公开(公告)号：US20180090296A1

公开(公告)日：2018-03-29

申请号：US15418946

申请日：2017-01-30

Applicant: KLA-Tencor Corporation

Inventor： Mark Allen Neil ,  Frank Laske

IPC: H01J37/20 ,  H01J37/244 ,  H01J37/147 ,  H01J37/28

CPC classification number: H01J37/20 ,  H01J37/147 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/20285 ,  H01J2237/2448 ,  H01J2237/2817

Abstract: Methods and systems for performing measurements of multiple die with an array of electron beam columns are presented herein. The wafer is scanned in a direction parallel to the die rows disposed on the wafer. The electron beam measurement columns are spatially separated in a column alignment direction. The wafer is scanned in a direction that is oriented at an oblique angle with respect to the column alignment direction such that each electron beam column measures the same row of die features on different die during the same wafer pass. The wafer is oriented with respect to the array of electron beam columns by rotating the wafer, rotating the electron beam columns, or both. In further aspects, each measurement beam is deflected to correct alignment errors between each column and the corresponding die row to be measured and to correct wafer positioning errors reported by the wafer positioning system.

公开(公告)号：US10386233B2

公开(公告)日：2019-08-20

申请号：US16226597

申请日：2018-12-19

Applicant: KLA-TENCOR CORPORATION

Inventor： Mark Allen Neil

IPC: G01J3/02 ,  G01J3/06 ,  G01J3/12 ,  G01J3/18 ,  G01J3/28 ,  G02B6/293 ,  G03F7/20 ,  G01B11/02 ,  G01B11/14 ,  G01N21/21 ,  G01N21/47 ,  G01N21/55

Abstract: Systems, methods, apparatuses, and articles of manufacture are provided for recovering a digitized spectrum and may comprise: an optical system configured to transform rays, the optical system including a diffraction grating, a steering mirror, a stage, and an actuator configured to move one of the stage, diffraction grating, or steering mirror according to a movement regime to vary an incidence of the rays on the stage; a sensor array disposed on the stage configured to receive the rays incident from the optical system at a plurality of measurement locations to obtain a plurality of ray spectra; and a processor electrically connected to the sensor array configured to receive the ray spectra, interleave the ray spectra to yield an interleaved spectrum, and deconvolve a point spread function corresponding to the optical system from the interleaved spectrum to yield a recovered digitized spectrum.

公开(公告)号：US20190212255A1

公开(公告)日：2019-07-11

申请号：US16226597

申请日：2018-12-19

Applicant: KLA-TENCOR CORPORATION

Inventor： Mark Allen Neil

IPC: G01N21/21 ,  G02B6/293 ,  G01B11/06

CPC classification number: G01J3/12 ,  G01B11/02 ,  G01B11/0625 ,  G01B11/14 ,  G01B2210/56 ,  G01J3/0202 ,  G01J3/027 ,  G01J3/0297 ,  G01J3/06 ,  G01J3/18 ,  G01J3/28 ,  G01J2003/1282 ,  G01N21/211 ,  G01N21/47 ,  G01N21/55 ,  G01N2021/213 ,  G01N2021/214 ,  G02B6/29314 ,  G03F7/70616

Abstract: Systems, methods, apparatuses, and articles of manufacture are provided for recovering a digitized spectrum and may comprise: an optical system configured to transform rays, the optical system including a diffraction grating, a steering mirror, a stage, and an actuator configured to move one of the stage, diffraction grating, or steering mirror according to a movement regime to vary an incidence of the rays on the stage; a sensor array disposed on the stage configured to receive the rays incident from the optical system at a plurality of measurement locations to obtain a plurality of ray spectra; and a processor electrically connected to the sensor array configured to receive the ray spectra, interleave the ray spectra to yield an interleaved spectrum, and deconvolve a point spread function corresponding to the optical system from the interleaved spectrum to yield a recovered digitized spectrum.

公开(公告)号：US10141156B2

公开(公告)日：2018-11-27

申请号：US15418946

申请日：2017-01-30

Applicant: KLA-Tencor Corporation

Inventor： Mark Allen Neil ,  Frank Laske

IPC: H01J37/20 ,  H01J37/147 ,  H01J37/244 ,  H01J37/28

Abstract: Methods and systems for performing measurements of multiple die with an array of electron beam columns are presented herein. The wafer is scanned in a direction parallel to the die rows disposed on the wafer. The electron beam measurement columns are spatially separated in a column alignment direction. The wafer is scanned in a direction that is oriented at an oblique angle with respect to the column alignment direction such that each electron beam column measures the same row of die features on different die during the same wafer pass. The wafer is oriented with respect to the array of electron beam columns by rotating the wafer, rotating the electron beam columns, or both. In further aspects, each measurement beam is deflected to correct alignment errors between each column and the corresponding die row to be measured and to correct wafer positioning errors reported by the wafer positioning system.