公开(公告)号：US20150148452A1

公开(公告)日：2015-05-28

申请号：US14404942

申请日：2013-02-15

Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

Inventor： Hyun-Aee Chun ,  Su-Jin Park ,  Sook-Yeon Park ,  Yun-Ju Kim ,  Sang-Yong Tak ,  Sung-Hwan Park ,  Kyung-Nam Kang

IPC: C08K5/549 ,  C08K3/22 ,  C07D301/00 ,  C07F7/18 ,  C07C41/06 ,  C07C37/48 ,  C08K3/28 ,  C08K3/36

CPC classification number: C08K5/549 ,  C07C37/48 ,  C07C41/06 ,  C07D301/00 ,  C07D303/12 ,  C07D303/30 ,  C07D407/12 ,  C07F7/1804 ,  C07F7/1876 ,  C08K3/22 ,  C08K3/28 ,  C08K3/36 ,  C08K2003/2241 ,  C08K2003/2244

Abstract: There is provided a composition including an alkoxysilylated epoxy compound, a composition of which exhibits good heat resistance properties, low CTE and high glass transition temperature or Tg-less and not requiring a separate coupling agent, and inorganic particles, a cured product formed of the composition, and a use of the cured product. An epoxy composition including an alkoxysilylated epoxy compound and inorganic particles, an epoxy composition including an epoxy compound, inorganic particles and a curing agent, a cured product of the composition, and a use of the composition are provided. Since chemical bonds may be formed between the alkoxysilyl group and the inorganic particles and between the alkoxysilyl groups, a composition of the composition including the alkoxysilylated epoxy compound and the inorganic particles exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less.

Abstract translation: 提供了包含烷氧基甲硅烷基化环氧化合物的组合物，其具有良好的耐热性，低CTE和高玻璃化转变温度或Tg-Tg并且不需要单独的偶联剂的组合物，以及无机颗粒，由 组合物和使用固化产物。 提供了包含烷氧基甲硅烷基化环氧化合物和无机颗粒的环氧组合物，包含环氧化合物，无机颗粒和固化剂的环氧组合物，组合物的固化产物和组合物的用途。 由于可以在烷氧基甲硅烷基和无机颗粒之间以及烷氧基甲硅烷基之间形成化学键，所以包含烷氧基硅烷基化环氧化合物和无机颗粒的组合物的组合物表现出改进的耐热性，降低的CTE和增加的玻璃化转变温度或Tg 减。

公开(公告)号：US20150105493A1

公开(公告)日：2015-04-16

申请号：US14384669

申请日：2013-03-14

Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

Inventor： Hyun-Aee Chun ,  Yun-Ju Kim ,  Su-Jin Park ,  Sook-Yeon Park ,  Sung-Hwan Park ,  Sang-Yong Tak

IPC: C08G59/32 ,  C08L63/00 ,  C08K7/14 ,  C08G59/30 ,  C08K3/36

CPC classification number: C08G59/3281 ,  C07D303/36 ,  C07F7/1804 ,  C07F7/1876 ,  C08G59/04 ,  C08G59/306 ,  C08K3/36 ,  C08K7/14 ,  C08L63/00 ,  C09D163/00

Abstract: The present invention relates to an alkoxysilylated epoxy compound, a composite of which exhibits good heat resistance properties, low CTE and high glass transition temperature and not requiring a coupling agent, a composition including the same, a cured product formed of the composition, a use of the cured product, and a method of preparing the epoxy compound having alkoxysilyl group. An epoxy compound having an epoxy group and an alkoxysilyl group, a composition including the epoxy compound, a curing agent, a filler and/or a reaction catalyst, a cured product of the composition, and a use of the composition including an electronic part are provided. In a composite and/or cured product, the epoxy composition forms chemical bonds and exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less. The cured product exhibits good flame retardant property by the introduction of the alkoxysilyl group.

