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    Optical Die to Database Inspection
    2.
    发明申请
    Optical Die to Database Inspection 有权

    公开(公告)号：US20170191948A1

    公开(公告)日：2017-07-06

    申请号：US15391753

    申请日：2016-12-27

    Applicant: KLA-Tencor Corporation

    Inventor： Lisheng Gao ,  Tao Luo ,  Keith Wells ,  Xiaochun Li

    IPC: G01N21/956 ,  G06T7/00 ,  G01N21/95

    CPC classification number: G01N21/95607 ,  G01N21/9501 ,  G01N2201/12 ,  G06T7/001 ,  G06T2207/20084 ,  G06T2207/30148

    Abstract: Methods and systems for detecting defects on a wafer are provided. One system includes one or more computer subsystems configured for generating a rendered image based on information for a design printed on the wafer. The rendered image is a simulation of an image generated by an optical inspection subsystem for the design printed on the wafer. Generating the rendered image includes one or more steps, and the computer subsystem(s) are configured for performing at least one of the one or more steps by executing a generative model. The computer subsystem(s)) are also configured for comparing the rendered image to an optical image of the wafer generated by the optical inspection subsystem. The design is printed on the wafer using a reticle. In addition, the computer subsystem(s) are configured for detecting defects on the wafer based on results of the comparing.

    Defect-location determination using correction loop for pixel alignment
    5.
    发明授权
    Defect-location determination using correction loop for pixel alignment 有权

    公开(公告)号：US11049745B2

    公开(公告)日：2021-06-29

    申请号：US16417645

    申请日：2019-05-21

    Applicant: KLA-Tencor Corporation

    Inventor： David Dowling ,  Tarunark Singh ,  Bjorn Brauer ,  Santosh Bhattacharyya ,  Bryant Mantiply ,  Hucheng Lee ,  Xiaochun Li ,  Sangbong Park

    IPC: H01L21/67 ,  G06T7/00

    Abstract: A method of semiconductor-wafer image alignment is performed at a semiconductor-wafer defect-inspection system. In the method, a semiconductor wafer is loaded into the semiconductor-wafer defect-inspection system. Pre-inspection alignment is performed for the semiconductor wafer. After performing the pre-inspection alignment, a first swath is executed to generate a first image of a first region on the semiconductor wafer. An offset of a target structure in the first image with respect to a known point is determined. Defect identification is performed for the first image, using the offset. After executing the first swath and determining the offset, a second swath is executed to generate a second image of a second region on the semiconductor wafer. While executing the second swath, run-time alignment of the semiconductor wafer is performed using the offset.

    Optical Die to Database Inspection
    6.
    发明申请
    Optical Die to Database Inspection 有权
    光学模具到数据库检查

    公开(公告)号：US20160290934A1

    公开(公告)日：2016-10-06

    申请号：US15088081

    申请日：2016-03-31

    Applicant: KLA-Tencor Corporation

    Inventor： Keith Wells ,  Xiaochun Li ,  Lisheng Gao ,  Tao Luo ,  Markus Huber

    IPC: G01N21/95 ,  H01L21/66 ,  G06T7/00 ,  H01L21/67

    CPC classification number: G01N21/9501 ,  G01N2201/061 ,  G01N2201/06113 ,  G01N2201/068 ,  G06T7/0006 ,  G06T7/0008 ,  G06T7/001 ,  G06T2207/30148 ,  H01L21/67288 ,  H01L22/12

    Abstract: Methods and systems for detecting defects on a wafer are provided. One system includes one or more computer subsystems configured for generating a rendered image based on information for a design printed on the wafer. The rendered image is a simulation of an image generated by the optical inspection subsystem for the design printed on the wafer. The computer subsystem(s) are also configured for comparing the rendered image to an optical image of the wafer generated by the optical inspection subsystem. The design is printed on the wafer using a reticle. In addition, the computer subsystem(s) are configured for detecting defects on the wafer based on results of the comparing.

    Abstract translation: 提供了用于检测晶片上的缺陷的方法和系统。 一个系统包括被配置为基于印刷在晶片上的设计的信息来生成渲染图像的一个或多个计算机子系统。 渲染图像是由光学检查子系统为印刷在晶片上的设计产生的图像的模拟。 计算机子系统还被配置为将渲染图像与由光学检查子系统产生的晶片的光学图像进行比较。 该设计使用标线印在晶片上。 此外，计算机子系统被配置为基于比较的结果来检测晶片上的缺陷。

    Optical die to database inspection
    7.
    发明授权
    Optical die to database inspection 有权

    公开(公告)号：US09915625B2

    公开(公告)日：2018-03-13

    申请号：US15391753

    申请日：2016-12-27

    Applicant: KLA-Tencor Corporation

    Inventor： Lisheng Gao ,  Tao Luo ,  Keith Wells ,  Xiaochun Li

    IPC: G01N21/95 ,  G01N21/956 ,  G06T7/00

    CPC classification number: G01N21/95607 ,  G01N21/9501 ,  G01N2201/12 ,  G06T7/001 ,  G06T2207/20084 ,  G06T2207/30148

    Abstract: Methods and systems for detecting defects on a wafer are provided. One system includes one or more computer subsystems configured for generating a rendered image based on information for a design printed on the wafer. The rendered image is a simulation of an image generated by an optical inspection subsystem for the design printed on the wafer. Generating the rendered image includes one or more steps, and the computer subsystem(s) are configured for performing at least one of the one or more steps by executing a generative model. The computer subsystem(s)) are also configured for comparing the rendered image to an optical image of the wafer generated by the optical inspection subsystem. The design is printed on the wafer using a reticle. In addition, the computer subsystem(s) are configured for detecting defects on the wafer based on results of the comparing.

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