT / IAO / Hf / PIT / IAO方案。