Abstract translation: 本发明涉及烷氧基甲硅烷基化环氧化合物，其具有良好的耐热性，低CTE和高玻璃化转变温度并且不需要偶联剂的组合物，包含它们的组合物，由该组合物形成的固化产物，使用 的固化物，以及制备具有烷氧基甲硅烷基的环氧化合物的方法。 具有环氧基和烷氧基甲硅烷基的环氧化合物，包含环氧化合物，固化剂，填料和/或反应催化剂的组合物，组合物的固化产物和包含电子部件的组合物的用途是 提供。 在复合和/或固化产物中，环氧组合物形成化学键并表现出改善的耐热性能，降低的CTE和增加的玻璃化转变温度或Tg。 固化产物通过引入烷氧基甲硅烷基具有良好的阻燃性能。

公开(公告)号：US09902803B2

公开(公告)日：2018-02-27

申请号：US14384669

申请日：2013-03-14

Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

Inventor： Hyun-Aee Chun ,  Yun-Ju Kim ,  Su-Jin Park ,  Sook-Yeon Park ,  Sung-Hwan Park ,  Sang-Yong Tak

IPC: C08G59/32 ,  C08G59/04 ,  C08G59/30 ,  C09D163/00 ,  C08K7/14 ,  C08K3/36 ,  C07F7/18 ,  C07D303/36 ,  C08L63/00

CPC classification number: C08G59/3281 ,  C07D303/36 ,  C07F7/1804 ,  C07F7/1876 ,  C08G59/04 ,  C08G59/306 ,  C08K3/36 ,  C08K7/14 ,  C08L63/00 ,  C09D163/00

Abstract: The present invention relates to an alkoxysilylated epoxy compound, a composite of which exhibits good heat resistance properties, low CTE and high glass transition temperature and not requiring a coupling agent, a composition including the same, a cured product formed of the composition, a use of the cured product, and a method of preparing the epoxy compound having alkoxysilyl group. An epoxy compound having an epoxy group and an alkoxysilyl group, a composition including the epoxy compound, a curing agent, a filler and/or a reaction catalyst, a cured product of the composition, and a use of the composition including an electronic part are provided. In a composite and/or cured product, the epoxy composition forms chemical bonds and exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less. The cured product exhibits good flame retardant property by the introduction of the alkoxysilyl group.

公开(公告)号：US20140308527A1

公开(公告)日：2014-10-16

申请号：US14355557

申请日：2012-11-01

Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

Inventor： Hyun-Aee Chun ,  Sang-Yong Tak ,  Su-Jin Park ,  Yun-Ju Kim ,  Sung-Hwan Park ,  Sook-Yeon Park

IPC: C08G59/30 ,  B32B15/092 ,  C08K3/36 ,  C08K7/14 ,  C07F7/18 ,  C08L63/00

CPC classification number: C08G59/306 ,  B32B15/092 ,  C07D251/32 ,  C07D405/14 ,  C07F7/0812 ,  C07F7/10 ,  C07F7/1804 ,  C08K3/36 ,  C08K7/14 ,  C08L63/00 ,  Y10T428/31529

Abstract: Disclosed are an alkoxysilylated isocyanurate epoxy compound, a composite of which exhibiting low CTE and high glass transition temperature or Tg-less and/or a cured product of which exhibiting good flame retardant property, a method of preparing the same, a composition including the same, a cured product formed of the composition, and a use of the composition. An isocyanurate epoxy compound having an alkoxysilyl group and an epoxy group in a core; a method of manufacturing the epoxy compound by the epoxidation and alkoxysilylation of a starting material; an epoxy composition including the epoxy compound; and a cured product and a use thereof, are provided. A composite of the epoxy composition has improved bonding efficiency between alkoxysilyl group and filler and between alkoxysilyl groups, and has good heat resistance, low CTE, and high glass transition temperature or Tg-less. A cured product formed of the epoxy composition has good flame retardant property.

