公开(公告)号：US10360671B2

公开(公告)日：2019-07-23

申请号：US15646808

申请日：2017-07-11

Applicant: KLA-Tencor Corporation

Inventor： Ravichander Rao ,  Gary Taan ,  Andreas Russ ,  Bjorn Brauer ,  Roger Davis ,  Bryant Mantiply ,  Swati Ramanathan ,  Karen Biagini

IPC: G06T7/00 ,  G01N21/88

Abstract: Systems and methods for tool health monitoring and matching through integrated real-time data collection, event prioritization, and automated determination of matched states through image analysis are disclosed. Data from the semiconductor production tools can be received in real-time. A control limit impact (CLI) of the parametric data and the defect attributes data can be determined and causation factors can be prioritized. Image analysis techniques can compare images and can be used to judge tool matching, such as by identifying one of the states at which the two or more of the semiconductor manufacturing tools match.

公开(公告)号：US11049745B2

公开(公告)日：2021-06-29

申请号：US16417645

申请日：2019-05-21

Applicant: KLA-Tencor Corporation

Inventor： David Dowling ,  Tarunark Singh ,  Bjorn Brauer ,  Santosh Bhattacharyya ,  Bryant Mantiply ,  Hucheng Lee ,  Xiaochun Li ,  Sangbong Park

IPC: H01L21/67 ,  G06T7/00

Abstract: A method of semiconductor-wafer image alignment is performed at a semiconductor-wafer defect-inspection system. In the method, a semiconductor wafer is loaded into the semiconductor-wafer defect-inspection system. Pre-inspection alignment is performed for the semiconductor wafer. After performing the pre-inspection alignment, a first swath is executed to generate a first image of a first region on the semiconductor wafer. An offset of a target structure in the first image with respect to a known point is determined. Defect identification is performed for the first image, using the offset. After executing the first swath and determining the offset, a second swath is executed to generate a second image of a second region on the semiconductor wafer. While executing the second swath, run-time alignment of the semiconductor wafer is performed using the offset.

公开(公告)号：US20190019280A1

公开(公告)日：2019-01-17

申请号：US15646808

申请日：2017-07-11

Applicant: KLA-Tencor Corporation

Inventor： Ravichander Rao ,  Gary Taan ,  Andreas Russ ,  Bjorn Brauer ,  Roger Davis ,  Bryant Mantiply ,  Swati Ramanathan ,  Karen Biagini

IPC: G06T7/00 ,  G01N21/88

CPC classification number: G06T7/001 ,  G01N21/8851 ,  G01N2021/8887 ,  G06T2207/20056 ,  G06T2207/30148 ,  G06T2207/30164

Abstract: Systems and methods for tool health monitoring and matching through integrated real-time data collection, event prioritization, and automated determination of matched states through image analysis are disclosed. Data from the semiconductor production tools can be received in real-time. A control limit impact (CLI) of the parametric data and the defect attributes data can be determined and causation factors can be prioritized. Image analysis techniques can compare images and can be used to judge tool matching, such as by identifying one of the states at which the two or more of the semiconductor manufacturing tools match.