Abstract translation: 公开了烷氧基甲硅烷基化的异氰脲酸酯环氧化合物，其具有低CTE和高玻璃化转变温度或Tg-Tg的复合材料和/或其具有良好阻燃性能的固化产物，其制备方法，包含其的组合物 ，由该组合物形成的固化产物，以及该组合物的用途。 在核心中具有烷氧基甲硅烷基和环氧基的异氰脲酸酯环氧化合物; 通过原料的环氧化和烷氧基甲硅烷基化制造环氧化合物的方法; 包含环氧化合物的环氧组合物; 和固化产物及其用途。 环氧组合物的复合物提高了烷氧基甲硅烷基与填料之间以及烷氧基甲硅烷基之间的粘合效率，并具有良好的耐热性，低CTE，高玻璃化转变温度或Tg。 由环氧组合物形成的固化产物具有良好的阻燃性能。

公开(公告)号：US10428176B2

公开(公告)日：2019-10-01

申请号：US15534451

申请日：2014-12-09

Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

Inventor： Hyun-Aee Chun ,  Sung-Hwan Park ,  Yun-Ju Kim ,  Su-Jin Park ,  Sook-Yeon Park ,  Sang-Yong Tak

IPC: C08G59/40 ,  C08L63/00 ,  C07F7/18 ,  C08K7/14 ,  C08K3/36 ,  C08G59/20

Abstract: The present invention relates to: a thermosetting alkoxysilyl compound (hereinafter, referred to as “alkoxysilyl compound”) having two or more alkoxysilyl groups showing excellent heat-resistance characteristics in a composite; a composition and a cured product comprising the same; a use thereof; and a method for preparing an alkoxysilyl compound. The composition of an alkoxysilyl compound, comprising a novel alkoxysilyl compound according to the present invention shows, in a composite, improved heat-resistance characteristics, i.e., an effect of decreasing the CTE of the composition of an alkoxysilyl compound and not showing a glass transition temperature (hereinafter, referred to as “Tg-less”). Further, the cured product comprising an alkoxysilyl compound according to the present invention shows excellent flame retardant properties due to the alkoxysilyl groups.

公开(公告)号：US09732182B2

公开(公告)日：2017-08-15

申请号：US14834387

申请日：2015-08-24

Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

Inventor： Hyun-Aee Chun ,  Sung-Hwan Park ,  Yun-Ju Kim ,  Su-Jin Park ,  Sook-Yeon Park ,  Sang-Yong Tak

IPC: C08G59/06 ,  C08G59/02 ,  C07F7/18 ,  C09J163/00 ,  C07D303/12 ,  C07D303/36 ,  C07D405/06 ,  C08L63/00 ,  C09D163/00 ,  C08G59/30

CPC classification number: C08G59/02 ,  C07D303/12 ,  C07D303/36 ,  C07D405/06 ,  C07F7/1804 ,  C08G59/06 ,  C08G59/306 ,  C08L63/00 ,  C09D163/00 ,  C09J163/00 ,  Y10T428/239

Abstract: Provided are alkoxysilylated epoxy compounds, a composite of which exhibits good heat resistance properties, low CTE and increased glass transition temperature, and a cured product thereof exhibits good flame retardancy without requiring separate coupling agent, a method for preparing the same and a composition and a cured product including the same. An alkoxysilylated epoxy compound including an epoxy group and at least one alkoxysilyl group of an S1 substituent selected from Formulae S11 to S15 or an S2 substituent selected from Formulae S21 to S25; a method for preparing the same by epoxy ring-opening reaction of starting material and alkoxysilylation, an epoxy composition including the epoxy compound, and a cured product and a use of the composition, are provided. Since chemical bonds may be formed between alkoxysilyl group and filler and between alkoxysilyl groups, chemical bonding efficiency of the composite may be improved.

公开(公告)号：US09725590B2

公开(公告)日：2017-08-08

申请号：US14427990

申请日：2013-09-17

Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

Inventor： Hyun-Aee Chun ,  Yun-Ju Kim ,  Su-Jin Park ,  Sang-Yong Tak ,  Sung-Hwan Park ,  Kyung-Nam Kang ,  Sook-Yeon Park

IPC: C07F7/08 ,  C07F7/10 ,  C07F7/18 ,  C08L63/00 ,  C09J163/00 ,  C08G59/20 ,  C08G59/30 ,  C08K5/50 ,  C08K7/14 ,  C08G59/32 ,  H01L33/52 ,  H05K1/03

CPC classification number: C08L63/00 ,  C07F7/1804 ,  C08G59/306 ,  C08G59/3281 ,  C08K5/50 ,  C08K7/14

Abstract: Provided are an alkoxysilylated epoxy compound, a composite of which exhibits good heat resistance properties, particularly low CTE and increased glass transition temperature, and a cured product thereof exhibits good flame retardancy and composition of which does not require additional silane coupling agent, a method for preparing the same and a composition and a cured product including the same. An alkoxysilylated epoxy compound including at least one alkoxysilyl group and at least two epoxy groups, a method for preparing the same by epoxide ring-opening reaction of starting material and alkoxysilylation, an epoxy composition including the epoxy compound, and a cured product and a use of the composition are provided. Since chemical bonds may be formed between alkoxysilyl group and filler and between alkoxysilyl groups, chemical bonding efficiency of the composite may be improved. Thus, the composite exhibits good heat resistance properties and the cured product exhibits good flame retardancy.

公开(公告)号：US11214583B2

公开(公告)日：2022-01-04

申请号：US16619464

申请日：2017-06-05

Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

Inventor： Hyun-Aee Chun ,  Yun-Ju Kim ,  Sook-Yeon Park ,  Su-Jin Park ,  Tae-Kwang Kim

IPC: C07F7/18 ,  C08G61/10 ,  C08L63/00 ,  C09D163/04 ,  C09J163/04 ,  C08K3/36

Abstract: The present invention relates to a novel compound having an alkoxysilyl group and an active ester group, a method for preparing the same, a composition comprising the same, and a use, wherein the novel compound exhibits improved low moisture absorption and/or low dielectric properties when cured as an epoxy composition, but is not accompanied by loss of thermal expansion characteristics. Disclosed are a novel compound of formulae AF to LF having an alkoxysilyl group and an active ester group, and a method for preparing the same, a composition comprising the same, and a use of same.

公开(公告)号：US10689482B2

公开(公告)日：2020-06-23

申请号：US14390340

申请日：2013-04-02

Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

Inventor： Hyun-Aee Chun ,  Su-Jin Park ,  Sang-Yong Tak ,  Yun-Ju Kim ,  Sook-Yeon Park ,  Sung-Hwan Park

IPC: C08G59/30 ,  C08G59/32 ,  C07D303/38 ,  C08G59/22 ,  C08K7/14 ,  C08G59/38 ,  C07F7/18 ,  C07D303/26 ,  C08L63/00 ,  C07D303/28

Abstract: The present invention relates to an alkoxysilylated epoxy compound, a composite exhibiting good heat resistance properties, low CTE and high glass transition temperature and not requiring a coupling agent, a composition including the same, a cured product formed of the composition, a use of the cured product, and a method of preparing the epoxy compound having alkoxysilyl group. An epoxy compound having an epoxy group and an alkoxysilyl group, a composition including the epoxy compound, a curing agent, a filler and/or a reaction catalyst, a cured product of the composition, and a use of the composition including an electronic part are provided. In a composite and/or cured product, the epoxy composition exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg-less. The cured product exhibits good flame retardant properties by the introduction of the alkoxysilyl group.

公开(公告)号：US10597412B2

公开(公告)日：2020-03-24

申请号：US15119977

申请日：2015-02-17

Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

Inventor： Sang-Yong Tak ,  Hyun-Aee Chun ,  Yun-Ju Kim ,  Sung-Hwan Park ,  Su-Jin Park ,  Sook-Yeon Park ,  Hak-Jun Lee

IPC: C08L63/00 ,  C08G59/30 ,  C08G59/32 ,  C07D303/12 ,  C07F7/18

Abstract: The present invention relates to a novel epoxy compound, a method for preparing same, a composition and cured product comprising same, and use thereof, wherein the compound shows excellent heat-resistant properties—specifically, a low thermal expansion property and a high glass transition temperature (including Tg-less which does not show a glass transition temperature), a flame retardant property and processability—specifically, a viscosity-control property, does not require a separate silane coupling agent, and has improved brittleness in a composite. According to one aspect of the present invention, provided are: an epoxy compound having at least one non-reactive silyl group, alkenyl group or combination thereof together with at least two epoxy groups and at least one alkoxysilyl group; a method for preparing the epoxy compound through alkoxysilylation and alkylsilylation; an epoxy composition comprising same; and a cured product.